| Specification |
Mode of Production: SMT;
Layers: 1-28 Layers;
Customized: Customized;
Condition: New;
PCBA Min. IC Pitch: 0.30mm(12mil);
PCBA Min. Chip Placement: 0201;
Item: Electronic PCB Board Assembly;
Other PCBA Service: Conformal Coating;
PCBA Foot Pin: So, Sop, Soj, Tsop, Tssop, Qfp, BGA and U-BGA;
Turnkey Service: PCB, PCB Assembly, Box Build;
Applicaton: Industrial PCB PCBA;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
Product Name: Multi-Layers Contract Manufacturing for HDI Rigid;
Shipment Way: by Air by Sea;
Payment Way: Tt;
Min.Pin Space of IC: 0.3mm;
Min. Space of BGA: +/- 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Electronic: 100kmonth;
Test : 100% Aoi Testing;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
Product Name: Customized PCBA Circuit Boards with Multilayer Fr4;
Shipment Way: by Air by Sea;
Payment Way: Tt;
Min.Pin Space of IC: 0.3mm;
Min. Space of BGA: +/- 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Electronic: 100kmonth;
Test : 100% Aoi Testing;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
Product Name: China OEM Turnkey Intelligent Electronic Washlet;
Shipment Way: by Air by Sea;
Payment Way: Tt;
Min.Pin Space of IC: 0.3mm;
Min. Space of BGA: +/- 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Electronic: 100kmonth;
Test : 100% Aoi Testing;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-6;
Customized: Customized;
Condition: New;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
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