| Specification |
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Processing Technology: OSP, Hal Lf;
Application: LED Production;
Mechanical Rigid: Rigid;
Material: Aluminum;
Brand: DJ&Zapon;
Board Thickness: 0.8mm,1.0mm,1.2mm,1.6mm,2.0mm,2.2mm;
Thermal Conductivity: 1.0W/M.K,1.5W/M.K,2.0W/M.K,3.0W/M.K,4.0W/M.K;
Ccl Brand: Jh,Ccaf.etc;
Sample Date: 3-5days;
|
Type: Rigid Circuit Board;
Flame Retardant Properties: Customized;
Dielectric: MCPCB\Fr4\Bt;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Processing Technology: Delay Pressure Foil;
Application: New Energy Vehicle Electronic Control Board;
Mechanical Rigid: Rigid;
Material: Aluminum;
Brand: Hongyu;
Board Thickness: 1.8mm;
Metal Core PCB: Aluminum 5052 Core (1.5mm);
Thermal Conductivity: 3.2W/M·K (Dielectric Layer);
Copper Foil: 105μm;
Tg: 150°C;
|
Type: Rigid Circuit Board;
Flame Retardant Properties: Customized;
Dielectric: MCPCB\Fr4\Bt;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Processing Technology: Delay Pressure Foil;
Application: New Energy Vehicle Electronic Control Board;
Mechanical Rigid: Rigid;
Material: Aluminum;
Brand: Hongyu;
Board Thickness: 1.8mm;
Metal Core PCB: Aluminum 5052 Core (1.5mm);
Thermal Conductivity: 3.2W/M·K (Dielectric Layer);
Copper Foil: 105μm;
Tg: 150°C;
|
Type: Rigid Circuit Board;
Flame Retardant Properties: Customized;
Dielectric: MCPCB\Fr4\Bt;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Processing Technology: Delay Pressure Foil;
Application: New Energy Vehicle Electronic Control Board;
Mechanical Rigid: Rigid;
Material: Aluminum;
Brand: Hongyu;
Board Thickness: 1.8mm;
Metal Core PCB: Aluminum 5052 Core (1.5mm);
Thermal Conductivity: 3.2W/M·K (Dielectric Layer);
Copper Foil: 105μm;
Tg: 150°C;
|
Type: Rigid Circuit Board;
Flame Retardant Properties: Customized;
Dielectric: MCPCB\Fr4\Bt;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Processing Technology: Delay Pressure Foil;
Application: New Energy Vehicle Electronic Control Board;
Mechanical Rigid: Rigid;
Material: Aluminum;
Brand: Hongyu;
Board Thickness: 1.8mm;
Metal Core PCB: Aluminum 5052 Core (1.5mm);
Thermal Conductivity: 3.2W/M·K (Dielectric Layer);
Copper Foil: 105μm;
Tg: 150°C;
|
