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      Header Female Connector
      US$0.012 / Piece
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      What is Header Female Connector of 1.25 Pitch Wafer Connector

      About this Item
      Details
      Company Profile

      Price

      Min. Order Reference FOB Price

      100 Pieces US$0.012 / Piece

      Sepcifications

      • Structure Multilayer FPC
      • Material Polyimide
      • Combination Mode Adhesive Flexible Plate
      • Application Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace
      • Conductive Adhesive Conductive Silver Paste
      • Flame Retardant Properties V0
      • Processing Technology Electrolytic Foil
      • Base Material Copper
      • Insulation Materials Epoxy Resin
      • Brand Xtz
      • Transport Package Bag
      • Trademark XTZ
      • Origin Made in China

      Product Description

      Supply Ability Supply Ability 10000 Piece/Pieces per Day Packaging &Delivery Packaging Details Bliser Packing , Color Box, PE bag packing etc . Port SHENZHEN/DONGGUAN Lead Time: Quantity(Pieces) 1 - 1000 >1000 Est. Time(days) 7 To be negotiated Product Description ...

      Learn More

      Header Female Connector Comparison
      Transaction Info
      Price US$0.012 / Piece US$0.20-1.00 / pieces US$0.20-1.20 / pieces US$0.50-5.00 / pieces US$0.20-1.20 / pieces
      Min Order 100 Pieces 5 pieces 5 pieces 5 pieces 5 pieces
      Payment Terms T/T T/T, D/P, PayPal, Western Union, Small-amount payment T/T, D/P, PayPal, Western Union, Small-amount payment T/T, D/P, PayPal, Western Union, Small-amount payment T/T, D/P, PayPal, Western Union, Small-amount payment
      Quality Control
      Management System Certification - - - - -
      Trade Capacity
      Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia
      Annual Export Revenue - - - - -
      Business Model - Own Brand, ODM, OEM Own Brand, ODM, OEM Own Brand, ODM, OEM Own Brand, ODM, OEM
      Average Lead Time Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Structure: Multilayer FPC;
      Material: Polyimide;
      Combination Mode: Adhesive Flexible Plate;
      Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
      Conductive Adhesive: Conductive Silver Paste;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Brand: Xtz;
      Structure: Multilayer FPC;
      Material: Polyimide;
      Combination Mode: Adhesive Flexible Plate;
      Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
      Conductive Adhesive: Conductive Silver Paste;
      Flame Retardant Properties: V0;
      Processing Technology: Delay Pressure Foil;
      Base Material: Pl, Copper and Ni/Au;
      Insulation Materials: Organic Resin;
      Brand: Smart;
      Supplier Type: Manufacturer;
      Copper Thickness: 0.5oz;
      Min. Hole Size: 0.15mm;
      Min. Line Spacing: 0.075mm;
      Min. Line Width: 0.075mm;
      Board Thickness: 0.057 to 0.6mm;
      Stiffener: Without, Top, Bot, Both Sides;
      Solder Mask(Coverlay): Yellow, White, Black;
      Surface Finishing: Enig, Immersion Silver, OSP;
      Structure: Multilayer FPC;
      Material: Polyimide;
      Combination Mode: Adhesive Flexible Plate;
      Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
      Conductive Adhesive: Conductive Silver Paste;
      Flame Retardant Properties: V0;
      Processing Technology: Delay Pressure Foil;
      Base Material: Pi;
      Insulation Materials: Organic Resin;
      Brand: Smart;
      Supplier Type: Manufacturer;
      Copper Thickness: 0.5oz-3oz;
      Min. Hole Size: 0.15mm;
      Min.Line Width: 0.075mm;
      Min.Line Spacing: 0.075mm;
      Board Thickness: 0.057-0.6mm;
      Surface Finishing: Enig, Immersion Silver, OSP;
      Stiffener: Without, Top, Bot, Both Sides;
      Solder Mask(Coverlay): Yellow, White, Black;
      Structure: Multilayer FPC;
      Material: Polyimide;
      Combination Mode: Adhesive Flexible Plate;
      Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
      Conductive Adhesive: Conductive Silver Paste;
      Flame Retardant Properties: V0;
      Processing Technology: Delay Pressure Foil;
      Base Material: Pl, Copper and Ni/Au;
      Insulation Materials: Organic Resin;
      Brand: Smart;
      Supplier Type: Manufacturer;
      Copper Thickness: 0.5oz;
      Min. Hole Size: 0.15mm;
      Min. Line Spacing: 0.075mm;
      Min. Line Width: 0.075mm;
      Stiffener: Without, Top, Bot, Both Sides;
      Solder Mask(Coverlay): Yellow, White, Black;
      Board Thickness: 0.057 to 0.6mm;
      Surface Finishing: Enig, Immersion Silver, OSP;
      Structure: Multilayer FPC;
      Material: Polyimide;
      Combination Mode: Adhesive Flexible Plate;
      Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
      Conductive Adhesive: Conductive Silver Paste;
      Flame Retardant Properties: V0;
      Processing Technology: Delay Pressure Foil;
      Base Material: Pi;
      Insulation Materials: Organic Resin;
      Brand: Smart;
      Supplier Type: Manufacturer;
      Copper Thickness: 0.5oz-3oz;
      Min. Hole Size: 0.15mm;
      Board Thickness: 0.057-0.6mm;
      Min.Line Spacing: 0.075mm;
      Min. Line Width: 0.075mm;
      Surface Finishing: Enig, Immersion Silver, OSP;
      Stiffener: Without, Top, Bot, Both Sides;
      Solder Mask(Coverlay): Yellow, White, Black;
      Supplier Name

      SHENZHEN XIANGTIANZHONG TECHNOLOGY CO., LTD.

      Gold Member Audited Supplier

      Shenzhen Smart Electronics Co., Ltd

      Diamond Member Audited Supplier

      Shenzhen Smart Electronics Co., Ltd

      Diamond Member Audited Supplier

      Shenzhen Smart Electronics Co., Ltd

      Diamond Member Audited Supplier

      Shenzhen Smart Electronics Co., Ltd

      Diamond Member Audited Supplier

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