| Specification |
Type: Rigid Circuit Board;
Dielectric: AIN;
Material: Aluminum Covered Copper Foil Layer;
Application: LED;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Exposure Process;
Base Material: Aluminum;
Insulation Materials: Metal Composite Materials;
Brand: No;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Computer;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Jingxin;
Layer: 1-32;
Board Thickness: 0.2-8.0mm;
PCB Testing: Ict Testing and Flying Probe Testing;
PCBA Testing: Function Test, Aoi Test, X-ray Test, Software;
PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop;
Qualified: Ipc-a-610cclass 2 & 3 Standard;
Thick Copper: 18um-210um(6oz);
Materials: Fr-4/Rogers/Cem1-3/Aluminum-Based Materials;
Surface Treatment: HASL, Enig, Gold Fingers, OSP etc.;
Offer Service: PCBA Prototype, PCBA Debugging, PCBA ODM (Project;
Certificates: ISO9001, IATF16949, ISO13485;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Abis;
Test: Flying Probe and Fixture;
Solder Mask: Green;
Board Thickness: 0.8mm / 1.6mm Custom;
Custom: OEM / ODM;
Copper: 0.5oz / 18um, 2oz / 70um;
Layers: 4 Layers, 6 Layers, 8 Layers, Custom;
Legend: White;
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Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Consumer Electronics;
Flame Retardant Properties: V1;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Jxpcba;
Product Type: Custom HDI PCBA;
Service: One-Stop Turnkey;
Applicational: Electronics Device/Home Appliances;
Testing Service: Aoi X-ray Function Test;
Raw Material: Fr4/Cem-1/Cem-3/Fr1/Aluminum;
Board Thickness: 0.2mm-7.0mm;
Layer: 1-32 Layers;
Solder Mask Color: Blue.Green.Red.Black.White.etc;
Surface Finishing: HASL\OSP\Immersion Gold;
Component Packing: Tary, Tube, Tape;
Number of Floors: 1-32;
Minimum Line Width/Spacing: 3.0mil;
Maximum Plate Thickness Aperture Ratio: 30:1;
Minimum Mechanical Drilling Aperture: 6mil;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Unice;
Layer: 1-20;
OEM/ODM: Support;
Surface Treatment: HASL/Lead Free/OSP/Immersion Gold etc.;
Testing: 100%;
Main Material: Fr4/High Tg Fr4/Aluminum/Rogers /Cem-3/Cem-1 etc;
Produce Capacity: 30000 Square Meters/Month;
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