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      2-Layers Board HDI Printed Circuit Made in China/HDI PCB

      About this Item
      Details
      Company Profile

      Price

      Min. Order Reference FOB Price

      1 Piece US$0.30-1.00 / Piece

      Sepcifications

      • Structure Multilayer Rigid PCB
      • Dielectric FR-4
      • Material Polyester Glass Fiber Mat Laminate
      • Application Consumer Electronics
      • Flame Retardant Properties V0
      • Processing Technology Electrolytic Foil
      • Production Process Subtractive Process
      • Base Material Fr4
      • Insulation Materials Organic Resin
      • Transport Package Vacuum Package
      • Specification Normal
      • Trademark XJYPCB
      • Origin China
      • Surface Finishing HASL
      • Copper Thickness 1oz
      • Board Thickness 1.6mm
      • Min. Hole Size 0.1mm
      • Min. Line Wigth 0.075mm
      • Min. Line Spacing 0.075mm
      • Color Blue
      • Size 103mm*58mm
      • Certificate RoHS, UL, SGS, Ect
      • Package Vacuum

      Product Description

      WELCOME TO XJYPCB------------------ Shenzhen Xinjiaye Electronics Technology Co., Ltd is a professional pcb manufacturer has over 10 years experience. We are able to offer 1 to 24 Layer PCB, ranging from pcb produce, components purchase, pcb assembly, pcb copy service.Our products are widely used ...

      Learn More

      2 Layer HDI Printed Circuit Comparison
      Transaction Info
      Price US$0.30-1.00 / Piece US$0.60-0.90 / Piece US$0.60-0.90 / Piece US$0.71-0.90 / Piece US$0.45-0.90 / Piece
      Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
      Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment
      Quality Control
      Product Certification RoHS, UL, SGS, Ect - - - -
      Management System Certification - - - - -
      Trade Capacity
      Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Europe, Southeast Asia/ Mideast North America, South America, Europe, Southeast Asia/ Mideast North America, South America, Europe, Southeast Asia/ Mideast North America, South America, Europe, Southeast Asia/ Mideast
      Annual Export Revenue - - - - -
      Business Model - - - - -
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Structure: Multilayer Rigid PCB;
      Dielectric: FR-4;
      Material: Polyester Glass Fiber Mat Laminate;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Production Process: Subtractive Process;
      Base Material: Fr4;
      Insulation Materials: Organic Resin;
      Surface Finishing: HASL;
      Copper Thickness: 1oz;
      Board Thickness: 1.6mm;
      Min. Hole Size: 0.1mm;
      Min. Line Wigth: 0.075mm;
      Min. Line Spacing: 0.075mm;
      Color: Blue;
      Size: 103mm*58mm;
      Package: Vacuum;
      Structure: Multilayer Rigid PCB;
      Dielectric: FR-4;
      Material: Polyester Glass Fiber Mat Laminate;
      Application: Communication;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Production Process: Subtractive Process;
      Base Material: Fr4;
      Insulation Materials: Epoxy Resin;
      Brand: Ca;
      Board Thickness: 1.6mm;
      Board Layer: 2 Layers;
      Copper Thickness: 1 Oz;
      Solder Mask: Blue;
      Silksreen: White;
      Min Pad: +/- 0.1mm (4mil);
      Surface Finihsing: HASL-Lf;
      Lead Time: 6-8 Working Days;
      Shipping Type: DHL, UPS, TNT, EMS, FedEx etc;
      Packing Type: Carton + Vacuum;
      Test: Fly Probe Testing;
      Min Board Thickness: 0.1mm Only for Single and Double Sided;
      Min. Line Width/Space: 0.05mm (2mil);
      Outline Machining Accuracy: +/- 0.1mm (4mil);
      MOQ: 1 PCS;
      Structure: Multilayer Rigid PCB;
      Dielectric: FR-4;
      Material: Polyester Glass Fiber Mat Laminate;
      Application: Communication;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Production Process: Subtractive Process;
      Base Material: Fr4;
      Insulation Materials: Epoxy Resin;
      Board Thickness: 1.6mm;
      Board Layer: 4 Layers;
      Copper Thickness: 1 Oz;
      Solder Mask: Green;
      Silksreen: White;
      Surface Finihsing: HASL-Lf;
      Lead Time: 6-8 Working Days;
      Min. Line Width/Space: 0.1mm;
      Min. Hole Size: 0.2mm;
      Board Material: Fr4;
      Structure: Multilayer Rigid PCB;
      Dielectric: FR-4;
      Material: Polyester Glass Fiber Mat Laminate;
      Application: Communication;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Production Process: Subtractive Process;
      Base Material: Fr4;
      Insulation Materials: Epoxy Resin;
      Board Thickness: 1.6mm;
      Board Layer: 4 Layers;
      Copper Thickness: 1 Oz;
      Solder Mask: Green;
      Silksreen: White;
      Surface Finihsing: HASL-Lf;
      Lead Time: 6-8 Working Days;
      Test: Fly Probe Testing;
      Max PCB Size: 650*650mm;
      Structure: Muitilayer;
      Dielectric: FR-4;
      Material: Polyester Glass Fiber Mat Laminate;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Production Process: Subtractive Process;
      Base Material: Fr4;
      Insulation Materials: Epoxy Resin;
      Board Thickness: 1.6mm;
      Board Layer: 4 Layers;
      Copper Thickness: 1 Oz;
      Solder Mask: Blue;
      Silksreen: White;
      Surface Finihsing: OSP;
      Lead Time: 6-8 Working Days;
      Min. Line Space: 0.1mm;
      Min.Hole Size: 0.15mm;
      Text: Flying Probe Text;
      Supplier Name

      Shenzhen Xinjiaye Electronics Technology Co., Ltd.

      Gold Member Audited Supplier

      Fastline Circuits Co., Limited

      Diamond Member Audited Supplier

      Fastline Circuits Co., Limited

      Diamond Member Audited Supplier

      Fastline Circuits Co., Limited

      Diamond Member Audited Supplier

      Fastline Circuits Co., Limited

      Diamond Member Audited Supplier

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