| Specification |
Structure: Flush Rigid PCB;
Dielectric: FR-4;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Layer Count: 1 to 24;
Surface Finishing: HASL;
Copper Thickness: 1oz;
Board Thickness: 1.6mm;
Min. Hole Size: 0.1mm;
Min. Line Wigth: 0.2mm;
Min. Line Spacing: 0.15mm;
Certificates: UL, RoHS, SGS, ISO9001;
Shipping: DHL, UPS, TNT, FedEx, etc;
Soldermask: Green;
|
Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Jingxin;
Layer: up to 32 Layers;
PCB Material: Fr-4, Cem-1, Cem-3, Hight Tg, Fr4 Halogen Free, Fr;
PCB Type: Rigid PCB, Flexible PCB, Rigid- Flexible PCB;
PCB Shape: Any Shape: Rectangular, Round, Slots, Cutouts, COM;
Board Thickness: 0.3mm-4mm;
Max.Finished Board Size: 22inch* 22inch or 550mm* 550mm;
Min.Drilled Hole Size: 0.2mm;
Surface Finish: HASL/HASL Lead Free, Chemical Tin, Chemical Gold;
Copper Thickness: 1/2oz, 1oz, 2oz, 3oz;
|
Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Jingxin;
Layer: up to 32 Layers;
PCB Material: Fr-4, Cem-1, Cem-3, Hight Tg, Fr4 Halogen Free, Fr;
PCB Type: Rigid PCB, Flexible PCB, Rigid- Flexible PCB;
PCB Shape: Any Shape: Rectangular, Round, Slots, Cutouts, COM;
Board Thickness: 0.3mm-4mm;
Max.Finished Board Size: 22inch* 22inch or 550mm* 550mm;
Min.Drilled Hole Size: 0.2mm;
Surface Finish: HASL/HASL Lead Free, Chemical Tin, Chemical Gold;
Copper Thickness: 1/2oz, 1oz, 2oz, 3oz;
|
Structure: Double-Sided Rigid PCB;
Dielectric: FR-1;
Material: Phenolic Paper Laminate;
Application: SMT;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Geekvalue;
Delivery: 1-7 Days;
MOQ: 1 PC;
Quality: 100% Tested;
Adaptation: PCB;
Inventory: Availability;
|
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Phenolic Paper Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V2;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Geekvalue;
Delivery: 1-7 Days;
MOQ: 100 PC;
Quality: 100% Tested;
Adaptation: PCB;
Inventory: Availability;
|
