Laptop Battery Design PCBA

US$0.01 / Piece

Laptop Battery Design Parallel Assemble PCB Board PCBA Maker Solar Circuit Board Competitive Price PCBA Factory Direct Sales pictures & photos

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What is Laptop Battery Design Parallel Assemble PCB Board PCBA Maker Solar Circuit Board Competitive Price PCBA Factory Direct Sales

Name: Laptop Battery Design Parallel Assemble PCB Board PCBA Maker Solar Circuit Board Competitive Price PCBA Factory Direct Sales
Uploaded: 2026-02-19T14:58:59+08:00
Description: Overview Product Description PCB Capability Layer count 1-50 layers Material FR4,Tg=135,150,170,180,210,AL base,Rogers,Nelco,CEM,Flex,and etc Copper thickness 1/2oz,1oz,2oz,3oz,4oz,5oz-10 oz Board th

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Price

Min. Order Reference FOB Price

1 Piece US$0.01 / Piece

Sepcifications

Metal Coating Enig / HASL / OSP / Silver etc.
Mode of Production SMT / DIP / Customized
Layers From 2 Layers to 50 Layers
Base Material Fr4/ High Tg Fr4/ Metal Core / Cem
Certification RoHS, CCC, ISO
Customized Customized
Condition New
Transport Package UPS/DHL/TNT/EMS/FedEx
Specification Custom
Trademark OEM
Origin China
Solder Mask Color Green,Blue,Yellow,White,Black,Red
Special Process Buried Hole, Blind Hole, Partial High Density, Bac
Copper Thickness 1/2oz,1oz,2oz,3oz,4oz,5oz-10 Oz
Layer Count 1-50 Layers
Quality Standard Ipc Class 2 and Ipc Class 3

Product Description

Overview Product Description PCB Capability Layer count 1-50 layers Material FR4,Tg=135,150,170,180,210,AL base,Rogers,Nelco,CEM,Flex,and etc Copper thickness 1/2oz,1oz,2oz,3oz,4oz,5oz-10 oz Board thickness 0.2-10.0mm Min.line width/space 3/3 mil(75/75um) Min. drill size 8 mil(0.2mm) ...

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Shenzhen Core Hecheng Electronic Technology Co., Ltd.

Diamond Member Since 2025

Audited Supplier

Rating & Reviews: 5.0/5.0

(2 Reviews)

Main Products PCBA Assembly, PCBA, PCB, Quick Turn PCB Assembly, Turnkey PCB Assembly, Cheap PCB ...
Address Shenzhen, Guangdong, China
Main Markets North America, South America, Eastern Europe, Western Europe, Eastern Asia, Southeast Asia
International Commercial Terms(Incoterms) FOB, EXW, CFR, CIF, DDP, CIP
Terms of Payment T/T, PayPal, Western Union, Small-amount payment
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

Laptop Battery Design PCBA Comparison

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Transaction Info
	Laptop Battery Design Parallel Assemble PCB Board PCBA Maker Solar Circuit Board Competitive Price PCBA Factory Direct Sales Contact Now	High Quality Customized One-Stop Service PCB Board Manufacturer Smart LED TV PCB Circuit Board PCBA Contact Now	Quick View PCBA Manufacturer SMT Electronic Components Assembly Circuit OEM Service Other PCB PCBA Contact Now	Quick View Support One-Stop OEM Service PCB Board PCBA Assembly PCBA Design Printed Circuit Board Supplier Contact Now	Quick View HMD4w-3 Air Conditioner Frequency Conversion Module Computer Main Board HMD4w-3 HMD3w-3c00 Zlbp1d-Swmk-Xese1 Contact Now
Price	US$0.01 / Piece	US$0.10-1.00 / Piece	US$0.10-5.00 / Piece	US$0.10-5.00 / Piece	US$430.00-440.00 / Piece
Min Order	1 Piece	1 Piece	1 Piece	1 Piece	1 Piece
Payment Terms	T/T, PayPal, Western Union, Small-amount payment	T/T, PayPal, Western Union, Small-amount payment	T/T, PayPal, Western Union, Small-amount payment	T/T, PayPal, Western Union, Small-amount payment	T/T, PayPal, Western Union, Small-amount payment
Quality Control
Product Certification	RoHS, CCC, ISO	RoHS, ISO	RoHS, ISO	RoHS, ISO	RoHS, ISO
Management System Certification	-	-	-	-	-
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Western Europe, Eastern Asia, Southeast Asia	South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe	South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe	South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe	South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	-	-	-	-	-
Average Lead Time	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Metal Coating: Enig / HASL / OSP / Silver etc.; Mode of Production: SMT / DIP / Customized; Layers: From 2 Layers to 50 Layers; Base Material: Fr4/ High Tg Fr4/ Metal Core / Cem; Customized: Customized; Condition: New; Solder Mask Color: Green,Blue,Yellow,White,Black,Red; Special Process: Buried Hole, Blind Hole, Partial High Density, Bac; Copper Thickness: 1/2oz,1oz,2oz,3oz,4oz,5oz-10 Oz; Layer Count: 1-50 Layers; Quality Standard: Ipc Class 2 and Ipc Class 3;	Metal Coating: Gold; Mode of Production: SMT; Layers: Double-Layer; Base Material: Fr4; Customized: Customized; Condition: New; Copper Thickness: 3oz -105oz; Surface Finish: Gold Finger; Special Teck: Metal Edging; Special 1: Blind Hole; Special 2: Buried Vias; Special 3: Fr4 Fr1 Cem1 Fr2;	Metal Coating: Gold; Mode of Production: SMT; Layers: Double-Layer; Base Material: Fr4; Customized: Customized; Condition: New; Copper Thickness: 3oz -105oz; Surface Finish: Gold Finger; Special Teck: Metal Edging; Special 1: Blind Hole; Special 2: Buried Vias; Special 3: Fr4 Fr1 Cem1 Fr2;	Metal Coating: Gold; Mode of Production: SMT; Layers: Double-Layer; Base Material: Fr4; Customized: Customized; Condition: New; Copper Thickness: 3oz -105oz; Surface Finish: Gold Finger; Special Teck: Metal Edging; Special 1: Blind Hole; Special 2: Buried Vias; Special 3: Fr4 Fr1 Cem1 Fr2;	Metal Coating: Copper; Mode of Production: DIP; Layers: Multilayer; Base Material: FR-4; Customized: Customized; Condition: New; Type: Rigid Circuit Board; Dielectric: Frequency Conversion Motherboard; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Insulation Materials: Epoxy Resin; Copper Thickness: 3oz -105oz;
Supplier Name	Shenzhen Core Hecheng Electronic Technology Co., Ltd.	Shenzhen Hemeixin Electronic Co., Limited	Shenzhen Hemeixin Electronic Co., Limited	Shenzhen Hemeixin Electronic Co., Limited	Shenzhen Hemeixin Electronic Co., Limited
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