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Assembly Module

US$0.01 / Piece

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What is Reliable Electronic Power Bank PCB Assembly Module Provide Design and PCBA Board

Name: Reliable Electronic Power Bank PCB Assembly Module Provide Design and PCBA Board
Uploaded: 2026-04-17T22:23:05+08:00
Description: Product Description PCB Capability Layer count 1-50 layers Material FR4,Tg=135,150,170,180,210,AL base,Rogers,Nelco,CEM,Flex,and etc Copper thickness 1/2oz,1oz,2oz,3oz,4oz,5oz-10 oz Board thickness

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About this Item

Price

Min. Order Reference FOB Price

1 Piece US$0.01 / Piece

Sepcifications

Metal Coating Enig / HASL / OSP / Silver etc.
Mode of Production SMT / DIP / PCB Manufacturing
Layers From 2 Layers to 50 Layers
Base Material Fr4/ High Tg Fr4/ Metal Core / Cem
Certification RoHS, CCC, ISO
Customized Customized
Condition New
Transport Package UPS/DHL/TNT/EMS/FedEx
Specification Custom
Trademark OEM
Origin China
Technology SMD, Tht, Double-Sided SMT Assembly, Fine Pitch to
SMT Line 11 SMT Lines
SMT Capability 20, 000, 000 Points Per Day
DIP Capability 300, 000 Points Per Day

Product Description

Product Description PCB Capability Layer count 1-50 layers Material FR4,Tg=135,150,170,180,210,AL base,Rogers,Nelco,CEM,Flex,and etc Copper thickness 1/2oz,1oz,2oz,3oz,4oz,5oz-10 oz Board thickness 0.2-10.0mm Min.line width/space 3/3 mil(75/75um) Min. drill size 8 mil(0.2mm) Min. ...

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Shenzhen Core Hecheng Electronic Technology Co., Ltd.

Diamond Member Since 2025

Audited Supplier

Rating & Reviews: 5.0/5.0

(2 Reviews)

Main Products PCBA Assembly, PCBA, PCB, Quick Turn PCB Assembly, Turnkey PCB Assembly, Cheap PCB ...
Address Shenzhen, Guangdong, China
Main Markets North America, South America, Eastern Europe, Western Europe, Eastern Asia, Southeast Asia
International Commercial Terms(Incoterms) FOB, EXW, CFR, CIF, DDP, CIP
Terms of Payment T/T, PayPal, Western Union, Small-amount payment
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

Assembly Module Comparison

	Reliable Electronic Power Bank PCB Assembly Module Provide Design and PCBA Board Contact Now	Quick View PCBA OEM Design PCBA and PCB Assembly Contact Now	Quick View High Quality Custom Flexible PCB Based on Your Design Contact Now	Quick View Mustar 4 Layers Rigid-Flex PCBA Assembly Contact Now	Quick View High Quality Custom Cellphone Motherboard PCB Based on Your Design Contact Now

Transaction Info
	Reliable Electronic Power Bank PCB Assembly Module Provide Design and PCBA Board Contact Now	Quick View PCBA OEM Design PCBA and PCB Assembly Contact Now	Quick View High Quality Custom Flexible PCB Based on Your Design Contact Now	Quick View Mustar 4 Layers Rigid-Flex PCBA Assembly Contact Now	Quick View High Quality Custom Cellphone Motherboard PCB Based on Your Design Contact Now
Price	US$0.01 / Piece	US$0.68-10.80 / Piece	US$0.68-10.80 / Piece	US$0.50-1.00 / Piece	US$0.68-10.80 / Piece
Min Order	1 Piece	1 Piece	1 Piece	10 Pieces	1 Piece
Payment Terms	T/T, PayPal, Western Union, Small-amount payment	PayPal, T/T	PayPal, T/T	LC, T/T, D/P, PayPal, Western Union, Small-amount payment	PayPal, T/T
Quality Control
Product Certification	RoHS, CCC, ISO	RoHS, ISO	RoHS, ISO	RoHS, CCC, ISO	RoHS, ISO
Management System Certification	-	-	-	-	-
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Western Europe, Eastern Asia, Southeast Asia	North America, Europe	North America, Europe	North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea)	North America, Europe
Annual Export Revenue	-	-	-	-	-
Business Model	-	ODM, OEM	ODM, OEM	-	ODM, OEM
Average Lead Time	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: one month Off Season Lead Time: within 15 workdays	Peak Season Lead Time: one month Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: one month Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Metal Coating: Enig / HASL / OSP / Silver etc.; Mode of Production: SMT / DIP / PCB Manufacturing; Layers: From 2 Layers to 50 Layers; Base Material: Fr4/ High Tg Fr4/ Metal Core / Cem; Customized: Customized; Condition: New; Technology: SMD, Tht, Double-Sided SMT Assembly, Fine Pitch to; SMT Line: 11 SMT Lines; SMT Capability: 20, 000, 000 Points Per Day; DIP Capability: 300, 000 Points Per Day;	Metal Coating: Copper; Mode of Production: SMT; Layers: Multilayer; Base Material: FR-4; Customized: Customized; Condition: Used; OEM/Odml: OEM/ODM;	Metal Coating: Copper; Mode of Production: SMT; Layers: Multilayer; Base Material: FR-4; Customized: Customized; Condition: Used; OEM/Odml: OEM/ODM;	Metal Coating: Copper; Mode of Production: SMT; Layers: Multilayer; Base Material: FR-4; Customized: Customized; Condition: New; Shape: DIP; Conductive Type: Bipolar Integrated Circuit; Integration: Gsi; Technics: Semiconductor IC; D/C: Standard; Warranty: 2 Years; Mounting Type: Standard, SMT, DIP; Cross Reference: Standard; Memory Type: Standard;	Metal Coating: Copper; Mode of Production: SMT; Layers: Multilayer; Base Material: FR-4; Customized: Customized; Condition: Used; OEM/Odml: OEM/ODM;
Supplier Name	Shenzhen Core Hecheng Electronic Technology Co., Ltd.	China Dragon Electronic Industrial Co., Limited	China Dragon Electronic Industrial Co., Limited	Mu Star (shenzhen) Industry Co., Ltd.	China Dragon Electronic Industrial Co., Limited
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