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      Printed Circuit
      US$0.01 / Piece
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      What is OEM Prototypy Service Turnkey Printed Circuit Board SMT Assembly PCB PCBA Layout Prototype Board

      About this Item
      Details
      Company Profile

      Price

      Min. Order Reference FOB Price

      1 Piece US$0.01 / Piece

      Sepcifications

      • Metal Coating Enig / HASL / OSP / Silver etc.
      • Mode of Production SMT / DIP / PCB Manufacturing
      • Layers From 2 Layers to 50 Layers
      • Base Material Fr4/ High Tg Fr4/ Metal Core / Cem
      • Certification RoHS, CCC, ISO
      • Customized Customized
      • Condition New
      • Transport Package UPS/DHL/TNT/EMS/FedEx
      • Specification Custom
      • Trademark OEM
      • Origin China
      • Technology SMD, Tht, Double-Sided SMT Assembly, Fine Pitch to
      • SMT Line 11 SMT Lines
      • SMT Capability 20, 000, 000 Points Per Day
      • DIP Capability 300, 000 Points Per Day

      Product Description

      Product Description PCB Capability Layer count 1-50 layers Material FR4,Tg=135,150,170,180,210,AL base,Rogers,Nelco,CEM,Flex,and etc Copper thickness 1/2oz,1oz,2oz,3oz,4oz,5oz-10 oz Board thickness 0.2-10.0mm Min.line width/space 3/3 mil(75/75um) Min. drill size 8 mil(0.2mm) Min. ...

      Learn More

      Printed Circuit Comparison
      Transaction Info
      Price US$0.01 / Piece US$4.00-5.00 / Piece US$1.00-50.00 / Piece US$1.00-50.00 / Piece US$20.00 / Piece
      Min Order 1 Piece 200 Pieces 1 Piece 1 Piece 1 Piece
      Payment Terms T/T, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Money Gram T/T, PayPal, Western Union, Small-amount payment, VTB T/T, PayPal, Western Union, Small-amount payment, VTB T/T
      Quality Control
      Product Certification RoHS, CCC, ISO RoHS, CCC, ISO ISO9001, ISO14001, IATF 16949, Ipc-a-610g, RoHS ISO9001, ISO14001, IATF 16949, Ipc-a-610g, RoHS RoHS, ISO, ISO13485
      Management System Certification - - - - -
      Trade Capacity
      Export Markets North America, South America, Eastern Europe, Western Europe, Eastern Asia, Southeast Asia North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Western Europe North America, South America, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe
      Annual Export Revenue - - - - -
      Business Model - - - - -
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: one month
      Product Attributes
      Specification
      Metal Coating: Enig / HASL / OSP / Silver etc.;
      Mode of Production: SMT / DIP / PCB Manufacturing;
      Layers: From 2 Layers to 50 Layers;
      Base Material: Fr4/ High Tg Fr4/ Metal Core / Cem;
      Customized: Customized;
      Condition: New;
      Technology: SMD, Tht, Double-Sided SMT Assembly, Fine Pitch to;
      SMT Line: 11 SMT Lines;
      SMT Capability: 20, 000, 000 Points Per Day;
      DIP Capability: 300, 000 Points Per Day;
      Metal Coating: Copper;
      Mode of Production: SMT;
      Layers: Multilayer;
      Base Material: FR-4;
      Customized: Customized;
      Condition: New;
      Specified Types: 4s Li-ion/Li-Polymer/LiFePO4 Battery;
      L-Ion/Li-Polymer Charging Voltage: 16.8V;
      LiFePO4 Charging Voltage: 14.4V;
      Max. Continuous Charging Current: 20A(Max);
      Maximal Continuous Discharging Current: 20A(Max);
      Discharge Overcurrent Protection: 50±10A(Adjustable);
      Colour of PCM: Green;
      Balance: Yes;
      Warranty: 12 Months;
      Metal Coating: Gold;
      Mode of Production: SMT+DIP;
      Layers: Multilayer;
      Base Material: FR-4;
      Customized: Customized;
      Condition: New;
      PCB Material: Fr-4, Cem-1, Cem-3, Hight Tg, Fr4 Halogen Free;
      PCB Shape: Rectangular, Round, Slots, Cutouts, Complex;
      Solder Mask: Green/Black/White/Red/Blue/Yellow/Purple.etc;
      Board Thickness: 0.2mm-8mm;
      Copper Thickness: 18um-3500um(0.5- 100oz);
      Service: PCB/Componentssourcing/Assembly/Test/Package;
      PCBA QA: X-ray, Aoi Test, in-Circuit Test (Ict);
      Layer: 1-36 Layers;
      Max. PCB Size: 1900mm*600mm;
      Profiling Punching: Routing, V-Cut, Beveling;
      Surface Finishing: HASL/HASL Lead Free, Chemical Tin, Chemical Gold;
      PCB Type: Rigid PCB, HDI PCB, Flexible PCB, Rigid-Flexible;
      Test: X-ray, Aoi, in-Circuit Test (Ict), Functional Test;
      PCBA Packaging: ESD Packaging, Shockproof Packaging, Anti-Drop;
      Metal Coating: Gold;
      Mode of Production: SMT+DIP;
      Layers: Multilayer;
      Base Material: FR-4;
      Customized: Customized;
      Condition: New;
      PCB Material: Fr-4, Cem-1, Cem-3, Hight Tg, Fr4 Halogen Free;
      PCB Shape: Rectangular, Round, Slots, Cutouts, Complex;
      Solder Mask: Green/Black/White/Red/Blue/Yellow/Purple.etc;
      Board Thickness: 0.2mm-8mm;
      Copper Thickness: 18um-3500um(0.5- 100oz);
      Service: PCB/Componentssourcing/Assembly/Test/Package;
      PCBA QA: X-ray, Aoi Test, in-Circuit Test (Ict);
      Layer: 1-36 Layers;
      Max. PCB Size: 1900mm*600mm;
      Profiling Punching: Routing, V-Cut, Beveling;
      Surface Finishing: HASL/HASL Lead Free, Chemical Tin, Chemical Gold;
      PCB Type: Rigid PCB, HDI PCB, Flexible PCB, Rigid-Flexible;
      Test: X-ray, Aoi, in-Circuit Test (Ict), Functional Test;
      PCBA Packaging: ESD Packaging, Shockproof Packaging, Anti-Drop;
      Metal Coating: Copper;
      Mode of Production: SMT;
      Layers: Multilayer;
      Base Material: FR-4;
      Customized: Customized;
      Condition: New;
      PCBA-Testing: X-ray, Aoi;
      Small Order: Acceptable;
      Type: Rigid Circuit Board;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Insulation Materials: Organic Resin;
      Material: Complex;
      Supplier Name

      Shenzhen Core Hecheng Electronic Technology Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen KeYing HengYe Technology Co., Ltd.

      Diamond Member Audited Supplier

      EXCEEDING ELECTRONICS GROUP LIMITED

      Diamond Member Audited Supplier

      EXCEEDING ELECTRONICS GROUP LIMITED

      Diamond Member Audited Supplier

      Shenzhen Grandtop Electronics Co., Ltd.

      Diamond Member Audited Supplier

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