| Specification |
Metal Coating: Copper/Tin/Gold/Silver;
Mode of Production: SMT+DIP;
Layers: Multilayer;
Base Material: Fr4/Al;
Customized: Customized;
Condition: New;
Service: PCB/Componentssourcing/Assembly/Test/Package;
Layer: 1-20 Layers;
PCB Material: Fr4/High Tg Fr4/Aluminum/Rogers /Cem-3/Cem-1/ etc.;
Surface Finished: HASL/Lead Free/OSP/Immersion Gold etc.;
Board Thickness: 0.3mm~3.5mm;
Solder Mask: Green/Black/White/Red/Blue/Yellow/Purple.etc;
Test: X-ray, Aoi, in-Circuit Test (Ict), Functional Test;
PCBA QA: X-ray, Aoi Test, in-Circuit Test (Ict);
Profiling Punching: Routing, V-Cut, Beveling;
Copper Thickness: 18um-3500um(0.5- 100oz);
Finished Outer Copper Thickness: H/H0z-5/50z;
Finished Inner Copper Thickness: H/H0z-4/40z;
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Metal Coating: Copper;
Mode of Production: DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Soldermask Color: Green, Yellow, Blue, Black, White...;
Sample: Available;
OEM/ODM: Available;
Test: 100%E-Testing;
Color of Silk Screen: Green, Purple, Black;
Service: OEM / Dfm;
PCB Factory: Yes;
Certificate Gurantee: Yes;
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Metal Coating: Copper;
Mode of Production: DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Soldermask Color: Green, Yellow, Blue, Black, White...;
Sample: Available;
OEM/ODM: Available;
Test: 100%E-Testing;
Color of Silk Screen: Green, Purple, Black;
Service: OEM / Dfm;
PCB Factory: Yes;
Certificate Gurantee: Yes;
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Metal Coating: Gold;
Mode of Production: SMT+DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Item: PCB Assembly;
PCB Layer: 1-28 Layers;
PCBA Min. IC Pitch: 0.30mm(12mil);
PCBA Foot Pin: So, Sop, Soj, Tsop, Tssop, Qfp, BGA and U-BGA;
PCBA Min. Chip Placement: 0201;
Turnkey Service: PCB Fabrication, PCB Assembly, Box Build;
Applicaton: Industrial Device, Medical, LED, New Energy;
Service: Customized, ODM, OEM;
Conformal Coating: Yes;
PCBA Programming: Yes;
PCBA Testing: Yes;
Packaging Service: Yes;
Process: DIP, SMT;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
PCBA-Testing: X-ray, Aoi;
Small Order: Acceptable;
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
Material: Complex;
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