| Specification |
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Product Name: PCBA;
Finished Outer Copper Thickness: H/H0z-5/5oz;
Finished Inner Copper Thickness: H/H0z-4/4oz;
Min Board Size: 8*8mm;
Board Thickness: 0.3mm~3.5mm;
Max Board Size: 650*610mm;
Assembly Service: SMT/DIP/Manual Soldering;
Surface Finish: HASL/HASL Lf/OSP/Immersion Gold/Tin/ Silver;
Value-Added Service: PCB Layout/Component/Bom Alternative;
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Metal Coating: Tin;
Mode of Production: SMT+DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Testing: Spi,Aoi,Ict,Fct,X-ray,RoHS and Aging.;
Min. Component: 01005;
Max. PCB Mulitylayer: up to 64 Layers;
Max PCB Dimension: 740*400mm;
MOQ: Orders of Small or Medium Quantity Is Welcomed;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Shape: DIP;
Conductive Type: Bipolar Integrated Circuit;
Integration: Gsi;
Technics: Semiconductor IC;
D/C: Standard;
Warranty: 2 Years;
Mounting Type: Standard, SMT, DIP;
Cross Reference: Standard;
Memory Type: Standard;
|
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Shape: DIP;
Conductive Type: Bipolar Integrated Circuit;
Integration: Gsi;
Technics: Semiconductor IC;
D/C: Standard;
Warranty: 2 Years;
Mounting Type: Standard, SMT, DIP;
Cross Reference: Standard;
Memory Type: Standard;
|
Metal Coating: Tin;
Mode of Production: SMT+DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Testing: Spi,Aoi,Ict,Fct,X-ray,RoHS and Aging.;
Min. Component: 01005;
Max. PCB Mulitylayer: up to 64 Layers;
Max PCB Dimension: 740*400mm;
MOQ: Orders of Small or Medium Quantity Is Welcomed;
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