| Specification |
Type: Flex-Rigid PCB;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Flex-Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Uc;
Board Thickness: 1.6mm;
Copper Thickness: 2oz;
Surface Finihsing: Immersion Gold;
Lead Time: 6-8 Working Days;
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Type: Rigid Circuit Board;
Dielectric: AIN;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: ODM;
Shape: Rectangular, Round, Slots, Cutouts, Complex;
PCB Testing: E-Test, Fly Probe Test, Visual Checking;
Soldermask Color: White, Green, Black;
Model: PCB;
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Type: 94V-0 Multilayer PCB;
Dielectric: FR-4;
Material: Customized;
Application: All;
Flame Retardant Properties: Customized;
Mechanical Rigid: Rigid, Fexible, Rigid and Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Copper, FPC, Ceramic, Aluminum-Based, High Freque;
Insulation Materials: Organic Resin;
Service: PCB+Assembly+Components;
Solder Mask Color: White.Black.Yellow.Green.Red.Blue;
Min. Hole Size: 0.15mm;
Min. Line Spacing: 0.075---0.09mm;
Surface Finishing: Asl\OSP\Immersion Gold;
|
Type: Rigid Circuit Board;
Dielectric: AIN;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: ODM;
Shape: Rectangular, Round, Slots, Cutouts, Complex;
PCB Testing: E-Test, Fly Probe Test, Visual Checking;
Soldermask Color: White, Green, Black;
Model: PCB;
|
Type: 94V-0 Multilayer PCB;
Dielectric: FR-4;
Material: Customized;
Application: All;
Flame Retardant Properties: Customized;
Mechanical Rigid: Rigid, Fexible, Rigid and Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Copper, FPC, Ceramic, Aluminum-Based, High Freque;
Insulation Materials: Organic Resin;
Service: PCB+Assembly+Components;
Solder Mask Color: White.Black.Yellow.Green.Red.Blue;
Min. Hole Size: 0.15mm;
Min. Line Spacing: 0.075---0.09mm;
Surface Finishing: Asl\OSP\Immersion Gold;
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