| Specification |
Type: Rigid Circuit Board;
Dielectric: Aluminum;
Material: Aluminum;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Metal Composite Materials;
Model: PCB;
Brand: Uc;
Layers: 2;
Thickness: 1.6mm;
Solder Mask Color: White;
Surface Treatment: HASL Lead Free;
Cooper Thickness: 1/1 Oz;
Base: Aluminum;
PCB Testing: E-Testing, Flying Probe Testing;
Ipc Standards: Ipc Class II;
Lead Time: 5-8 Working Days;
Fast Turn: 3 Working Days;
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Type: Flexible Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Model: PCB;
Board Thickness: 0.21mm to 7.0mm;
Layer: 1 to 28 Layers;
Meterial Type: Fr-4, Cem-1, High Tg, Fr4 Halogen Free, Rogers;
Copper Thickness: 0.5oz to 5oz;
Min Hole Size: 0.2mm;
Min Line Width: 0.075mm;
Min Line Spacing: 0.075mm;
Solder Mask Color: Green.White, Blue, Ect;
Shipping: UPS, FedEx, DHL, Ect;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Model: PCB;
Solder Mask: White, Green, Black, Red;
Silkscreen: White, Green, Black, Red;
PCB Material Thickness: 0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm, 2.0mm, 3.2mm;
Surface Finishing: HASL, Lf-Hal, Immerion Tin, Immerion Gold, OSP;
Copper Thickness: 1oz;
Min Hole Size: 0.2mm;
Min Line Width: 0.1mm;
Min Line Spacing: 0.1mm;
Shipping: UPS, FedEx, DHL, Ect;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Paper Phenolic Copper Foil Substrate;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Copper Thickness: 1oz;
Surface Finishing: OSP;
Solder Mask Type: Green;
Silkscreen: White;
Board Thickness: 2.0mm;
Min. Hole Size: 0.2mm;
Min. Line Width: 0.15mm;
Min. Line Spacing: 0.15mm;
Certificates: UL, RoHS, SGS, ISO9001;
Shipping: DHL, UPS, TNT, FedEx, etc;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: FR-4;
Brand: Xjy;
Copper Thickness: 1oz;
Board Thickness: 1.6mm;
Min Hole Size: 0.1mm;
Min Line Space: 0.075mm;
Min Line Width: 0.075mm;
Soldermask: Green;
Silkscreen: White;
Surface Treatment: HASL Lead Free;
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