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      Power PCB
      US$1.20-1.80 / Piece
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      What is HDI PCB Circuit Board for Power with Multilayer

      About this Item
      Details
      Company Profile

      Price

      Purchase Qty. Reference FOB Price

      1-99 Pieces US$1.80

      100-499 Pieces US$1.50

      500+ Pieces US$1.20

      Sepcifications

      • Type Rigid Circuit Board
      • Dielectric FR-4
      • Material Fiberglass Epoxy
      • Application Computer
      • Flame Retardant Properties V0
      • Mechanical Rigid Rigid
      • Processing Technology Electrolytic Foil
      • Base Material Copper
      • Insulation Materials Epoxy Resin
      • Brand Uc
      • Transport Package Vacuum Package
      • Specification UL(US&Canada). ISO. RoHs, TS, SGS
      • Trademark UC
      • Origin Shenzhen, China
      • Layer 22
      • Thickness 1.78mm
      • Surface Enig
      • Special HDI

      Product Description

      Ucreate LTD PCB's Aim: Customer Satisfaction is Always Our First Priority! *Quality Policy *Top Quality and high efficiency *Improve continuously *Achieve customer's satisfaction 1.Products Application: 2. Market Distribution: ...

      Learn More

      Power PCB Comparison
      Transaction Info
      Price US$1.20-1.80 / Piece US$0.70-6.00 / Piece US$0.20-0.60 / Piece US$0.50-1.50 / Piece US$0.50-1.50 / Piece
      Min Order 1 Piece 2 Pieces 1 Piece 1 Piece 1 Piece
      Payment Terms LC, T/T, D/P, PayPal, Western Union T/T, PayPal, Western Union T/T, PayPal, Western Union T/T, PayPal, Western Union T/T, PayPal, Western Union
      Quality Control
      Management System Certification - - - - -
      Trade Capacity
      Export Markets North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia
      Annual Export Revenue - - - - -
      Business Model - ODM, OEM ODM, OEM ODM, OEM ODM, OEM
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Computer;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Brand: Uc;
      Layer: 22;
      Thickness: 1.78mm;
      Surface: Enig;
      Special: HDI;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy Resin + Polyimide Resin;
      Application: Communication;
      Flame Retardant Properties: V2;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Metal Composite Materials;
      Brand: New Chip;
      Soldermask Color: Green, Yellow, Blue, Black, White...;
      Sample: Available;
      OEM/ODM: Available;
      Certificate Gurantee: Yes;
      Test: 100%E-Testing;
      Color of Silk Screen: Green, Purple, Black;
      Service: OEM / Dfm;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy Resin + Polyimide Resin;
      Application: Consumer Electronics;
      Flame Retardant Properties: V2;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Brand: New Chip;
      Capacity: 1000000;
      OEM/ODM: Available;
      Sample: Available;
      Surface Treatment: OSP, Enig, HASL, AG Immersion;
      Certificate Gurantee: Yes;
      Test: 100%E-Testing;
      Min Bonding Pad Diameter: 10mil;
      Min Thickness of Soldermask: 10um;
      Color of Silk-Screen: White, Yellow, Black;
      Data File Format: Gerber File and Drilling File, Protel Series, ...;
      Material for PCB: Fr-4, High Tg Fr$, Halogen Free,;
      Layer Count: 1-20 Layers;
      Shipping: DHL/UPS/FedEx/Air/Sea;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy Resin + Polyimide Resin;
      Application: Consumer Electronics;
      Flame Retardant Properties: V2;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Brand: New Chip;
      Capacity: 1000000;
      OEM/ODM: Available;
      Sample: Available;
      Surface Treatment: OSP, Enig, HASL, AG Immersion;
      Certificate Gurantee: Yes;
      Test: 100%E-Testing;
      Min Bonding Pad Diameter: 10mil;
      Min Thickness of Soldermask: 10um;
      Color of Silk-Screen: White, Yellow, Black;
      Data File Format: Gerber File and Drilling File, Protel Series, ...;
      Material for PCB: Fr-4, Halogen Free, Rogers, Cem-1, Ari;
      Layer Count: 1-20 Layers;
      Shipping: DHL/UPS/FedEx/Air/Sea;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy Resin + Polyimide Resin;
      Application: Consumer Electronics;
      Flame Retardant Properties: V2;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Brand: New Chip;
      Capacity: 1000000;
      OEM/ODM: Available;
      Sample: Available;
      Surface Treatment: OSP, Enig, HASL, AG Immersion;
      Certificate Gurantee: Yes;
      Test: 100%E-Testing;
      Min Bonding Pad Diameter: 10mil;
      Min Thickness of Soldermask: 10um;
      Color of Silk-Screen: White, Yellow, Black;
      Data File Format: Gerber File and Drilling File, Protel Series, ...;
      Material for PCB: Fr-4, Halogen Free, Rogers, Cem-1, Ari;
      Layer Count: 1-20 Layers;
      Shipping: DHL/UPS/FedEx/Air/Sea;
      Supplier Name

      Ucreate PCB Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen New Chip international Ltd

      Gold Member Audited Supplier

      Shenzhen New Chip international Ltd

      Gold Member Audited Supplier

      Shenzhen New Chip international Ltd

      Gold Member Audited Supplier

      Shenzhen New Chip international Ltd

      Gold Member Audited Supplier