| Specification |
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Application: Computer;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: UC;
Layer: 12;
Thickness: 0.96mm;
Soldmask: Green;
Surface: Plated Gold;
Silkscreen: White;
Certificates: UL, ISO, Ts16949;
Hole Quantity Per PCS: 1200;
Min Line Width/ Space: 0.1/0.1mm;
Use: Electronic Production;
Panel: 6PCS/Set;
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Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Jingxin;
MOQ: 1PCS;
Layer: 1-80layers;
Board Thickness: 0.2mm-7.0mm;
Solder Mask: Green.Blue.Red.Black.White.etc;
Surface Finishing: HASL\OSP\Immersion Gold;
Product Type: Custom HDI PCBA;
Applicate: Electronics Device/Home Appliances;
Delivery Time: Sample Is Available Within 3days;
Package: Vacuum Bag+Carton;
Supplier Type: PCB, PCBA, FPC, HDI, Rfpc;
Capacity: 1000000PCS Each Week;
Keyword: OEM Contract Manufacturing PCB PCBA;
Service: One-Stop Turnkey;
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Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Jingxin;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Copper Thickness: 1 Oz;
Board Layer: 1-20 Layers;
Board Thickness: 1.6mm;
Surface Finish: Gold Plating, Enig;
Solder Mask: Green/Custom;
Legend: White;
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Structure: Metal Base Rigid PCB;
Dielectric: CEM-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V2;
Processing Technology: Delay Pressure Foil;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Okey;
Shape: Retangular, Round, Slots, Cutouts, Complex, Irreg;
Surface Finishing: OSP, Immersion Gold, Immersion Tin, Immersion AG;
Layer: 1-22 Layers;
Service: Turnkey Assembly PCB Service;
Other Capabilities: Repair/Rework Services Mechanical Assembly Box Bui;
Copper Thickness: 1-10oz;
Min. SMD Size: 01005;
QA Inspection: Aoi, X-ray, Ict;
Order Qty: No Limited;
Condition: New;
Controlling Range: -40c~125c;
Solder Resist Color: Green;Red;Yellow;Black;White;
Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable Mask;
Trade Mark: OEM, ODM;
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