| Specification |
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Uc;
Board Layer: 1-24;
Material Finished Thickness: 0.4-3.2mm;
Surface Treatment: Immersion Gold/HASL Lead Free/ Immersion Silve;
Finished Copper Thickness: 1&2 Oz;
Solder Mask Color: Green/White/Black/Blue/Red;
PCB Testing: E-Testing; Flying Probe Testing;
Lead Time: 5 Working Days;
Fast Turn: 2 Working Days;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Fiberglass Epoxy, Polyester Glass Fiber Mat Laminate;
Application: Medical Instruments, Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil, Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Fr4, Copper;
Insulation Materials: Epoxy Resin, Organic Resin;
Type: Combining Rigid Circuit Board;
Mechanical Rigid: Rigid;
Board Thickness: 1.6mm;
Board Layer: 4 Layers;
Copper Thickness: 1 Oz;
Solder Mask: Green;
Silksreen: White;
Surface Finihsing: Enig;
Lead Time: 6-8 Working Days;
Shipping Type: DHL, UPS, TNT, EMS, FedEx etc;
Packing Type: Carton + Vacuum;
Material Type: Fr4;
|
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Fiberglass Epoxy, Polyester Glass Fiber Mat Laminate;
Application: Medical Instruments, Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil, Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Fr4, Copper;
Insulation Materials: Epoxy Resin, Organic Resin;
Type: Combining Rigid Circuit Board;
Mechanical Rigid: Rigid;
Board Thickness: 1.6mm;
Board Layer: 4 Layers;
Copper Thickness: 1 Oz;
Solder Mask: Green;
Silksreen: White;
Surface Finihsing: Enig;
Lead Time: 6-8 Working Days;
Shipping Type: DHL.TNT, EMS, FedEx, UPS etc;
PCB Design: Custom Design Product;
Board Material: Fr4;
|
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Fiberglass Epoxy, Polyester Glass Fiber Mat Laminate;
Application: Medical Instruments, Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil, Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Fr4, Copper;
Insulation Materials: Epoxy Resin, Organic Resin;
Type: Combining Rigid Circuit Board;
Mechanical Rigid: Rigid;
Board Thickness: 1.6mm;
Board Layer: 4 Layers;
Copper Thickness: 1 Oz;
Solder Mask: Green;
Silksreen: White;
Surface Finihsing: HASL;
Lead Time: 6-8 Working Days;
Shipping Type: DHL.TNT, EMS, FedEx, UPS etc;
PCB Design: Custom Design Product;
Board Material: Polyimide;
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Structure: Double-Sided FPC, Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Fr4, Polyester Glass Fiber Mat Laminate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace, Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Fr4, Copper;
Insulation Materials: Epoxy Resin, Organic Resin;
Combination Mode: Without Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
Board Material: Fr4;
Board Layer: 2;
Board Thickness: 0.2 mm;
Copper Thickness: 1 Oz;
Solser Mask: Green;
Silkscreen: White;
Surface Finishing: Enig;
Lead Time: 4-5 Working Days;
Shipping Type: DHL.TNT, EMS, FedEx, UPS etc;
PCB Design: Custom Design Product;
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