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Die Bonder

US$90,500.00-119,000.00 / Piece

Flip Chip Bonder Semiconductor Equipment Small Desktop China Manufaturer pictures & photos

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What is Flip Chip Bonder Semiconductor Equipment Small Desktop China Manufaturer

Name: Flip Chip Bonder Semiconductor Equipment Small Desktop China Manufaturer
Uploaded: 2026-01-07T02:11:23+08:00
Description: High Precision Flip chip Bonder for Semiconductor with soldering DB100 is a manual-semi-automatic micro assembly placement system. The whole machine uses a marble motion platform to ensure that th

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About this Item

Price

Min. Order Reference FOB Price

1 Piece US$90,500.00-119,000.00 / Piece

Sepcifications

After-sales Service Online and Video Service
Condition New
Speed Medium Speed
Precision High Precision
Certification ISO, CE
Warranty 12 Months
Automatic Grade Semiautomatic
Type Medium-speed Chip Mounter
Transport Package Polywood Case
Specification 800 * 750 * 630mm
Trademark TERMWAY
Origin Beijing, China
Max. Chip Size 20mm X20mm (50*50mm Optional)
Min. Chip Size 0.2mm*0.2mm
Mounting Precision 0.1um/0.3um
Feeding Mode 2 Inch Waffle Box*2
Soldering Size 150*150mm
X Y Z Axis Motion System Roller Screw + Servo Motor
X Y Axis Resolution 0.1um
Net Weight 300kg
Power Supply 220V, 50Hz

Product Description

High Precision Flip chip Bonder for Semiconductor with soldering DB100 is a manual-semi-automatic micro assembly placement system. The whole machine uses a marble motion platform to ensure that the entire motion accuracy reaches the sub-micron level. It comes with a laser height measurement ...

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Termway (Beijing) Precision Technology Co., Ltd.

Diamond Member Since 2010

Audited Supplier

Business Type Manufacturer/Factory & Trading Company
Main Products PCB Assembly, Pick&Place Machine, Reflow Oven/Wave Machine, Screen Printer, Dispenser
Year of Establishment 2012-07-31
Number of Employees 28
Address 12i Factory Building, No 15, Jingsheng South 4th Street, Jinqiao Science and Technology Industrial Base, Zhongguancun High-Tech Park, Tongzhou District, Beijing

Die Bonder Comparison

	Flip Chip Bonder Semiconductor Equipment Small Desktop China Manufaturer Contact Now	Quick View YAMAHA SMT Pick and Place Machine Ys24 Chip Mounter Contact Now	Quick View SMT Spare Parts YAMAHA Filter K46-M8527-00X/K46-M8527-C0 Contact Now	Quick View SMT Spare Parts FUJI H24 Nozzle 0.7mm Nozzle 2agknx003106 Contact Now	Quick View Ruibo Semiconductor Industry Automatic IC Programming Machine Contact Now

Transaction Info
	Flip Chip Bonder Semiconductor Equipment Small Desktop China Manufaturer Contact Now	Quick View YAMAHA SMT Pick and Place Machine Ys24 Chip Mounter Contact Now	Quick View SMT Spare Parts YAMAHA Filter K46-M8527-00X/K46-M8527-C0 Contact Now	Quick View SMT Spare Parts FUJI H24 Nozzle 0.7mm Nozzle 2agknx003106 Contact Now	Quick View Ruibo Semiconductor Industry Automatic IC Programming Machine Contact Now
Price	US$90,500.00-119,000.00 / Piece	US$29,999.00 / Piece	US$0.10-1.00 / Piece	US$10.00-40.00 / Piece	US$12,000.00-20,000.00 / Set
Min Order	1 Piece	1 Piece	1 Piece	1 Piece	1 Set
Payment Terms	LC, T/T	LC, T/T, D/P, PayPal, Western Union, Small-amount payment	LC, T/T, D/P, PayPal, Western Union, Small-amount payment	LC, T/T, D/P, PayPal, Western Union, Small-amount payment	LC, T/T, D/P, PayPal, Western Union, Small-amount payment
Quality Control
Product Certification	ISO, CE	CE	ISO, CE	ISO, CE	ISO, CE
Management System Certification	-	-	-	-	-
Trade Capacity
Export Markets	North America, Europe, East Asia(Japan/ South Korea)	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	Own Brand	Own Brand, ODM, OEM	Own Brand, ODM, OEM	Own Brand, ODM, OEM	ODM, OEM
Average Lead Time	Peak Season Lead Time: one month Off Season Lead Time: one month	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Product Attributes
Specification	After-sales Service: Online and Video Service; Condition: New; Speed: Medium Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Semiautomatic; Type: Medium-speed Chip Mounter; Max. Chip Size: 20mm X20mm (5050mm Optional);* Min. Chip Size: 0.2mm0.2mm;* Mounting Precision: 0.1um/0.3um; Feeding Mode: 2 Inch Waffle Box2;* Soldering Size: 150150mm;* X Y Z Axis Motion System: Roller Screw + Servo Motor; X Y Axis Resolution: 0.1um; Net Weight: 300kg; Power Supply: 220V, 50Hz;	After-sales Service: Video Call Technical Support; Condition: Used; Speed: High Speed; Precision: High Precision; Warranty: 1 Month; Automatic Grade: Automatic; Type: High-speed Chip Mounter; Name: YAMAHA;	Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 6 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter; Lead Time: 2 Days; Quality: 100% Tested; Shipping Ways: DHL, FedEx, TNT, UPS, EMS, by Sea;	Condition: New; Precision: Precision; Warranty: 3 Months; Part No.: 2agknx003106; Product Name: Nozzle; Lead Time: 1-3 Days After Payment; Shipping Ways: DHL, FedEx, TNT, UPS, EMS, by Sea, by Air;	After-sales Service: Remote Coaching or on-Site Service; Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter; Accuracy: 0.1 mm; Control Mode: Continuous Path Control; Drive Mode: Electric; Welding Speed: 10 M/Min; Function: Abrasion Resistance, High Temperature Resistance; Demoulding: Automatic; PC Control: Use a USB Link, Suppert Offline Burning; Repeatalibity: Screw/±0.02 Belt/±0.05; Buring Efficiency: 3600/Burning Time(Sec +3)2;* Input Power: 220VAC 1# 3.0kw; Drive Mode of IC: SMC Rodless Cylinder Drive; Detectuve Product: Automatic Alarm; Edit Mode: PC + Hand Control Box; Moving Accuracy: +/-0.02mm; Control System: PLC;
Supplier Name	Termway (Beijing) Precision Technology Co., Ltd.	Qinyi Electronics Co., Ltd.	Qinyi Electronics Co., Ltd.	Qinyi Electronics Co., Ltd.	Dongguan Ruibo Automation Equipment Co., Ltd.
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