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      SMT Placement Machine
      US$50,000.00-80,000.00 / module
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      What is Panasonic Cm602-L High-Speed Placement Machine

      About this Item
      Details
      Company Profile

      Price

      Min. Order Reference FOB Price

      1 module US$50,000.00-80,000.00 / module

      Sepcifications

      • After-sales Service 224
      • Condition Used
      • Speed High Speed
      • Precision High Precision
      • Certification CCC, RoHS, CE
      • Warranty 12 Months
      • Automatic Grade Automatic
      • Type High-speed Chip Mounter
      • Transport Package Wooden Case
      • Specification 1500KGS
      • Trademark PANASONICS
      • Origin Japan
      • Delivery Time About 15 Days

      Product Description

      Panasonic's CM602-L SMT machine is a classic modular SMT machine in the CM series, widely used in the electronics manufacturing industry, known for its high speed, high precision, and high reliability. The following is an introduction to the main product specifications of * * CM602-L * *: 1. ...

      Learn More

      SMT Placement Machine Comparison
      Transaction Info
      Price US$50,000.00-80,000.00 / module US$1,000,000.00-1,001,000.00 / Piece US$23,000.00-40,000.00 / Piece US$23,000.00-40,000.00 / Piece US$48,150.00-48,200.00 / Piece
      Min Order 1 module 1 Piece 1 Piece 1 Piece 1 Piece
      Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram
      Quality Control
      Product Certification CCC, RoHS, CE CCC, PSE, RoHS, ISO CCC, PSE, RoHS, ISO CCC, PSE, RoHS, ISO CCC, PSE, FDA
      Management System Certification - - - - -
      Trade Capacity
      Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
      Annual Export Revenue - - - - -
      Business Model ODM, OEM ODM, OEM ODM, OEM ODM, OEM ODM, OEM
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      After-sales Service: 224;
      Condition: Used;
      Speed: High Speed;
      Precision: High Precision;
      Warranty: 12 Months;
      Automatic Grade: Automatic;
      Type: High-speed Chip Mounter;
      Delivery Time: About 15 Days;
      After-sales Service: Yes;
      Condition: Used;
      Speed: High Speed;
      Precision: High Precision;
      Warranty: 12 Months;
      Automatic Grade: Automatic;
      Type: High-speed Chip Mounter;
      Equipment Type: SMT Parallel Transfer Conveyor / Buffer;
      PCB Thickness: 0.4mm ~ 4.0mm;
      PCB Warpage Tolerance: < 1.0%;
      Conveyor Height: 900mm ± 20mm (Standard);
      Max. PCB Width: 480mm (Adjustable);
      Control System: PLC (Programmable Logic Controller);
      After-sales Service: Yes;
      Speed: High Speed;
      Precision: High Precision;
      Warranty: 12 Months;
      Automatic Grade: Automatic;
      Type: High-speed Chip Mounter;
      Bonding Force: Closed-Loop Controlled, Highly Precise;
      Ultrasonic Frequency: 58 kHz / 120 kHz (Selectable);
      Vision System: High-Resolution Digital CCD / CMOS;
      Search Field (Fs): up to 2048 X 2048 Pixels;
      Bonding Accuracy: < ±25μm / ±10% of Wire Diameter;
      Air Pressure Requirement: 0.5 MPa to 0.7 MPa;
      Production Speed: up to 8 -12 Balls Per Second (Depending on Loop H;
      After-sales Service: Yes;
      Speed: High Speed;
      Precision: High Precision;
      Automatic Grade: Automatic;
      Type: High-speed Chip Mounter;
      Machine Type: Automatic Wire Bonder (Ball Bonding);
      Bonding Force: Closed-Loop Controlled;
      Ultrasonic Frequency: 58 kHz / 120 kHz (Selectable);
      Wire Diameter Range: 18μm -50μm (0.7 Mil -2.0 Mil);
      Vision System: High-Resolution Digital CCD;
      Search Field (Fs): Standard and High-Resolution Modes;
      Bonding Accuracy: < ±25μm / ±10% of Wire Diameter;
      Speed: Super High Speed;
      Precision: Precision;
      Automatic Grade: Automatic;
      Inspection Type: Inline / Real-Time (SMT Line);
      Camera Resolution: High-Definition Industrial Camera (e.g., 5MP / 10m;
      Lighting System: RGB Multi-Angle LED Strobe Lighting (Programmable);
      PCB Board Thickness: 0.4mm - 6.0mm (Customizable);
      Max. Board Size: up to 30 - 50 Cm²/Sec (Dependent on Program Comple;
      Defects Detected: Solder Short, Open, Insufficient Solder, Lifted Le;
      Power Supply: AC 220V / 380V, 50/60Hz;
      Supplier Name

      Shenzhen Tengxiangjia Technology Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Tengxiangjia Technology Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Tengxiangjia Technology Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Tengxiangjia Technology Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Tengxiangjia Technology Co., Ltd.

      Diamond Member Audited Supplier

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