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      ROM-2860 Embedded Industrial Motherboards Open Standard Qualcomm Qcs6490 Osm 1.1 Computer on-Module for Advantech

      About this Item
      Details
      Company Profile

      Price

      Min. Order Reference FOB Price

      1 unit US$80.00-200.00 / unit

      Sepcifications

      • Integrated Graphics Integrated Graphics
      • Main Chipset Intel
      • Maximum Memory Capacity 8G
      • Structure Rtx Module
      • Memory DDR5
      • SATA Interface SATA3.0
      • Printed Circuit Board Double Layers
      • Main Board Structure Integrated
      • Audio Effects Not HiFi
      • Transport Package Std
      • Specification 45 x 45 mm
      • Trademark Advantech
      • Origin Bj, Cn
      • with CPU Yes
      • Chipset Other
      • Fsb/Ht 2400
      • Socket Typeo Onboard CPU
      • CPU Type Intel
      • Aunch Date 2018
      • Hard Drive Interface SATA
      • Item Condition New
      • Memory Channel Double
      • Products Status New
      • Private Mold Yes
      • Application Server/Workstation

      Product Description

      Product Description Advantech Embedded Industrial Motherboards Open Standard ROM-2860 Qualcomm QCS6490 OSM 1.1 Computer-on-Module Andreo VPU 633 Andreo GPU 643 ROM-2860 Qualcomm QCS6490 OSM 1.1 Computer-on-Module Features ƒ Qualcomm Arm® v8 Cortex® Gold plus up to 2.7 GHz ...

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      Embedded Industrial Computer Comparison
      Transaction Info
      Price US$80.00-200.00 / unit Negotiable Negotiable Negotiable Negotiable
      Min Order 1 unit 1 Piece 1 Piece 1 Piece 1 Piece
      Payment Terms LC, T/T, D/P, PayPal, Western Union T/T, PayPal T/T, PayPal T/T, PayPal T/T, PayPal
      Quality Control
      Product Certification - - - - CE, RoHS, FCC, Kc
      Management System Certification - - - - -
      Trade Capacity
      Export Markets Europe, Southeast Asia/ Mideast, Australia, Domestic North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
      Annual Export Revenue - - - - -
      Business Model Own Brand, ODM, OEM - - - -
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Integrated Graphics: Integrated Graphics;
      Main Chipset: Intel;
      Maximum Memory Capacity: 8G;
      Structure: Rtx Module;
      Memory: DDR5;
      SATA Interface: SATA3.0;
      Printed Circuit Board: Double Layers;
      Main Board Structure: Integrated;
      Audio Effects: Not HiFi;
      with CPU: Yes;
      Chipset: Other;
      Fsb/Ht: 2400;
      Socket Typeo: Onboard CPU;
      CPU Type: Intel;
      Aunch Date: 2018;
      Hard Drive Interface: SATA;
      Item Condition: New;
      Memory Channel: Double;
      Products Status: New;
      Private Mold: Yes;
      Application: Server/Workstation;
      Integrated Graphics: Integrated Graphics;
      Main Chipset: Intel® H610/B660;
      Maximum Memory Capacity: 64G;
      Structure: Mini-ITX;
      Memory: Dual-Channel So-DIMM, DDR4 , Max 64GB;
      SATA Interface: 2*SATA3.0;
      CPU Socket: LGA1700;
      Printed Circuit Board: Six Layer;
      Main Board Structure: CPU Based;
      Audio Effects: HiFi;
      Processor: Intel® Alder Lake & Raptor Lake12th/13th Proce;
      RAM: 2*So-DIMM DDR4 3200MHz, Max64GB;
      Display1: Lvds/Edp(4K)+HDMI1+HDMI2+VGA/Dp, Three Display;
      Display2: Intel ® Core Graphics Card, 3-Display;
      LAN: 1*Realtek 8111h(Optionalintel I219lm);
      Interface: 2*USB3.2gen2(10gbps)+2*USB3.0 Gen1+ 4*USB2.0;
      Power Supply: DC19V;
      Storage1: 1*M.2 M Key (Default SATA, Optional Pcie3.0 X4);
      Storage2: 2*SATA3.0;
      Extension Slot1: 1*M.2 E Key (WiFi6/Cnvi)+1*M.2 E Key(Optiona);
      OS: Window10/Window11/Linux;
      Temp.: Working: 0~60℃; Storage: -20℃~75;
      Humidity: 0% ~ 95% Humidity, Non-Condensing;
      Integrated Graphics: Integrated Graphics;
      Main Chipset: Intel;
      Maximum Memory Capacity: 8G;
      Structure: Mini-ITX;
      Memory: DDR4 2400MHz;
      SATA Interface: SATA3.0;
      CPU Socket: Fcbga1090;
      Printed Circuit Board: Six Layer;
      Main Board Structure: CPU Based;
      Audio Effects: HiFi;
      Processor1: N4000/N5000;
      Processor2: Compatible with Intel Gemini Lake/Gemini Lake-R;
      RAM: Single Channels DDR4 2400MHz, Max.8g;
      Display1: Intel UHD Graphics 600;
      Display2: HDMI, VGA/Dp, Lvds/Edp, Triple Display;
      LAN: 1*Realtek Rtl8111h Gbe, Dual LAN Optional;
      Interface1: 6* USB, 6* COM(RS485, RS422 Optional));
      Power Supply: DC_12V Single Power Input;
      Audio: 1*Realtek Alc269, Whit Mic_in/HP_out and Amplifier;
      Storage: 1* SATA3.0, 1*M.2 Key M, M.2 2242/2280 SATA/Nvme;
      Extension Slot1: 1*M.2 Key B(M.2 3042/3052 4G/5g);
      Extension Slot2: 1*M.2 Key E(M.2 2230 WiFi+Bt);
      OS: Windows10/11/Linux;
      Temp.: Working:-10-60℃;Storage:-20-70℃;
      Working Humidity: 5%-95% Relative Humidity, No-Condensing;
      Integrated Graphics: Integrated Graphics;
      Main Chipset: Intel;
      Maximum Memory Capacity: 16G;
      Structure: Nano;
      Memory: Single-Channel 3200MHz DDR4;
      SATA Interface: SATA3.0;
      CPU Socket: Fcbga1264;
      Printed Circuit Board: Six Layer;
      Main Board Structure: CPU Based;
      Audio Effects: No;
      Processor1: Intel N100, Intel® Alder Lake Series CPU;
      RAM: 1*3200MHz DDR4,up to 16GB;
      Display1: Integraged Intel® UHD Graphics;
      Display2: 1*HDMI ,1*Dp,1*Type-C(Optional),1*HDMI2(Optional);
      LAN: 4* Intel I225 or I226 2.5g,Support Net Wake-up/Pxe;
      Interface: 5* USB,2* COM(1*RS485 Optional);
      Power Supply: DC12V;
      Storage: 1* SATA3.0,1*M.2 Key-M,1*Mini-Pcie;
      Extension Slot: 1 * Mini Pcie (4G ,WiFi);
      BIOS: 128MB Flash ROM;
      OS: Windows 10/Windows 11/Linux;
      Temp.: Working: -10~60℃; Storage: -20~70℃;
      Humidity: 0% ~ 95% Humidity, Non-Condensing;
      Integrated Graphics: Integrated Graphics;
      Main Chipset: Intel;
      Maximum Memory Capacity: 16G;
      Structure: Itx;
      Memory: 2*DDR4-2133;
      SATA Interface: SATA3.0;
      CPU Socket: Fcbga1528;
      Printed Circuit Board: Six Layer;
      Main Board Structure: Integrated;
      Audio Effects: HiFi;
      Processor1: Intel®core I5-8265u/I5-10210u;
      Processor2: Intel® Coffee Lake-U or Comet Lake-U;
      RAM: 2* DDR4-2133, up to 16GB;
      Power: DC12V ,1* 4pin ATX Interface;
      Ethernet Ports: 2*Realtek Gigabit Network,Wake-on-LAN/Pxe;
      Storage: 1* SATA3.0,1* M.2 2280/2242 Slot;
      System: Windows 8/Windows 10/Windows 11/Linux;
      Interface: 8*USB,6*RS232(2*RS485 Optional),1*Lpt;
      Extension Slot1: 1* Mini-Pcie Slot,Support WiFi/4G;
      Extension Slot2: 1* M.2 Slot ,Support WiFi/Bluetooth;
      Audio: Alc662/Alc888 6-Channel;
      Display: 1* VGA or Dp,1*HDMI,1*Lvds or Edp;
      Working Temp.: -10-60;
      Dimmension: 170mm X 170mm;
      Supplier Name

      Beijing Teket Innovation Technology Company Limited

      Gold Member Audited Supplier

      R&O Industrial Technology Co., Limited

      Diamond Member Audited Supplier

      R&O Industrial Technology Co., Limited

      Diamond Member Audited Supplier

      R&O Industrial Technology Co., Limited

      Diamond Member Audited Supplier

      R&O Industrial Technology Co., Limited

      Diamond Member Audited Supplier