• <thead id="gpwd1"></thead>

    <s id="gpwd1"></s>
    <cite id="gpwd1"><rp id="gpwd1"><form id="gpwd1"></form></rp></cite>
    <thead id="gpwd1"><rt id="gpwd1"><form id="gpwd1"></form></rt></thead>
    <blockquote id="gpwd1"></blockquote>

      撸啊撸激情久久,亚洲AV成人无码网天堂,久久久久久久,性爱综合网,91人人干,五月综合色,国产91无码精品综合,日日夜夜人人
      Android7.1/9.0 Operating System
      US$52.00-60.00 / Piece

      What is Rockchip Rk3399 Android Integrated Board

      About this Item
      Details
      Company Profile

      Price

      Purchase Qty. Reference FOB Price

      10-99 Pieces US$60.00

      100-999 Pieces US$58.00

      1,000+ Pieces US$52.00

      Sepcifications

      • Integrated Graphics Integrated Board
      • Main Chipset Rk
      • Maximum Memory Capacity 128g
      • Structure ATX
      • Memory DDR4
      • SATA Interface SATA3.0
      • CPU Socket Cortex-A55
      • Printed Circuit Board Eight Layers
      • Main Board Structure CPU Based
      • Audio Effects Not HiFi
      • Transport Package Tbd
      • Specification 120*75*12mm
      • Trademark PaneSeen
      • Origin China
      • Network Support RJ45
      • USB 6*USB-2.0, 1*USB-3.0, 1*Type-C
      • Serial Port 4*RS232, 2*Uart Ttl, 1*RS485(Optional)
      • Io Port 4*Io Port

      Product Description

      RK3399 Android integrated board, using the RK3399 six core 64 bit server level chip scheme. The CPU adopts big.LITTLE core architecture, using dual-core Cortex-A72 large core + quad-core Cortex-A53 small core structure; The frequency is up to 1.8GHz; Support for Google Android 7.1/9.0 operating ...

      Learn More

      Android7.1/9.0 Operating System Comparison
      Transaction Info
      Price US$52.00-60.00 / Piece US$66.00-200.00 / Piece US$72.00-230.00 / Piece US$75.00-217.00 / Piece US$75.00-217.00 / Piece
      Min Order 10 Pieces 5 Pieces 5 Pieces 5 Pieces 5 Pieces
      Payment Terms T/T, PayPal T/T, PayPal T/T, PayPal T/T, PayPal T/T, PayPal
      Quality Control
      Product Certification - - CE, RoHS, FCC, Kc CE, RoHS, FCC, Kc CE, RoHS, FCC, Kc
      Management System Certification - - - - -
      Trade Capacity
      Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
      Annual Export Revenue - - - - -
      Business Model - - - - -
      Average Lead Time Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Integrated Graphics: Integrated Board;
      Main Chipset: Rk;
      Maximum Memory Capacity: 128g;
      Structure: ATX;
      Memory: DDR4;
      SATA Interface: SATA3.0;
      CPU Socket: Cortex-A55;
      Printed Circuit Board: Eight Layers;
      Main Board Structure: CPU Based;
      Audio Effects: Not HiFi;
      Network: Support RJ45;
      USB: 6*USB-2.0, 1*USB-3.0, 1*Type-C;
      Serial Port: 4*RS232, 2*Uart Ttl, 1*RS485(Optional);
      Io Port: 4*Io Port;
      Integrated Graphics: Integrated Graphics;
      Main Chipset: Intel;
      Maximum Memory Capacity: 16G;
      Structure: Micro ATX;
      Memory: DDR3l;
      SATA Interface: SATA3.0;
      CPU Socket: LGA1155;
      Printed Circuit Board: Six Layer;
      Main Board Structure: Integrated;
      Audio Effects: HiFi;
      Processor: 2th/3th Gen Intel LGA1155 B75;
      RAM: 2* Soddr3,Support 1600/1333MHz Memory,up to 16GB;
      Display: 1*VGA+1*HDMI;
      LAN: 2*Rtl8111h;
      Chipset: B75;
      Pcie: 1;
      USB: 4*USB3.2gen1,12*USB2.0;
      Gpio: 8;
      Power: 24+4ATX;
      COM: 2*COM;
      Integrated Graphics: Integrated Graphics;
      Main Chipset: Intel;
      Maximum Memory Capacity: 128GB;
      Structure: ATX;
      Memory: 2*DDR4;
      SATA Interface: SATA3.0;
      CPU Socket: Standard;
      Printed Circuit Board: Six Layer;
      Main Board Structure: Integrated;
      Audio Effects: HiFi;
      Processor1: 6th/7th/8th/9th Intel® LGA11151 CPU;
      Chipset: B250;
      RAM: 2*DDR4 SODIMM,32GB;
      Power: 24+8 ATX;
      Ethernet Ports: 6*Intel I226-V 2.5g;
      Storage: 2* SATA3.0,1*Msata;
      USB3.2: 6;
      Extension Slot1: 1*Minipcle 1*Pclex16;
      Audio: Alc897;
      COM: 10;
      Display1: HDMI+VGA+Lvds;
      Temp.: Working:-10-60;Storage:-20-70;
      Dimmension: 180X180mm;
      Integrated Graphics: Integrated Graphics;
      Main Chipset: Intel;
      Maximum Memory Capacity: 128GB;
      Structure: ATX;
      Memory: 4*DDR4;
      SATA Interface: SATA3.0;
      CPU Socket: Standard;
      Printed Circuit Board: Six Layer;
      Main Board Structure: Integrated;
      Audio Effects: HiFi;
      Processor1: 6th/7th/8th/9th Intel® LGA11151 CPU;
      Chipset: B365;
      RAM: 4*DDR4 SODIMM,128GB;
      Power: 24+8 ATX;
      Ethernet Ports: 2*Intel I211-at;
      Storage: 5* SATA3.0,1*M.2;
      System: Windows 10/Windows 11/Linux;
      USB3.0: 6;
      Extension Slot1: 1mini Pcie; 1pcie X16;;
      Audio: Alc662;
      COM: 2;
      Display1: HDMI+VGA;
      Temp.: Working:-10-60;Storage:-20-70;
      Dimmension: 305mm * 245mm;
      Integrated Graphics: Integrated Graphics;
      Main Chipset: Intel;
      Maximum Memory Capacity: 128GB;
      Structure: ATX;
      Memory: 4*DDR4;
      SATA Interface: SATA3.0;
      CPU Socket: Standard;
      Printed Circuit Board: Six Layer;
      Main Board Structure: Integrated;
      Audio Effects: HiFi;
      Processor1: 6th/7th/8th/9th Intel® LGA11151 CPU;
      Chipset: B365;
      RAM: 4*DDR4 SODIMM,128GB;
      Power: 24+8 ATX;
      Ethernet Ports: 2*Intel I211-at;
      Storage: 5* SATA3.0,1*M.2;
      System: Windows 10/Windows 11/Linux;
      USB3.0: 6;
      Extension Slot1: 1mini Pcie; 1pcie X16;;
      Audio: Alc662;
      COM: 2;
      Display1: HDMI+VGA;
      Temp.: Working:-10-60;Storage:-20-70;
      Dimmension: 305mm * 245mm;
      Supplier Name

      Shenzhen Boxing World Technology Co., Ltd.

      Diamond Member Audited Supplier

      R&O Industrial Technology Co., Limited

      Diamond Member Audited Supplier

      R&O Industrial Technology Co., Limited

      Diamond Member Audited Supplier

      R&O Industrial Technology Co., Limited

      Diamond Member Audited Supplier

      R&O Industrial Technology Co., Limited

      Diamond Member Audited Supplier