| Specification |
Core Architecture: 32-Bit Arm Cortex-M3;
Frequency: 72MHz;
Flash Memory: 64kb;
RAM: 20kb;
Peripherals: Uart X3, Spi X2, I2c X2, USB, ADC X10, PWM X6, Gpi;
Operating Voltage: 2.0V - 3.6V;
Package: Lqfp-48;
Operating Temperature: -40°c ~ +85°c;
Applications: Industrial Control, Smart Home, Embedded Systems;
Certifications: RoHS, CE;
Supply Status: in Stock / Samples Available / OEM Orders Accepted;
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Conductive Type: Unipolar Integrated Circuit;
Integration: GSI;
Technics: Semiconductor IC;
shape: DIP;
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Conductive Type: Unipolar Integrated Circuit;
Integration: GSI;
Technics: Semiconductor IC;
Layer: 1-32 Layers;
Service: OEM/ODM;
OEM/ODM: Available;
Test: 100%E-Testing;
Layer Count: 1-20 Layers;
Shipping: DHL/UPS/FedEx/Air/Sea;
Surface Treatmen: OSP, Enig, HASL, AG Immersion;
Certificate Gurantee: Yes;
shape: DIP;
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Conductive Type: Bipolar Integrated Circuit;
Integration: SSI;
Technics: Thick Film IC;
Capacity: 1000000;
OEM/ODM: Available;
Sample: Available;
Surface Treatment: OSP, Enig, HASL, AG Immersion;
Certificate Gurantee: Yes;
Test: 100%E-Testing;
Min Bonding Pad Diameter: 10mil;
Min Thickness of Soldermask: 10um;
Color of Silk-Screen: White, Yellow, Black;
Data File Format: Gerber File and Drilling File, Protel Series, ...;
Material for PCB: Fr-4, High Tg Fr$, Halogen Free, Rogers, Cem-1, Ari;
Layer Count: 1-20 Layers;
Shipping: DHL/UPS/FedEx/Air/Sea;
shape: DIP;
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Conductive Type: Unipolar Integrated Circuit;
Integration: SSI;
Shape: DIP;
Technics: Semiconductor IC;
shape: DIP;
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