Esp32-S3 Core Board Development Board N8r2/N8r8/N16r8 Compatible with Devkitc-1

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Price

Min. Order Reference FOB Price

10 Pieces US$4.50-6.50 / Piece

Sepcifications

Type Combining Rigid Circuit Board
Dielectric SIC
Material Aluminum Covered Copper Foil Layer
Application Medical Instruments
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Copper
Insulation Materials Metal Composite Materials
Transport Package Bag
Specification 57*28mm
Trademark ESPRESSIF
Origin Cn
Item Core Development Board
Model Esp32-S3
Chip CH340K/CH343p
Format N8r2/N8r8/N16r8

Product Description

ESP32-S3 Core Board Compatible with DevKitC-1 ESP32-S3 Core Board ESP32-S3N8R2 ESP32-S3N8R8 ESP32-S3N16R8 This series is backward compatible in sequence. Module programs with small storage specifications can run directly on storage modules with higher specifications without modification. ...

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Sunhokey Electronics Co., Ltd.

Gold Member Since 2019

Audited Supplier

Rating & Reviews: 5.0/5.0

(6 Reviews)

Business Type Trading Company
Main Products Digital Voltmeter Ammeter, Oximeter Blood Oxygen Monitor, Communication Network, Raspberry ...
Year of Establishment 2016-04-15
Number of Employees 10
Management System Certification Others
Address Room 209, 2nd Floor, Building B, Xinxin Building, No. 109, Xingzheng Road, Huaqiangbei Street, Shenzhen, Guangdong, China

Esp32-S3 Comparison

	Esp32-S3 Core Board Development Board N8r2/N8r8/N16r8 Compatible with Devkitc-1 Contact Now	Quick View Multilayer PCB for Communication Devices Multilayer PCB for Automotive Electronics Contact Now	Quick View Advanced Multilayer PCB Technology Multilayer PCB for High - Density Wiring Contact Now	Quick View Durable Multilayer PCB Products Multilayer PCB with Good Signal Integrity Contact Now	Quick View Multilayer PCB for Communication Devices Multilayer PCB with Precise Lamination Contact Now

Transaction Info
	Esp32-S3 Core Board Development Board N8r2/N8r8/N16r8 Compatible with Devkitc-1 Contact Now	Quick View Multilayer PCB for Communication Devices Multilayer PCB for Automotive Electronics Contact Now	Quick View Advanced Multilayer PCB Technology Multilayer PCB for High - Density Wiring Contact Now	Quick View Durable Multilayer PCB Products Multilayer PCB with Good Signal Integrity Contact Now	Quick View Multilayer PCB for Communication Devices Multilayer PCB with Precise Lamination Contact Now
Price	US$4.50-6.50 / Piece	US$1.00-2.00 / Piece	US$1.00-2.00 / Piece	US$1.00-2.00 / Piece	US$1.00-2.00 / Piece
Min Order	10 Pieces	1 Piece	1 Piece	1 Piece	1 Piece
Payment Terms	LC, T/T, D/P, PayPal, Western Union, Small-amount payment	LC, T/T, D/P, Western Union, PayPal, Small-amount payment	LC, T/T, D/P, Western Union, PayPal, Small-amount payment	LC, T/T, D/P, Western Union, PayPal, Small-amount payment	LC, T/T, D/P, Western Union, PayPal, Small-amount payment
Quality Control
Management System Certification	Others	-	-	-	-
Trade Capacity
Export Markets	North America, Europe	Southeast Asia/ Mideast	Southeast Asia/ Mideast	Southeast Asia/ Mideast	Southeast Asia/ Mideast
Annual Export Revenue	-	-	-	-	-
Business Model	-	Own Brand	Own Brand	Own Brand	Own Brand
Average Lead Time	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Type: Combining Rigid Circuit Board; Dielectric: SIC; Material: Aluminum Covered Copper Foil Layer; Application: Medical Instruments; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Metal Composite Materials; Item: Core Development Board; Model: Esp32-S3; Chip: CH340K/CH343p; Format: N8r2/N8r8/N16r8;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Gold Plating Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Cry;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Gold Plating Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Cry;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Gold Plating Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Cry;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Gold Plating Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Cry;
Supplier Name	Sunhokey Electronics Co., Ltd.	Shenzhen Chengruyuan Technology Co., Ltd.	Shenzhen Chengruyuan Technology Co., Ltd.	Shenzhen Chengruyuan Technology Co., Ltd.	Shenzhen Chengruyuan Technology Co., Ltd.
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