| Specification |
Material: ABS/PP/PE/PC/PA/PVC;
Application: Medical, Household, Electronics, Automotive, Agricultural;
Performance: UV Resistance, Heat Resistance, Fire Resistance, G;
Color: Almost All Pms Colors Available.;
Mold Material: S136h, 718h, Nak80, P20, H13, etc.;
|
Material: ABS, PC/ABS, PP, PA, Glass Filled Plastics;
Application: Electronic Enclosures, Appliance Housings, Industr;
Processing_Method: Large Part Injection Molding;
Tolerance: ±0.05mm (Small Features), ±0.1mm (La;
Lead Time: 4-8 Weeks;
MOQ: 500 Pieces;
|
Material: Optical Grade PMMA, PC, Coc;
Application: Medical, Household, Electronics, Tonometers, Pressure Sensors, Optical Windows;
Processing_Method: Precision Injection Molding;
Tolerance: ±0.005mm;
Lead Time: 3-6 Weeks;
MOQ: 1000 Pieces;
Color: Natural;
|
Material: Peek;
Application: Semiconductor;
Name: Wafer Carriers;
Dimensional Tolerance Class: 0.05mm(ISO 20457-1 Class 3);
Minimum Wall Thickness: Peek: 0.15/Glass Fiber Reinforcement: 0.8;
Density: 1.30 G/Cm³;
Melting Temperature: 343ºC(ISO 11357);
Glass Transition Temperature: 143ºC(ISO 11357);
Tensile Strength: 100 MPa (Yield, 23 ºC/ISO 527);
Elongation at Break: 30%(23ºC);
Flexural Strength: 160 MPa(23ºC/ISO 178);
Notched Impact Strength: 6.5 Kj/M²(23ºC/ISO 180/a);
Continuous Use Temperature: 260 ºC (Long-Term);
|
Material: Peek;
Application: Semiconductor;
Name: Wafer Carriers;
Dimensional Tolerance Class: 0.05mm(ISO 20457-1 Class 3);
Minimum Wall Thickness: Peek: 0.15/Glass Fiber Reinforcement: 0.8;
Density: 1.30 G/Cm³;
Melting Temperature: 343ºC(ISO 11357);
Glass Transition Temperature: 143ºC(ISO 11357);
Tensile Strength: 100 MPa (Yield, 23 ºC/ISO 527);
Elongation at Break: 30%(23ºC);
Flexural Strength: 160 MPa(23ºC/ISO 178);
Notched Impact Strength: 6.5 Kj/M²(23ºC/ISO 180/a);
Continuous Use Temperature: 260 ºC (Long-Term);
|