| Specification |
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Type: Rigid Circuit Board;
Dielectric: FR-1;
Material: Paper Phenolic Copper Foil Substrate;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Metal Composite Materials;
Model: PCB;
Brand: Head Sun;
Machine No. 1: Hds Live 7;
Machine No. 2: Hds Live 9;
Machine No. 3: Hds Live 12;
Machine No. 4: Hds Live 16;
Machine No. 5: Hds Gen 2 Touch 7;
Machine No. 6: Hds Gen 3 Touch 12;
Machine No. 7: Hds Gen 3 Carbon 12;
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Type: Rigid Circuit Board;
Dielectric: M6 R-5775g;
Material: Low Dk Glass Cloth;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Panasonic;
Solder Mask: Black;
Layer Count: 4-Layer;
Application: Antenna;
Surface Finish: Immersion Gold;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Model: FR-4;
Brand: Exceeding;
Delivery: 24hours~5 Days;
Service: 7*24 Hours Online;
Price: Factory Price;
Keyword: Custom PCB;
Product Name: Rigid PCB;
MOQ: 1 PCS;
Min. Hole Size: 0.1mm(4mil) for HDI / 0.15mm(6mil);
Min. Line Width: 0.075mm(3mil);
Copper Thickness: 0.5-12oz(18-420um);
Min. Line Spacing: Min. Line Spacing;
Board Thickness: 0.2-6.0mm;
Surface Finishing: Immersion Silver, Tin, Gold /HASL Lead Free;
One-Stop Service: PCB Assembly, Component Supply;
Testing Service: 100% E-Testing;
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Type: Rigid Circuit Board;
Dielectric: CEM-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Hydrocarbon Resin;
Model: PCB;
Brand: Rogers;
Tihickness: 8mil, 10mil, 12mil, 20mil, 32mil and 60mil;
Soldermask Color: Blcak, Blue, Yellow, Red, Green...;
Copper Weight: 0.5oz, 1oz, 2oz;
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