Main Control Board Assembly

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Price

Min. Order Reference FOB Price

100 Pieces Negotiable

Sepcifications

Brand Smart Power
Transport Package Plywood Pallet
Origin China

Product Description

Built in 2008,Zhouju is a leading company with RD team and strong OEM, ODM ability in the filed of HVAC BLDC motor drivers control and other HVAC control systems, Located in Xianlin Science Technology Zone, Hangzhou City, Zhejiang Province, Nearby Xixi wetland Scenic. Our products ranges are air ...

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Hangzhou Zhouju Electronic Technological Co., Ltd.

Diamond Member Since 2022

Audited Supplier

Business Type Manufacturer/Factory & Trading Company
Main Products BLDC Motor Driver, Compressor for Air Conditioning, HVAC Motor and Accessories, HVAC, Fan ...
Year of Establishment 2010-07-05
Number of Employees 638
Management System Certification ISO9001:2015, ISO45001:2018, ISO14001
Address No. 32 Xianxing Road, Xianlin Town, Yuhang Zone, Hangzhou, Zhejiang, China

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Transaction Info
	Main Control Board Assembly Contact Now	Quick View Fr4 1.6mm PCB Fr4 94V0 PCBA Assembly Customized PCB Production Contact Now	Quick View Professional Embedded Industrial Control PCBA Custom Industrial PCB Motherboard Assembly Contact Now	Quick View OEM Electronics Manufacturing PCB Assembly LED Circuit Boards Assembly PCB Main Fabrication Contact Now	Quick View OEM Multilayer PCB Design Fabrication Gerber PCBA Assembly PCB Manufacturing Production Contact Now
Price	Negotiable	US$0.10-1.50 / Piece	US$0.10-1.50 / Piece	US$0.10-1.50 / Piece	US$0.10-1.50 / Piece
Min Order	100 Pieces	1 Piece	1 Piece	1 Piece	1 Piece
Payment Terms	T/T, LC	T/T	T/T	T/T	T/T
Quality Control
Management System Certification	ISO9001:2015, ISO45001:2018, ISO14001	-	-	-	-
Trade Capacity
Export Markets	South America, Europe, East Asia(Japan/ South Korea), Australia	North America, South America, Eastern Europe, Southeast Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	Own Brand, ODM, OEM	-	-	-	-
Average Lead Time	Peak Season Lead Time: one month Off Season Lead Time: one month	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Brand: Smart Power;	Type: Rigid Circuit Board; Flame Retardant Properties: V0; Dielectric: FR-4; Base Material: Copper; Insulation Materials: Organic Resin; Processing Technology: Electrolytic Foil; Application: Consumer Electronics; Mechanical Rigid: Rigid; Material: Paper Phenolic Copper Foil Substrate; Brand: Kevis; Layer: 1-64 Layers; Board Thickness: 0.2mm-7.0mm; Min. Line Width: 0.075mm/0.075mm(3mil/3mil); Min. Hole Size: 0.15mm; Surface Treatment: Flash Gold, Enig, Enepig, Gold Fingers Hard Gold; Solder Mask Color: Green, Blue, Yellow, White, Black;	Type: Rigid Circuit Board; Flame Retardant Properties: V0; Dielectric: FR-4; Base Material: Copper; Insulation Materials: Organic Resin; Processing Technology: Electrolytic Foil; Application: Consumer Electronics; Mechanical Rigid: Rigid; Material: Paper Phenolic Copper Foil Substrate; Brand: Kevis; Layer: 1-64 Layers; Board Thickness: 0.2mm-7.0mm; Min. Line Width: 0.075mm/0.075mm(3mil/3mil); Min. Hole Size: 0.15mm; Surface Treatment: Flash Gold, Enig, Enepig, Gold Fingers Hard Gold; Solder Mask Color: Green, Blue, Yellow, White, Black;	Type: Rigid Circuit Board; Flame Retardant Properties: V0; Dielectric: FR-4; Base Material: Copper; Insulation Materials: Organic Resin; Processing Technology: Electrolytic Foil; Application: Consumer Electronics; Mechanical Rigid: Rigid; Material: Paper Phenolic Copper Foil Substrate; Brand: Kevis; Layer: 1-64 Layers; Board Thickness: 0.2mm-7.0mm; Min. Line Width: 0.075mm/0.075mm(3mil/3mil); Min. Hole Size: 0.15mm; Surface Treatment: Flash Gold, Enig, Enepig, Gold Fingers Hard Gold; Solder Mask Color: Green, Blue, Yellow, White, Black;	Type: Rigid Circuit Board; Flame Retardant Properties: V0; Dielectric: FR-4; Base Material: Copper; Insulation Materials: Organic Resin; Processing Technology: Electrolytic Foil; Application: Consumer Electronics; Mechanical Rigid: Rigid; Material: Paper Phenolic Copper Foil Substrate; Brand: Kevis; Layer: 1-64 Layers; Board Thickness: 0.2mm-7.0mm; Min. Line Width: 0.075mm/0.075mm(3mil/3mil); Min. Hole Size: 0.15mm; Surface Treatment: Flash Gold, Enig, Enepig, Gold Fingers Hard Gold; Solder Mask Color: Green, Blue, Yellow, White, Black;
Supplier Name	Hangzhou Zhouju Electronic Technological Co., Ltd.	Guangzhou Kevis Electronic Technology Co., Ltd.	Guangzhou Kevis Electronic Technology Co., Ltd.	Guangzhou Kevis Electronic Technology Co., Ltd.	Guangzhou Kevis Electronic Technology Co., Ltd.
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