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      Education Laptop PCBA
      US$1.00-5.00 / pieces
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      What is Smart Electronics OEM Multi-Layer PCBA Clone PCB Reverse Engineering Printed Circuit Board Assembly Education Laptop PCBA

      About this Item
      Details
      Company Profile

      Price

      Purchase Qty. Reference FOB Price

      5-99 pieces US$5.00

      100-999 pieces US$1.80

      1,000+ pieces US$1.00

      Sepcifications

      • Metal Coating Gold
      • Mode of Production SMT
      • Layers Multilayer
      • Base Material FR-4
      • Certification RoHS, ISO, CE
      • Customized Customized
      • Condition New
      • Transport Package Carton
      • Specification Customized
      • Trademark Smart
      • Origin China
      • Layer 1-24 Layers
      • Material Fr-4, High Tg, Isola, Aluminum, Rogers, etc
      • PCB Type Rigid, Flexible, Rigid-Flexible
      • Surface Finish HASL, Lf HASL, Imm Gold, Imm Silver, OSP etc
      • Solder Mask Green, Red, White, Yellow, Blue, Black, Orange etc
      • Min Linewidth/Linespacing 0.075mm
      • Min Hole Diameter 0.15mm
      • Min Solder Resist Bridge 0.1mm
      • Finished Thickness 0.2-4mm
      • Mounting Component Pitch 0.15mm

      Product Description

      Products Description PCB Capacities and Technical Specification Order Quantity 1-500,000 Layer 1, 2, 4, 6, up to 24 layer Material FR-4, High Tg, Isola, Aluminum, Rogers, etc PCB type Rigid, flexible, rigid-flexible Shape Rectangular, round, slots, cutouts, complex, irregular Max PCB ...

      Learn More

      Education Laptop PCBA Comparison
      Transaction Info
      Price US$1.00-5.00 / pieces US$1.88-18.88 / Piece US$1.88-18.88 / Piece US$1.88-18.88 / Piece US$1.88-18.88 / Piece
      Min Order 5 pieces 5 Pieces 5 Pieces 5 Pieces 5 Pieces
      Payment Terms T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram
      Quality Control
      Product Certification RoHS, ISO, CE RoHS, CCC, ISO RoHS, CCC, ISO RoHS, CCC, ISO RoHS, CCC, ISO
      Management System Certification - - - - -
      Trade Capacity
      Export Markets North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
      Annual Export Revenue - - - - -
      Business Model Own Brand, ODM, OEM - - - -
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Metal Coating: Gold;
      Mode of Production: SMT;
      Layers: Multilayer;
      Base Material: FR-4;
      Customized: Customized;
      Condition: New;
      Layer: 1-24 Layers;
      Material: Fr-4, High Tg, Isola, Aluminum, Rogers, etc;
      PCB Type: Rigid, Flexible, Rigid-Flexible;
      Surface Finish: HASL, Lf HASL, Imm Gold, Imm Silver, OSP etc;
      Solder Mask: Green, Red, White, Yellow, Blue, Black, Orange etc;
      Min Linewidth/Linespacing: 0.075mm;
      Min Hole Diameter: 0.15mm;
      Min Solder Resist Bridge: 0.1mm;
      Finished Thickness: 0.2-4mm;
      Mounting Component Pitch: 0.15mm;
      Metal Coating: Copper;
      Mode of Production: SMT;
      Layers: Multilayer;
      Base Material: FR-4;
      Customized: Customized;
      Condition: Used;
      PCBA-Testing: X-ray, Aoi;
      Type: Rigid Circuit Board;
      Processing Technology: Electrolytic Foil;
      Insulation Materials: Organic Resin;
      Flame Retardant Properties: V0;
      Metal Coating: Copper;
      Mode of Production: SMT;
      Layers: Multilayer;
      Base Material: FR-4;
      Customized: Customized;
      Condition: Used;
      PCBA-Testing: X-ray, Aoi;
      Type: Rigid Circuit Board;
      Processing Technology: Electrolytic Foil;
      Insulation Materials: Organic Resin;
      Flame Retardant Properties: V0;
      Metal Coating: Copper;
      Mode of Production: SMT;
      Layers: Multilayer;
      Base Material: FR-4;
      Customized: Customized;
      Condition: Used;
      PCBA-Testing: X-ray, Aoi;
      Type: Rigid Circuit Board;
      Processing Technology: Electrolytic Foil;
      Insulation Materials: Organic Resin;
      Flame Retardant Properties: V0;
      Metal Coating: Copper;
      Mode of Production: SMT;
      Layers: Multilayer;
      Base Material: FR-4;
      Customized: Customized;
      Condition: Used;
      PCBA-Testing: X-ray, Aoi;
      Type: Rigid Circuit Board;
      Processing Technology: Electrolytic Foil;
      Insulation Materials: Organic Resin;
      Flame Retardant Properties: V0;
      Supplier Name

      Shenzhen Smart Electronics Co., Ltd

      Diamond Member Audited Supplier

      Shenzhen Zhendatech Co., Ltd.

      Gold Member Audited Supplier

      Shenzhen Zhendatech Co., Ltd.

      Gold Member Audited Supplier

      Shenzhen Zhendatech Co., Ltd.

      Gold Member Audited Supplier

      Shenzhen Zhendatech Co., Ltd.

      Gold Member Audited Supplier

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