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      Power Bank PCB
      US$0.35 / Piece
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      About this Item
      Details
      Company Profile

      Price

      Min. Order Reference FOB Price

      5 Pieces US$0.35 / Piece

      Sepcifications

      • Type Rigid Circuit Board
      • Dielectric FR-4
      • Material Fiberglass Epoxy
      • Application Consumer Electronics
      • Flame Retardant Properties V0
      • Mechanical Rigid Rigid
      • Processing Technology Electrolytic Foil
      • Base Material Fr-4,Fr-1,Cem-1,Cem-3,Fr-4 Halogen Free
      • Insulation Materials Organic Resin
      • Brand Smart
      • Transport Package Carton
      • Specification custom
      • Trademark Smart
      • Origin Guangdong, China
      • Product Name Printed Circuit Board
      • Supplier Type Manufacturer
      • PCB Type Rigid, Flexible, Rigid-Flexible
      • Layer 1-24 Layers
      • Functional Application PCBA
      • Copper Thickness 1oz or Custom
      • Surface Finish HASL, Lf HASL, Imm Gold, Imm Silver, OSP etc
      • Solder Mask Green, Red, White, Yellow, Blue, Black, Orange etc
      • Min Linewidth/Linespacing 0.075mm
      • Min Hole Diameter 0.15mm
      • Min Solder Resist Bridge 0.1mm
      • Board Thickness 0.2-4mm
      • Mounting Component Pitch 0.15mm

      Product Description

      Products Description Smart Electronics Professional Prototype PCB Board Manufacturer HASL Fr4 High Frequency Custom Circuit Boards PCB Assembly Service Product Name Custom Electronic Printed Circuit Board PCB Assembly Services OEM Other Multilayer PCB PCBA Manufacture Our Service Electronic ...

      Learn More

      Power Bank PCB Comparison
      Transaction Info
      Price US$0.35 / Piece US$0.30-13.00 / Piece US$0.02-12.00 / Piece US$0.02-10.00 / Piece US$0.01-10.00 / Piece
      Min Order 5 Pieces 1 Piece 1 Piece 1 Piece 1 Piece
      Payment Terms T/T, D/P, PayPal, Western Union, Small-amount payment T/T, PayPal, Western Union T/T, PayPal, Western Union T/T, PayPal, Western Union T/T, PayPal, Western Union
      Quality Control
      Management System Certification - - - - -
      Trade Capacity
      Export Markets North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia
      Annual Export Revenue - - - - -
      Business Model Own Brand, ODM, OEM ODM, OEM ODM, OEM ODM, OEM ODM, OEM
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Fr-4,Fr-1,Cem-1,Cem-3,Fr-4 Halogen Free;
      Insulation Materials: Organic Resin;
      Brand: Smart;
      Product Name: Printed Circuit Board;
      Supplier Type: Manufacturer;
      PCB Type: Rigid, Flexible, Rigid-Flexible;
      Layer: 1-24 Layers;
      Functional Application: PCBA;
      Copper Thickness: 1oz or Custom;
      Surface Finish: HASL, Lf HASL, Imm Gold, Imm Silver, OSP etc;
      Solder Mask: Green, Red, White, Yellow, Blue, Black, Orange etc;
      Min Linewidth/Linespacing: 0.075mm;
      Min Hole Diameter: 0.15mm;
      Min Solder Resist Bridge: 0.1mm;
      Board Thickness: 0.2-4mm;
      Mounting Component Pitch: 0.15mm;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Complex;
      Application: Communication;
      Flame Retardant Properties: V2;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Brand: New Chip;
      Layer: 1-32 Layers;
      Service: OEM/ODM;
      OEM/ODM: Available;
      Test: 100%E-Testing;
      Shipping: DHL/UPS/FedEx/Air/Sea;
      Surface Treatmen: OSP, Enig, HASL, AG Immersion;
      Certificate Gurantee: Yes;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy Resin + Polyimide Resin;
      Application: Communication;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Metal Composite Materials;
      Brand: New Chip;
      Soldermask Color: Green;
      Sample: Available;
      OEM/ODM: Available;
      Certificate Gurantee: Yes;
      Test: 100%E-Testing;
      Color of Silk Screen: Green, Purple, Black;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy Resin + Polyimide Resin;
      Application: Consumer Electronics;
      Flame Retardant Properties: V2;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Brand: New Chip;
      Capacity: 1000000;
      OEM/ODM: Available;
      Sample: Available;
      Surface Treatment: OSP, Enig, HASL, AG Immersion;
      Certificate Gurantee: Yes;
      Test: 100%E-Testing;
      Min Bonding Pad Diameter: 10mil;
      Min Thickness of Soldermask: 10um;
      Color of Silk-Screen: White, Yellow, Black;
      Data File Format: Gerber File and Drilling File, Protel Series,...;
      Material for PCB: Fr-4, High Tg Fr$, Halogen Free,Rogers, Cem-1, Ari;
      Layer Count: 1-20 Layers;
      Shipping: DHL/UPS/FedEx/Air/Sea;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy Resin + Polyimide Resin;
      Application: Consumer Electronics;
      Flame Retardant Properties: V2;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Brand: New Chip;
      Capacity: 1000000;
      OEM/ODM: Available;
      Sample: Available;
      Surface Treatment: OSP, Enig, HASL, AG Immersion;
      Certificate Gurantee: Yes;
      Test: 100%E-Testing;
      Min Bonding Pad Diameter: 10mil;
      Min Thickness of Soldermask: 10um;
      Color of Silk-Screen: White, Yellow, Black;
      Data File Format: Gerber File and Drilling File, Protel Series,...;
      Material for PCB: Fr-4, High Tg Fr$, Halogen Free,Rogers, Cem-1, Ari;
      Layer Count: 1-20 Layers;
      Shipping: DHL/UPS/FedEx/Air/Sea;
      Supplier Name

      Shenzhen Smart Electronics Co., Ltd

      Diamond Member Audited Supplier

      Shenzhen New Chip international Ltd

      Gold Member Audited Supplier

      Shenzhen New Chip international Ltd

      Gold Member Audited Supplier

      Shenzhen New Chip international Ltd

      Gold Member Audited Supplier

      Shenzhen New Chip international Ltd

      Gold Member Audited Supplier