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      PCBA Copy Service
      US$1.00-5.00 / pieces
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      What is Smart Electronics Shenzhen Custom Multilayer PCB Prototype Board Printer Circuit PCB Manufacturer PCBA Copy Service

      About this Item
      Details
      Company Profile

      Price

      Purchase Qty. Reference FOB Price

      5-499 pieces US$5.00

      500+ pieces US$1.00

      Sepcifications

      • Metal Coating Gold
      • Mode of Production SMT
      • Layers Multilayer
      • Base Material Fr4,Tg
      • Certification RoHS, ISO, CE
      • Customized Customized
      • Condition New
      • Transport Package Carton
      • Specification custom
      • Trademark Smart
      • Origin Guangdong, China
      • Copper Thickness 0.5-6.0oz
      • Min.Hole Size 0.1mm
      • Solder Mask Green, Red, Blue, Yellow, Black, White etc
      • Min.Line Spacing 0.075mm
      • Min. Line Width 0.15mm
      • Supplier Type Manufacturer
      • Type Smart Electronics PCBA
      • Board Thickness 0.2-4.0mm
      • Surface Finishing HASL, Lead Free

      Product Description

      Products Description Product Name Custom Electronic Printed Circuit Board PCB Assembly Services OEM Other Multilayer PCB PCBA Manufacture Our Service Electronic Engineering; PCB Manufacturing; Turnkey PCBA; PCB Clone; SMT; Component Sourcing; PCB Assembly; Plugin Assembly; Packing Ect. Main ...

      Learn More

      PCBA Copy Service Comparison
      Transaction Info
      Price US$1.00-5.00 / pieces US$2.00 / Piece US$2.00 / Piece US$2.00 / Piece US$2.00 / Piece
      Min Order 5 pieces 1 Piece 1 Piece 1 Piece 1 Piece
      Payment Terms T/T, D/P, PayPal, Western Union, Small-amount payment T/T, PayPal, Western Union, Small-amount payment T/T, PayPal, Western Union, Small-amount payment T/T, PayPal, Western Union, Small-amount payment T/T, PayPal, Western Union, Small-amount payment
      Quality Control
      Product Certification RoHS, ISO, CE RoHS, ISO RoHS, ISO RoHS, ISO RoHS, ISO
      Management System Certification - - - - -
      Trade Capacity
      Export Markets North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe
      Annual Export Revenue - - - - -
      Business Model Own Brand, ODM, OEM - - - -
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Metal Coating: Gold;
      Mode of Production: SMT;
      Layers: Multilayer;
      Base Material: Fr4,Tg;
      Customized: Customized;
      Condition: New;
      Copper Thickness: 0.5-6.0oz;
      Min.Hole Size: 0.1mm;
      Solder Mask: Green, Red, Blue, Yellow, Black, White etc;
      Min.Line Spacing: 0.075mm;
      Min. Line Width: 0.15mm;
      Supplier Type: Manufacturer;
      Type: Smart Electronics PCBA;
      Board Thickness: 0.2-4.0mm;
      Surface Finishing: HASL, Lead Free;
      Metal Coating: Copper;
      Mode of Production: DIP;
      Layers: Double-Layer;
      Base Material: Fr4, FR-4;
      Customized: Customized;
      Condition: New;
      Type: Rigid Circuit Board;
      Dielectric: Fr-4;
      Material: Fiberglass Epoxy;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Insulation Materials: Epoxy Resin;
      Processing Technology: Immersion Gold;
      Copper Thickness: 3oz -105oz;
      Surface Finish: Gold Finger;
      Special Technology: Metal Edging;
      Special 1: Blind Hole;
      Special 2: Buried Vias;
      Special 3: Flex-Rigid PCB;
      Surface Finish 1: Immersion Gold Immersion Tin Hal Lead Free;
      Metal Coating: Gold;
      Mode of Production: SMT;
      Layers: Multilayer;
      Base Material: Fr4, FR-4;
      Customized: Customized;
      Condition: New;
      Type: Rigid Circuit Board;
      Dielectric: Fr-4;
      Material: Fiberglass Epoxy;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Insulation Materials: Epoxy Resin;
      Processing Technology: Immersion Gold;
      Copper Thickness: 3oz -105oz;
      Surface Finish: Gold Finger;
      Special Technology: Metal Edging;
      Special 1: Blind Hole;
      Special 2: Buried Vias;
      Special 3: Flex-Rigid PCB;
      Surface Finish 1: Immersion Gold Immersion Tin Hal Lead Free;
      Metal Coating: Copper;
      Mode of Production: DIP;
      Layers: Double-Layer;
      Base Material: Fr4, FR-4;
      Customized: Customized;
      Condition: New;
      Type: Rigid Circuit Board;
      Dielectric: Fr-4;
      Material: Fiberglass Epoxy;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Insulation Materials: Epoxy Resin;
      Processing Technology: Immersion Gold;
      Copper Thickness: 3oz -105oz;
      Surface Finish: Gold Finger;
      Special Technology: Metal Edging;
      Special 1: Blind Hole;
      Special 2: Buried Vias;
      Special 3: Flex-Rigid PCB;
      Surface Finish 1: Immersion Gold Immersion Tin Hal Lead Free;
      Metal Coating: Gold;
      Mode of Production: SMT;
      Layers: Multilayer;
      Base Material: Fr4, FR-4;
      Customized: Customized;
      Condition: New;
      Type: Rigid Circuit Board;
      Dielectric: Fr-4;
      Material: Fiberglass Epoxy;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Insulation Materials: Epoxy Resin;
      Processing Technology: Immersion Gold;
      Copper Thickness: 3oz -105oz;
      Surface Finish: Gold Finger;
      Special Technology: Metal Edging;
      Special 1: Blind Hole;
      Special 2: Buried Vias;
      Special 3: Flex-Rigid PCB;
      Surface Finish 1: Immersion Gold Immersion Tin Hal Lead Free;
      Supplier Name

      Shenzhen Smart Electronics Co., Ltd

      Diamond Member Audited Supplier

      Shenzhen Hemeixin Electronic Co., Limited

      Gold Member Audited Supplier

      Shenzhen Hemeixin Electronic Co., Limited

      Gold Member Audited Supplier

      Shenzhen Hemeixin Electronic Co., Limited

      Gold Member Audited Supplier

      Shenzhen Hemeixin Electronic Co., Limited

      Gold Member Audited Supplier

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