| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr-4,Fr-1,Cem-1,Cem-3,Fr-4 Halogen Free;
Insulation Materials: Organic Resin;
Brand: Smart;
Product Name: Printed Circuit Board;
Supplier Type: Manufacturer;
PCB Type: Rigid, Flexible, Rigid-Flexible;
Layer: 1-24 Layers;
Functional Application: PCBA;
Copper Thickness: 1oz or Custom;
Surface Finish: HASL, Lf HASL, Imm Gold, Imm Silver, OSP etc;
Solder Mask: Green, Red, White, Yellow, Blue, Black, Orange etc;
Min Linewidth/Linespacing: 0.075mm;
Min Hole Diameter: 0.15mm;
Min Solder Resist Bridge: 0.1mm;
Board Thickness: 0.2-4mm;
Mounting Component Pitch: 0.15mm;
|
Type: Rigid Circuit Board;
Dielectric: CEM-3;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: New Chip;
Soldermask Color: Green, Yellow, Blue, Black, White...;
Sample: Available;
OEM/ODM: Available;
Certificate Gurantee: Yes;
Test: 100%E-Testing;
Color of Silk Screen: Green, Purple, Black;
Service: OEM / Dfm;
|
Type: Flexible Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Layers: 2 Layers;
Thickness: 1.6mm;
Solder Mask: Amber;
Legend: Write;
Surface Finish: HASL;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Application: Medical Instruments;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Mu Star;
Color: Customized;
Testing Service: Aoi/ X-ray/ Fai;
Board Thickness: 1.6mm;
Number of Layers: 1-58 Layers;
|
Material: Fr-4, Cem-1/Cem-3, Pi,High Tg,Rogers;
Board Layer: 10L;
Surface Finihsing: Immersion Gold;
Lead Time: 6-8 Working Days;
Board Thickness: 0.1mm-7.0mm;
Max Panel Size: 32"×48"(800mm×1200mm);
Min Hole Size: 0.075mm;
Min Line Width: 3mil(0.075mm);
Copper Thickness: 0.5-7.0oz;
Soldermask: Green/Yellow/Black/White/Red/Blue;
Silkscreen: Red/Yellow/Black/White;
Min Pad: 5mil(0.13mm);
Material Suppilers: Shengyi, Kb, Nanya, Iteq,etc.;
|