| Specification |
Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: Fr-4fr-1.Cem-1,Cem-3fr-4 Halogen Free;
Customized: Customized;
Condition: New;
Color: Green, Yellow, Black, White, Red, Blue;
Copper Thickness: 1oz;
Min.Hole Size: 0.1mm;
Min.Line Spacing: 0.075mm;
Min. Line Width: 0.15mm;
Supplier Type: Manufacturer;
Type: Motherboard PCBA;
Functional Application: Smart Electronics;
Application: Consumer Electronics;
Board Thickness: 0.2mm-4mm;
Surface Finishing: HASL, Lead Free HASL;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
Insulation Materials: Organic Resin;
Functional Testing: Spi, X-ray, Aoi, Ict, Fct, RoHS and Aging;
Processing Technology: Electrolytic Foil;
Type: Rigid PCB;
PCBA Min.IC Pitch: 0.30mm(12mil);
BGA Minimum Dia: 01015;
PCBA Foot Pin: So, Sop, Soj, Tsop, Tssop, Qfp, BGA and U-BGA;
Small Order: Acceptable;
IP Protection: Strong Believe in IP Protection with Proven Record;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
Insulation Materials: Organic Resin;
Functional Testing: Spi, X-ray, Aoi, Ict, Fct, RoHS and Aging;
Processing Technology: Electrolytic Foil;
Type: Rigid PCB;
PCBA Min.IC Pitch: 0.30mm(12mil);
BGA Minimum Dia: 01015;
PCBA Foot Pin: So, Sop, Soj, Tsop, Tssop, Qfp, BGA and U-BGA;
Small Order: Acceptable;
IP Protection: Strong Believe in IP Protection with Proven Record;
|
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
Insulation Materials: Organic Resin;
Functional Testing: Spi, X-ray, Aoi, Ict, Fct, RoHS and Aging;
Processing Technology: Electrolytic Foil;
Type: Rigid PCB;
PCBA Min.IC Pitch: 0.30mm(12mil);
BGA Minimum Dia: 01015;
PCBA Foot Pin: So, Sop, Soj, Tsop, Tssop, Qfp, BGA and U-BGA;
Small Order: Acceptable;
IP Protection: Strong Believe in IP Protection with Proven Record;
|
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
Functional Testing: Spi, X-ray, Aoi, Ict, Fct, RoHS and Aging;
Type: Rigid Circuit Board;
PCBA Min. IC Pitch: 0.30mm(12mil);
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
BGA Minimum Dia: 01015;
PCBA Foot Pin: So, Sop, Soj, Tsop, Tssop, Qfp, BGA and U-BGA;
Small Order: Acceptable;
IP Protection: Strong Believe in IP Protection with Proven Record;
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