| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr-4,Fr-1,Cem-1,Cem-3,Fr-4 Halogen Free;
Insulation Materials: Organic Resin;
Brand: Smart;
Product Name: Printed Circuit Board;
Supplier Type: Manufacturer;
PCB Type: Rigid, Flexible, Rigid-Flexible;
Layer: 1-24 Layers;
Functional Application: PCBA;
Copper Thickness: 1oz or Custom;
Surface Finish: HASL, Lf HASL, Imm Gold, Imm Silver, OSP etc;
Solder Mask: Green, Red, White, Yellow, Blue, Black, Orange etc;
Min Linewidth/Linespacing: 0.075mm;
Min Hole Diameter: 0.15mm;
Min Solder Resist Bridge: 0.1mm;
Board Thickness: 0.2-4mm;
Mounting Component Pitch: 0.15mm;
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Type: Flexible Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Industry Control;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Yizexin;
Color: According to Your Design;
Feature: Enclosed and Waterproof;
Insulation Ink Voltage: 100VDC;
Custom Made: OEM/Customize;
Conductive Ink: Screen Printing Silver Ink, Carbon Ink;
Pattern of Payment: L/C, T/T, Dp, Western Union, Paypal, Money Gram;
Package: Inner; Vacuum Packing; Dry Packing out Packing;
Back Adhesive: 3m9449 3m467 3m468 3m200;
Transportation: by Ship/by Air/by Land;
|
Type: Flexible Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Industry Control;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Yizexin;
Color: According to Your Design;
Feature: Enclosed and Waterproof;
Insulation Ink Voltage: 100VDC;
Custom Made: OEM/Customize;
Conductive Ink: Screen Printing Silver Ink, Carbon Ink;
Pattern of Payment: L/C, T/T, Dp, Western Union, Paypal, Money Gram;
Package: Inner; Vacuum Packing; Dry Packing out Packing;
Back Adhesive: 3m9449 3m467 3m468 3m200;
Transportation: by Ship/by Air/by Land;
|
Type: Flexible Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Industry Control;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Yizexin;
Color: According to Your Design;
Feature: Enclosed and Waterproof;
Insulation Ink Voltage: 100VDC;
Custom Made: OEM/Customize;
Conductive Ink: Screen Printing Silver Ink, Carbon Ink;
Pattern of Payment: L/C, T/T, Dp, Western Union, Paypal, Money Gram;
Package: Inner; Vacuum Packing; Dry Packing out Packing;
Back Adhesive: 3m9449 3m467 3m468 3m200;
Transportation: by Ship/by Air/by Land;
|
Type: Flexible Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Industry Control;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Yizexin;
Color: According to Your Design;
Feature: Enclosed and Waterproof;
Insulation Ink Voltage: 100VDC;
Custom Made: OEM/Customize;
Conductive Ink: Screen Printing Silver Ink, Carbon Ink;
Pattern of Payment: L/C, T/T, Dp, Western Union, Paypal, Money Gram;
Package: Inner; Vacuum Packing; Dry Packing out Packing;
Back Adhesive: 3m9449 3m467 3m468 3m200;
Transportation: by Ship/by Air/by Land;
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