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      Electronics
      US$70.00-75.00 / Piece
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      What is Customized ODM/OEM Multi-Layer Electronics PCB Assembly Board

      About this Item
      Details
      Company Profile

      Price

      Purchase Qty. Reference FOB Price

      1,000-1,999 Pieces US$75.00

      2,000-4,999 Pieces US$73.00

      5,000+ Pieces US$70.00

      Sepcifications

      • Metal Coating Tin
      • Mode of Production DIP
      • Layers Single-Layer
      • Base Material FR-4
      • Certification CCC
      • Customized Customized
      • Condition New
      • Transport Package Neutral Packing
      • Specification depend on size
      • Trademark OEM/ODM
      • Origin China

      Product Description

      Product Description Product details: Model:TC-fireplace03 Technology Sepcifications: Operating Voltage:100V-240V 50HZ Load Power:=<2000w Bluetooth Range:30m Operating Temperature:-20ºC~60ºC Size:120*70*19(mm) Weight:117(g) Touch screen control functions: 1.Timing ...

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      Electronics Comparison
      Transaction Info
      Price US$70.00-75.00 / Piece US$0.10-50.00 / piece US$1.00-99.00 / Piece US$0.01 / Piece US$5.20-5.50 / Piece
      Min Order 1,000 Pieces 1 piece 1 Piece 1 Piece 1,000 Pieces
      Payment Terms T/T, PayPal, Western Union, Money Gram LC, T/T, PayPal, Western Union T/T T/T, PayPal, Western Union, Small-amount payment LC, D/P, T/T, PayPal, Western Union, Small-amount payment
      Quality Control
      Product Certification CCC RoHS, ISO RoHS, ISO, ISO13485 & IATF16949 & ISO9001 RoHS, CCC, ISO RoHS, CCC, ISO
      Management System Certification - - - - ISO9001:2015
      Trade Capacity
      Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Western Europe, Eastern Asia, Southeast Asia North America, Europe, East Asia(Japan/ South Korea), Australia, Domestic, Sout Asia
      Annual Export Revenue - - - - -
      Business Model - - - - ODM
      Average Lead Time Peak Season Lead Time: 1-3 months
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: one month
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: one month
      Product Attributes
      Specification
      Metal Coating: Tin;
      Mode of Production: DIP;
      Layers: Single-Layer;
      Base Material: FR-4;
      Customized: Customized;
      Condition: New;
      Metal Coating: Gold;
      Mode of Production: SMT;
      Layers: Multilayer;
      Base Material: FR-4;
      Customized: Customized;
      Condition: New;
      Combination Mode: Adhesive Flexible Plate;
      Conductive Adhesive: Conductive Silver Paste;
      Metal Coating: Tin;
      Mode of Production: SMT&DIP;
      Layers: Multilayer;
      Base Material: FR-4;
      Customized: Customized;
      Condition: Used;
      BGA Minimum Dia: 01005;
      PCBA Min. IC Pitch: 0.30mm(12mil);
      PCB Layer: Max 64 Layers;
      PCBA Foot Pin: So, Sop, Soj, Tsop, Tssop, Qfp, BGA and U-BGA;
      Function Testing: Spi , Aoi , Ict, Fct , X-ray ,RoHS and Aging;
      IP Protection: Strong Believe in IP Protection with Proven Record;
      Turkey Service: Turkey Sourcing ,Procurement and Material Manageme;
      Metal Coating: Enig / HASL / OSP / Silver etc.;
      Mode of Production: SMT / DIP / Customized;
      Layers: From 2 Layers to 50 Layers;
      Base Material: Fr4/ High Tg Fr4/ Metal Core / Cem;
      Customized: Customized;
      Condition: New;
      Solder Mask Color: Green,Blue,Yellow,White,Black,Red;
      Special Process: Buried Hole, Blind Hole, Partial High Density, Bac;
      Copper Thickness: 1/2oz,1oz,2oz,3oz,4oz,5oz-10 Oz;
      Layer Count: 1-50 Layers;
      Quality Standard: Ipc Class 2 and Ipc Class 3;
      Metal Coating: Gold;
      Mode of Production: SMT;
      Layers: Double-Layer;
      Base Material: FR-4;
      Customized: Customized;
      Condition: New;
      Minimum Linespacing: 0.075mm;
      Minimum Solder Resist Bridge: 0.1mm;
      Minimum Linewidth: 0.075mm;
      Minimum Hole Diameter: 0.15mm;
      Finished Thickness: 0.3-3.5mm;
      Accuracy of Printing Solder Paste: 0.025mm;
      Supplier Name

      Shenzhen XinYingxin Electronics Technology Co., Ltd.

      Gold Member Audited Supplier

      Abis Circuits Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Grandtop Electronics Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Core Hecheng Electronic Technology Co., Ltd.

      Diamond Member Audited Supplier

      Dongguan Access Star Co., Ltd.

      Gold Member Audited Supplier