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      Bask Version Machine
      US$799.00-899.00 / Piece
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      What is Automatic Plate Making Machine

      About this Item
      Details
      Company Profile

      Price

      Purchase Qty. Reference FOB Price

      5-49 Pieces US$899.00

      50+ Pieces US$799.00

      Sepcifications

      • Usage Nano Science Technology
      • Type Plate Exposure
      • Page Single Face
      • Automatic Grade Automatic
      • Product Type Chemicals
      • Proximity Exposure Vacuum Contact
      • Feature Size 2um
      • Transport Package Carton and Pallet
      • Specification 2300*1400*1300mm
      • Trademark SHMECO
      • Origin China
      • Exposing Area(mm) 1000*800/1150*950/1350*1100**mm2
      • Light Source 2-3kw
      • Vacuum System High Speed Dual-Loop Vacuum-Exhausting System
      • Exposure Uniformity 97%
      • Exposure Major Exposure and Second Exposure
      • Power Supply 220V/380V50hzv
      • Electric Phase 1pH/3pH
      • Net Weight (Kg) 300
      • Deliver Time 1month

      Product Description

      Specifications 1) Solid and environment-friendly full-cover metal machine frame 2) Three drawers for stores and standby plates Function A contact exposure frame, or printing down frame, or plate exposure is contact imaging device used for making the printing plates. The pressure, both ...

      Learn More

      Bask Version Machine Comparison
      Transaction Info
      Price US$799.00-899.00 / Piece US$300,000.00-1,000,000.00 / Piece US$300,000.00-1,000,000.00 / Piece US$300,000.00-1,000,000.00 / Piece US$160.00 / Piece
      Min Order 5 Pieces 1 Piece 1 Piece 1 Piece 1 Piece
      Payment Terms - LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, D/P
      Quality Control
      Management System Certification - - - - -
      Trade Capacity
      Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
      Annual Export Revenue - - - - -
      Business Model Own Brand, ODM, OEM - - - -
      Average Lead Time Peak Season Lead Time: 3-6 months
      Off Season Lead Time: 1-3 months
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Usage: Nano Science Technology;
      Type: Plate Exposure;
      Page: Single Face;
      Automatic Grade: Automatic;
      Product Type: Chemicals;
      Proximity Exposure: Vacuum Contact;
      Feature Size: 2um;
      Exposing Area(mm): 1000*800/1150*950/1350*1100**mm2;
      Light Source: 2-3kw;
      Vacuum System: High Speed Dual-Loop Vacuum-Exhausting System;
      Exposure Uniformity: 97%;
      Exposure: Major Exposure and Second Exposure;
      Power Supply: 220V/380V50hzv;
      Electric Phase: 1pH/3pH;
      Net Weight (Kg): 300;
      Deliver Time: 1month;
      Usage: Semiconductor;
      Type: Image Setter;
      Page: Single Face;
      Automatic Grade: Automatic;
      Product Type: PCB Exposure;
      Proximity Exposure: Vacuum Contact;
      Feature Size: 0.35 um;
      Model: Mac-Dpb-Di50e;
      Light Source: Fiber Coupled Laser + DMD;
      Laser Power: 24 Watts;
      Wave Length: 395nm - 415nm UV Sensitive;
      Imaging Material: Conventional Dry Film, PCB Ink, Ldi Dry Film;
      Supported Substrate: Max: 630X730mm Min: 250X250mm;
      Substrate Thickness: 0.05mm to 5mm;
      Minimum Line Width / Line Distance: 50um / 50um;
      Line Width Accuracy: Within 4um;
      Depth of Focus: 300um;
      Layer Alignment Accuracy: 20um;
      Outer Layer Alignment Accuracy: 10um;
      Repeat Accuracy: 2um;
      File Format: Gerber274X, Gerber274D, Odb++;
      Productivity (535X610mm, 20 Mj/Cm2): 39s / Side;
      Usage: Semiconductor;
      Type: Image Setter;
      Page: Single Face;
      Automatic Grade: Automatic;
      Product Type: PCB Exposure;
      Proximity Exposure: Vacuum Contact;
      Feature Size: 0.35 um;
      Model: Mac-Dpb-Di50e;
      Light Source: Fiber Coupled Laser + DMD;
      Laser Power: 24 Watts;
      Wave Length: 395nm - 415nm UV Sensitive;
      Imaging Material: Conventional Dry Film, PCB Ink, Ldi Dry Film;
      Supported Substrate: Max: 630X730mm Min: 250X250mm;
      Substrate Thickness: 0.05mm to 5mm;
      Minimum Line Width / Line Distance: 50um / 50um;
      Line Width Accuracy: Within 4um;
      Depth of Focus: 300um;
      Layer Alignment Accuracy: 20um;
      Outer Layer Alignment Accuracy: 10um;
      Repeat Accuracy: 2um;
      File Format: Gerber274X, Gerber274D, Odb++;
      Productivity (535X610mm, 20 Mj/Cm2): 39s / Side;
      Usage: Semiconductor;
      Type: Image Setter;
      Page: Single Face;
      Automatic Grade: Automatic;
      Product Type: PCB Exposure;
      Proximity Exposure: Vacuum Contact;
      Feature Size: 0.35 um;
      Model: Mac-Dpb-Di50e;
      Light Source: Fiber Coupled Laser + DMD;
      Laser Power: 24 Watts;
      Wave Length: 395nm - 415nm UV Sensitive;
      Imaging Material: Conventional Dry Film, PCB Ink, Ldi Dry Film;
      Supported Substrate: Max: 630X730mm Min: 250X250mm;
      Substrate Thickness: 0.05mm to 5mm;
      Minimum Line Width / Line Distance: 50um / 50um;
      Line Width Accuracy: Within 4um;
      Depth of Focus: 300um;
      Layer Alignment Accuracy: 20um;
      Outer Layer Alignment Accuracy: 10um;
      Repeat Accuracy: 2um;
      File Format: Gerber274X, Gerber274D, Odb++;
      Productivity (535X610mm, 20 Mj/Cm2): 39s / Side;
      Usage: Semiconductor;
      Type: Plate Exposure;
      Page: None;
      Automatic Grade: Automatic;
      Product Type: None;
      Proximity Exposure: None;
      Feature Size: None;
      Supplier Name

      Changshu Evergrande Imp. & Exp. Co., Ltd.

      Diamond Member Audited Supplier

      McLantis Technology (Shanghai) Co., Ltd.

      Gold Member Audited Supplier

      McLantis Technology (Shanghai) Co., Ltd.

      Gold Member Audited Supplier

      McLantis Technology (Shanghai) Co., Ltd.

      Gold Member Audited Supplier

      Hangzhou Ecoographix Digital Technology Co., Ltd.

      Gold Member Audited Supplier