| Specification |
Conductive Type: Bipolar Integrated Circuit;
Integration: MSI;
Technics: Semiconductor IC;
MFG.: TI;
D/C: 17+;
Package: TSSOP-20;
Quality: Genuine New Original;
shape: SMD;
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Technics: Semiconductor IC;
Core Processor: Pic;
Core Size: 8-Bit;
Speed: 64MHz;
Connectivity: I²c, Linbus, Spi, Uart/Usart;
Peripherals: Brown-out Detect/Reset, Por, PWM, Wdt;
Number of I/O: 18;
Program Memory Size: 16kb (16K X 8);
Program Memory Type: Flash;
RAM Size: 1K X 8;
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V;
Operating Temperature: -40°c ~ 85°c (Ta);
Package / Case: 20-Pdip;
Data Converters: a/D 17X12b; D/a 2X8b;
Oscillator Type: Internal;
shape: DIP;
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Conductive Type: Unipolar Integrated Circuit;
Integration: LSI;
Technics: Thick Film IC;
Package: Tube;
Product Status: Active;
Speed: 8MHz;
Data Interface: Spi;
shape: SMD;
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Technics: Semiconductor IC;
Core Processor: Arm Cortex-M4;
Core Size: 32-Bit Single-Core;
Speed: 72MHz;
Connectivity: Canbus, IrDA, Linbus, Spi, Uart/Usart, USB;
Peripherals: DMA, I²s, Por, PWM, Wdt;
Number of I/O: 37;
Program Memory Size: 128kb (128K X 8);
Program Memory Type: Flash;
RAM Size: 32K X 8;
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V;
Operating Temperature: -40°c ~ 85°c (Ta);
Package / Case: 48-Lqfp;
Data Converters: a/D 15X12b; D/a 2X12b;
Oscillator Type: Internal;
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Conductive Type: Unipolar Integrated Circuit;
Integration: GSI;
Technics: Semiconductor IC;
Layer: 1-32 Layers;
Service: OEM/ODM;
OEM/ODM: Available;
Test: 100%E-Testing;
Layer Count: 1-20 Layers;
Shipping: DHL/UPS/FedEx/Air/Sea;
Surface Treatmen: OSP, Enig, HASL, AG Immersion;
Certificate Gurantee: Yes;
shape: DIP;
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