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      High-Speed Data Acquisition
      US$11,100.00-13,400.00 / board
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      What is High-Speed Data Acquisition and Storagefpga, Direct Write to Nvme SSD (Dual-Bay)

      About this Item
      Details
      Company Profile

      Price

      Purchase Qty. Reference FOB Price

      1-9 board US$13,400.00

      10+ board US$11,100.00

      Sepcifications

      • Conductive Type Unipolar Integrated Circuit
      • Integration MSI
      • Mounting Type SMT
      • Operating Temperature -20℃~40℃
      • Shape Board
      • Technics Application-Specific Integrated Circuit
      • Transport Package ESD Bag
      • Specification 160*100mm
      • Trademark Ragine
      • Origin China

      Product Description

      High-Speed Data Acquisition and StorageFPGA ,Direct Write to NVMe SSD (Dual-Bay) High-Speed Data Acquisition and Storage System.This FPGA-based system features direct writing to dual NVMe SSDs, comprising: XCZU7EV FPGA; High-speed DDR4 buffer memory; PCIe Gen3 hard IP core; High-speed NVMe ...

      Learn More

      High-Speed Data Acquisition Comparison
      Transaction Info
      Price US$11,100.00-13,400.00 / board US$0.072-15.00 / Piece US$0.072-15.00 / Piece US$0.072-15.00 / Piece US$0.072-15.00 / Piece
      Min Order 1 board 100 Pieces 100 Pieces 100 Pieces 100 Pieces
      Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, PayPal LC, T/T, PayPal LC, T/T, PayPal LC, T/T, PayPal
      Quality Control
      Management System Certification - Others Others Others Others
      Trade Capacity
      Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe South America, Europe, East Asia(Japan/ South Korea) South America, Europe, East Asia(Japan/ South Korea) South America, Europe, East Asia(Japan/ South Korea) South America, Europe, East Asia(Japan/ South Korea)
      Annual Export Revenue - - - - -
      Business Model - - - - -
      Average Lead Time Peak Season Lead Time: one month
      Off Season Lead Time: one month
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Conductive Type: Unipolar Integrated Circuit;
      Integration: MSI;
      Mounting Type: SMT;
      Operating Temperature: -20℃~40℃;
      Shape: Board;
      Technics: Application-Specific Integrated Circuit;
      Conductive Type: Unipolar Integrated Circuit;
      Integration: LSI;
      Technics: Thick Film IC;
      MFG.: ANLOGIC;
      D/C: 17+;
      Package: BGA-256;
      Quality: Genuine New Original;
      shape: SMD;
      Conductive Type: Unipolar Integrated Circuit;
      Integration: LSI;
      Technics: Thick Film IC;
      MFG.: ALTERA;
      D/C: 17+;
      Package: TQFP-144;
      Quality: Genuine New Original;
      shape: SMD;
      Conductive Type: Unipolar Integrated Circuit;
      Integration: LSI;
      Technics: Thick Film IC;
      MFG.: ALTERA;
      D/C: 17+;
      Package: TQFP-100;
      Quality: Genuine New Original;
      shape: SMD;
      Conductive Type: Unipolar Integrated Circuit;
      Integration: LSI;
      Technics: Thick Film IC;
      MFG.: ALTERA;
      D/C: 17+;
      Package: TQFP-100;
      Quality: Genuine New Original;
      shape: SMD;
      Supplier Name

      Hangzhou Ragine Electronic Technology Development Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Semilotec Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Semilotec Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Semilotec Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Semilotec Co., Ltd.

      Diamond Member Audited Supplier

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