SMT Spare Part Samsung Sub Conv Jumper J9060014b

Contact Now

Get Latest Price

About this Item

Price

Min. Order Reference FOB Price

1 Piece US$100.00-1,000.00 / Piece

Sepcifications

Condition New
Precision Precision
Certification ISO, CE
Warranty 3 Months
Transport Package Normal Packing
Trademark SAMSUNG
Origin Korea
Part No. J9060014b
Lead Time 1-3 Days After Payment
Shipping Ways DHL, FedEx, TNT, UPS, EMS, by Sea, by Air

Product Description

SMT pick and place machine SAMSUNG SUB CONV JUMPER J9060014B There are also other samsung spare parts for you. PART NO. PART NAME J1301023 E-RING J1301151 HEX NUT J1301154 FLAT WASHER J1301155 STEEL BALL J1301157 FLAT HEAD CAP SCREW J1301161 FLAT HEAD CAP SCREW J1301164 BEARING J1301266 HEX NUT ...

Learn More

Qinyi Electronics Co., Ltd.

Diamond Member Since 2015

Audited Supplier

Business Type Trading Company
Main Products SMT Spare Parts, Pick and Place Machines, SMT Feeder, SMT Nozzle, SMT Motor, SMT Printer ...
Year of Establishment 2013-06-19
Number of Employees 29
Address Room 1107, Eleventh Floor, Tong Fang Centre, Zhongxin Road, Shajing Town, Baoan District, 518104 China, Shenzhen, Guangdong, China

Samsung Sub Conv Jumper Comparison

	SMT Spare Part Samsung Sub Conv Jumper J9060014b Contact Now	Quick View Fully Automatic Die Bonding Machine for Advanced Semiconductor Assembly Contact Now	Quick View High Precision Pick and Place Machine Flip Chip Die Bonder Semiconductor Bonding Equipment Contact Now	Quick View Automatic High Precision Die Bonder Die Bonding Machine for Qfp/Lqfp/Qfn Contact Now	Quick View Semiconductor Packaging Equipment Package Bonder for Tcb Ncp/Ncf/Tc-Cuf C2 and C4 and Fo-Wlp Chip-to-Substrate Bonding Contact Now

Transaction Info
	SMT Spare Part Samsung Sub Conv Jumper J9060014b Contact Now	Quick View Fully Automatic Die Bonding Machine for Advanced Semiconductor Assembly Contact Now	Quick View High Precision Pick and Place Machine Flip Chip Die Bonder Semiconductor Bonding Equipment Contact Now	Quick View Automatic High Precision Die Bonder Die Bonding Machine for Qfp/Lqfp/Qfn Contact Now	Quick View Semiconductor Packaging Equipment Package Bonder for Tcb Ncp/Ncf/Tc-Cuf C2 and C4 and Fo-Wlp Chip-to-Substrate Bonding Contact Now
Price	US$100.00-1,000.00 / Piece	US$100,000.00-1,000,000.00 / Piece	US$10,000.00-100,000.00 / Piece	US$100,000.00-1,000,000.00 / Piece	US$100,000.00-1,000,000.00 / Piece
Min Order	1 Piece	1 Piece	1 Piece	1 Piece	1 Piece
Payment Terms	LC, T/T, D/P, PayPal, Western Union, Small-amount payment	LC, T/T, PayPal, Western Union	LC, T/T, PayPal, Western Union	LC, T/T, PayPal, Western Union	LC, T/T, PayPal, Western Union
Quality Control
Product Certification	ISO, CE	ISO	RoHS, ISO, CE	ISO	ISO
Management System Certification	-	-	-	-	-
Trade Capacity
Export Markets	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia	Europe	Europe	Europe	Europe
Annual Export Revenue	-	-	-	-	-
Business Model	Own Brand, ODM, OEM	ODM, OEM	ODM, OEM	ODM, OEM	ODM, OEM
Average Lead Time	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months	Peak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months	Peak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months	Peak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Product Attributes
Specification	Condition: New; Precision: Precision; Warranty: 3 Months; Part No.: J9060014b; Lead Time: 1-3 Days After Payment; Shipping Ways: DHL, FedEx, TNT, UPS, EMS, by Sea, by Air;	After-sales Service: Provided; Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Product Name: Semiconductor Equipment; Feature 1: Guaranteed Quality; Feature 2: Customized According to Needs; After-Sale Service: Provided;	After-sales Service: Provided; Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter; Product Name: Semiconductor Equipment; Feature 1: Guaranteed Quality; Feature 2: Customized According to Needs; After-Sale Service: Provided;	After-sales Service: Provided; Condition: New; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Product Name: Semiconductor Equipment; Feature 1: Guaranteed Quality; Feature 2: Customized According to Needs; After-Sale Service: Provided;	After-sales Service: Provided; Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Product Name: Semiconductor Equipment; Feature 1: Guaranteed Quality; Feature 2: Customized According to Needs; After-Sale Service: Provided;
Supplier Name	Qinyi Electronics Co., Ltd.	Jiangsu Himalaya Semiconductor Co., Ltd.	Jiangsu Himalaya Semiconductor Co., Ltd.	Jiangsu Himalaya Semiconductor Co., Ltd.	Jiangsu Himalaya Semiconductor Co., Ltd.
Select All

Contact Now

Hot Search