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      Factory Customized OPS Motherboard Support Core 6/7/8th Gen Processor Cell 3955u HDMI2.0 4K Display DDR4 OPS PC

      About this Item
      Details
      Company Profile

      Price

      Purchase Qty. Reference FOB Price

      1-499 Pieces US$88.00

      500+ Pieces US$80.00

      Sepcifications

      • Application Field Industrial Control
      • Processor Type Intel
      • Stratification Application Layer
      • Range of Application General
      • Bus Type No
      • Certification CE, RoHS, FCC
      • Type Embedded Board
      • Machine Word-Length No
      • Instruction Type RISC
      • Kernel No
      • Transport Package Piesia Standard Package
      • Specification 120x180x30mm
      • Trademark piesia or ODM OEM
      • Origin China
      • Processor Intel 6th/7th/8th Mobile
      • Memory 1*DDR4
      • LAN 1*Gigabit LAN Port
      • USB 2*USB3.0
      • ROM 1*Ngff 1*SATA3.0 1*SATA_HDD
      • Display Port VGA + HDMI1.4

      Product Description

      Product Description Integrated Intel 6th/7th Mobile Skylake/Kaby lake-U single chipset CPU 1 DDR4 SODIMM 260 Socket Providing 1*VGA,1*HD(M)I Support power-on automatic boot function, jumper selection Single input DC power supply, DC12-19V power supply Support OPS expansion Size 179.6*118*29.6 ...

      Learn More

      Core I5 I7 OPS PC Comparison
      Transaction Info
      Price US$80.00-88.00 / Piece US$140.40-153.60 / Piece US$142.80-156.00 / Piece US$190.80-206.40 / Piece US$138.00-150.00 / Piece
      Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
      Payment Terms T/T, PayPal, Western Union, Small-amount payment, Money Gram T/T, PayPal T/T, PayPal T/T, PayPal T/T, PayPal
      Quality Control
      Product Certification CE, RoHS, FCC CE, RoHS, FCC CE, RoHS, FCC CE, RoHS, FCC CE, RoHS, FCC
      Management System Certification - ISO9001:2015 ISO9001:2015 ISO9001:2015 ISO9001:2015
      Trade Capacity
      Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia
      Annual Export Revenue - - - - -
      Business Model - Own Brand, ODM, OEM Own Brand, ODM, OEM Own Brand, ODM, OEM Own Brand, ODM, OEM
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays, one month
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays, one month
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays, one month
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays, one month
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Application Field: Industrial Control;
      Processor Type: Intel;
      Stratification: Application Layer;
      Range of Application: General;
      Bus Type: No;
      Type: Embedded Board;
      Machine Word-Length: No;
      Instruction Type: RISC;
      Kernel: No;
      Processor: Intel 6th/7th/8th Mobile;
      Memory: 1*DDR4;
      LAN: 1*Gigabit LAN Port;
      USB: 2*USB3.0;
      ROM: 1*Ngff 1*SATA3.0 1*SATA_HDD;
      Display Port: VGA + HDMI1.4;
      Application Field: Industrial Control;
      Processor Type: ARM;
      Stratification: HardWare Layer;
      Type: Embedded Systems;
      Kernel: T507-H;
      Processor: T507-H 1.416GHz;
      RAM: DDR4 1/2GByte;
      ROM: eMMC 8/16GByte;
      Input Voltage: DC 9~36V;
      Ethernet Port: RJ-45 1x100M;
      Mini PCIE: Supports Bluetooth, WiFi, 4G module;
      Digital Input: YES;
      Digital Output: YES;
      SIM Slot: 1 slot, NANO;
      USB Port: 2x USB2.0 ESD Level 3;
      Antenna: 2, For 4G/WIFI/GPS;
      Grounding: 1-pin GND terminal;
      Debug: 1x Micro USB debug port;
      SD Slot: 1;
      Installation: DIN35 rail mounting, wall mounting;
      Application Field: Industrial Control;
      Processor Type: ARM;
      Stratification: HardWare Layer;
      Type: Embedded Systems;
      Kernel: T507-H;
      Processor: T507-H 1.416GHz;
      RAM: DDR4 1/2GByte;
      ROM: eMMC 8/16GByte;
      Input Voltage: DC 9~36V;
      Ethernet Port: RJ-45 2x100M;
      Mini PCIE: Supports Bluetooth, WiFi, 4G module;
      Digital Input: YES;
      Digital Output: YES;
      SIM Slot: 1 slot, NANO;
      USB Port: 2x USB2.0 ESD Level 3;
      Antenna: 2, For 4G/WIFI/GPS;
      Grounding: 1-pin GND terminal;
      Debug: 1x Micro USB debug port;
      SD Slot: 1;
      Installation: DIN35 rail mounting, wall mounting;
      Application Field: Industrial Control;
      Processor Type: ARM;
      Stratification: HardWare Layer;
      Type: Embedded Systems;
      Kernel: T507-H;
      Processor: T507-H 1.416GHz;
      RAM: DDR4 1/2GByte;
      ROM: eMMC 8/16GByte;
      Input Voltage: DC 9~36V;
      Ethernet Port: RJ-45 3x100M;
      Mini PCIE: Supports Bluetooth, WiFi, 4G module;
      Digital Input: YES;
      Digital Output: YES;
      USB Port: 2x USB2.0 ESD Level 3;
      Analog Input: YES;
      Analog Output: YES;
      Installation: DIN35 rail mounting, wall mounting;
      Antenna: 2, For 4G/WIFI/GPS;
      Grounding: 1-pin GND terminal;
      Debug: 1x Micro USB debug port;
      Application Field: Industrial Control;
      Processor Type: ARM;
      Stratification: HardWare Layer;
      Type: Embedded Systems;
      Kernel: T507-H;
      Processor: T507-H 1.416GHz;
      RAM: DDR4 1/2GByte;
      ROM: eMMC 8/16GByte;
      Input Voltage: DC 9~36V;
      Ethernet Port: RJ-45 3x100M;
      Mini PCIE: Supports Bluetooth, WiFi, 4G module;
      Digital Input: YES;
      Digital Output: YES;
      SIM Slot: 1 slot, NANO;
      USB Port: 2x USB2.0 ESD Level 3;
      Antenna: 2, For 4G/WIFI/GPS;
      Grounding: 1-pin GND terminal;
      Debug: 1x Micro USB debug port;
      SD Slot: 1;
      Installation: DIN35 rail mounting, wall mounting;
      Supplier Name

      Shenzhen Piesia Electronic Technology Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Beilai Technology Co., Ltd.

      Gold Member Audited Supplier

      Shenzhen Beilai Technology Co., Ltd.

      Gold Member Audited Supplier

      Shenzhen Beilai Technology Co., Ltd.

      Gold Member Audited Supplier

      Shenzhen Beilai Technology Co., Ltd.

      Gold Member Audited Supplier

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