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      Communication Module Development Board
      US$50.90 / Piece
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      About this Item
      Details
      Company Profile

      Price

      Min. Order Reference FOB Price

      1 Piece US$50.90 / Piece

      Sepcifications

      • Metal Coating Tin
      • Mode of Production DIP
      • Layers Single-Layer
      • Base Material AIN
      • Certification N/a
      • Customized Non-Customized
      • Condition New
      • Transport Package Carton
      • Specification Small Size
      • Trademark Original brand
      • Origin Original
      • Package Standard
      • Function Development and Debugging
      • Application Electronic Project for Control
      • Features Mini Development Board

      Product Description

      Product Parameters ITEM VALUE D/C New Condition New Package Original Brand PCBA Applications Raspberry PI Dedicated to CSI Conversion Board Series Nano Development Board Description Electronic Project for Control Lead Free Status ROHS Compliant Mounting Type DIP Express ...

      Learn More

      Communication Module Development Board Comparison
      Transaction Info
      Price US$50.90 / Piece US$20.00 / Piece US$0.97 / Piece US$0.01-0.41 / Piece US$1.00-30.00 / Piece
      Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
      Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment T/T T/T LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram T/T
      Quality Control
      Product Certification N/a RoHS, ISO, ISO13485 RoHS, ISO ISO9001, ISO14000, Ts16949.UL.RoHS RoHS, UL / ISO9001, ISO13485, IATF16949
      Management System Certification - - - - -
      Trade Capacity
      Export Markets North America North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe
      Annual Export Revenue - - - - -
      Business Model ODM, OEM - - - -
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: one month
      Peak Season Lead Time: one month
      Off Season Lead Time: one month
      Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: one month
      Product Attributes
      Specification
      Metal Coating: Tin;
      Mode of Production: DIP;
      Layers: Single-Layer;
      Base Material: AIN;
      Customized: Non-Customized;
      Condition: New;
      Package: Standard;
      Function: Development and Debugging;
      Application: Electronic Project for Control;
      Features: Mini Development Board;
      Metal Coating: Copper;
      Mode of Production: SMT;
      Layers: Multilayer;
      Base Material: FR-4;
      Customized: Customized;
      Condition: New;
      PCBA-Testing: X-ray, Aoi;
      Small Order: Acceptable;
      Type: Rigid Circuit Board;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Insulation Materials: Organic Resin;
      Material: Complex;
      Metal Coating: Copper;
      Mode of Production: SMT;
      Layers: Multilayer;
      Base Material: FR-4;
      Customized: Customized;
      Condition: New;
      PCBA-Testing: X-ray, Aoi;
      Small Order: Acceptable;
      Type: Rigid Circuit Board;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Insulation Materials: Organic Resin;
      Material: Complex;
      Metal Coating: Copper;
      Mode of Production: SMT;
      Layers: Multilayer;
      Base Material: FR-4;
      Customized: Customized;
      Condition: New;
      Shape: Retangular, Round, Slots, Cutouts, Complex, Irreg;
      Surface Finishing: OSP, Immersion Gold, Immersion Tin, Immersion AG;
      Layer: 1-22 Layers;
      Service: Turnkey Assembly PCB Service;
      Other Capabilities: Repair/Rework Services Mechanical Assembly Box Bui;
      Copper Thickness: 1-10oz;
      Min. SMD Size: 01005;
      QA Inspection: Aoi, X-ray, Ict;
      Order Qty: No Limited;
      Controlling Range: -40c~125c;
      Solder Resist Color: Green;Red;Yellow;Black;White;
      Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable Mask;
      Trade Mark: OEM, ODM;
      Surface Finish: Lead Free HASL;
      Metal Coating: Copper;
      Mode of Production: SMT;
      Layers: 1~28 Layers;
      Base Material: FR-4;
      Customized: Customized;
      Condition: New;
      Basic Material: Fr-4;
      PCBA Testing: X-ray, Aoi Test, Function Test;
      PCBA Min. BGA Pitch: 0.2mm;
      Processing Technology: Electrolytic Foil;
      Other Service: ODM, OEM, Final Product Assembling;
      Insulation Materials: Organic Resin;
      Application: Consumer Electronics, Communications, Aerospace;
      PCB Surface Treatment: HASL Lead Free, OPS, Immersion Tin/Gold, etc;
      Supplier Name

      Shenzhen Junbo Trading Co., LTD

      Gold Member Audited Supplier

      Shenzhen Grandtop Electronics Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Grandtop Electronics Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Okey Circuit Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Grandtop Electronics Co., Ltd.

      Diamond Member Audited Supplier

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