| Specification |
Conductive Type: Unipolar Integrated Circuit;
Integration: GSI;
Memory Type: Logic Ics;
Shape: Flat;
Technics: Semiconductor IC;
D/C: New;
Series: Electronic Components Circuits;
Product Completion Type: IC Chips;
Mounting Type: Surface Mount;
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Conductive Type: Unipolar Integrated Circuit;
Integration: GSI;
Technics: Semiconductor IC;
Layer: 1-32 Layers;
Service: OEM/ODM;
OEM/ODM: Available;
Test: 100%E-Testing;
Layer Count: 1-20 Layers;
Shipping: DHL/UPS/FedEx/Air/Sea;
Surface Treatmen: OSP, Enig, HASL, AG Immersion;
Certificate Gurantee: Yes;
shape: DIP;
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Conductive Type: Bipolar Integrated Circuit;
Integration: SSI;
Technics: Thick Film IC;
Capacity: 1000000;
OEM/ODM: Available;
Sample: Available;
Surface Treatment: OSP, Enig, HASL, AG Immersion;
Certificate Gurantee: Yes;
Test: 100%E-Testing;
Min Bonding Pad Diameter: 10mil;
Min Thickness of Soldermask: 10um;
Color of Silk-Screen: White, Yellow, Black;
Data File Format: Gerber File and Drilling File, Protel Series, ...;
Material for PCB: Fr-4, High Tg Fr$, Halogen Free, Rogers, Cem-1, Ari;
Layer Count: 1-20 Layers;
Shipping: DHL/UPS/FedEx/Air/Sea;
shape: DIP;
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Conductive Type: Unipolar Integrated Circuit;
Integration: SSI;
Shape: DIP;
Technics: Semiconductor IC;
shape: DIP;
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Conductive Type: Standard;
Integration: Standard;
Shape: DIP;
Technics: Semiconductor IC;
Package: DIP-14;
Mounting Type: Through Hole;
Pack: Tube;
Base Product Number: Pic16f676;
-: DIP/SMD;
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