| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Okey;
Board Material: Fr4, H-Tg, It-180A, Cem, Aluminum, Copper Base;
Board Thickness: 0.4-5.0mm;
Layer: 1-60 Layers;
Copper Thickness: 0.5-10 Oz;
Solder Mask Color: Green, White, Black, Blue, Yellow, Red, Purple;
Silkscreen Color: Green, White, Black, Blue, Yellow;
Surface Finishing: HASL, Lf HASL, Enig, OSP, Carbon Oil;
Min. SMD Size: 01005;
PCB Testing: E-Test, Fly Probe Test, Visual Checking;
PCBA Testing: Aoi, Ict, Fct, Burn-in, Vibration Test;
Order Qty: Not Limited;
Shape: Rectangular, Round, Slots, Cutouts, Complex;
Service: Turnkey Assembly PCB PCBA Service;
Customized: Customizable;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Mu Star;
Solder Mask Color: Green, Red, Black (as Your Require);
Silkscreen Color: White, Black;
Testing Service: Ict, Function Test, X-ray, Aoi;
Layers: 1-64;
MOQ: 5PCS;
Warranty: 2 Years;
|
Type: Multilayer PCB;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4,Tg,Cem-1,Aluminium;
Insulation Materials: Organic Resin;
Brand: Smart;
Number of Layers: 2/4/6/8/12/Custom;
Copper Thickness: 0.5-6.0oz;
Min.Hole Size: 0.1mm;
Min.Line Spacing: 0.075mm;
Min. Line Width: 0.15mm;
Board Size: Custom;
Board Thickness: 0.2-4.0mm;
|
Type: Multilayer PCB;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4,Tg,Cem-1,Aluminium;
Insulation Materials: Organic Resin;
Brand: Smart;
Number of Layers: 2/4/6/8/12/Custom;
Copper Thickness: 0.5-6.0oz;
Min.Hole Size: 0.1mm;
Min.Line Spacing: 0.075mm;
Min. Line Width: 0.15mm;
Board Size: Custom;
Board Thickness: 0.2-4.0mm;
|
Type: Multilayer PCB;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4,Tg,Cem-1,Aluminium;
Insulation Materials: Organic Resin;
Brand: Smart;
Number of Layers: 2/4/6/8/12/Custom;
Copper Thickness: 0.5-6.0oz;
Min.Hole Size: 0.1mm;
Min.Line Spacing: 0.075mm;
Min. Line Width: 0.15mm;
Board Size: Custom;
Board Thickness: 0.2-4.0mm;
|