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      Reverse Engineer
      US$0.01-0.02 / Piece
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      About this Item
      Details
      Company Profile

      Price

      Min. Order Reference FOB Price

      1 Piece US$0.01-0.02 / Piece

      Sepcifications

      • Type Combining Rigid Circuit Board
      • Flame Retardant Properties HB
      • Dielectric FR-5
      • Base Material Aluminum
      • Insulation Materials Metal Composite Materials
      • Processing Technology Delay Pressure Foil
      • Application Consumer Electronics
      • Mechanical Rigid Fexible
      • Material The Paper Ring Gas Resin
      • Brand OEM ODM
      • Transport Package Inner Vacuum Packing Outer Carton Box
      • Specification FR 4, 0.8mm, 1 Layer, 1OZ Copper Thickness
      • Trademark OKEY/ODM OEM
      • Origin China
      • Shape Retangular, Round, Slots, Cutouts, Complex, Irreg
      • Surface Finishing OSP, Immersion Gold, Immersion Tin, Immersion AG
      • Layer 1-60 Layers
      • Service Turnkey Assembly PCB Service
      • Other Capabilities Repair/Rework Services Mechanical Assembly Box Bui
      • Copper Thickness 1-10oz
      • Min. SMD Size 01005
      • QA Inspection Aoi, X-ray, Ict
      • Certificate ISO9001, ISO14000, Ts16949.UL.RoHS
      • Order Qty No Limited
      • Condition New
      • Controlling Range -40c~125c
      • Solder Resist Color Green;Red;Yellow;Black;White
      • Surface Finished HASL, Gold Finger, OSP, Enig, Peelable Mask
      • Trade Mark OEM, ODM

      Product Description

      Our one-stop service: 1. PCB development and design; 2. PCB manufacturing from 1 to 32 layers(Rigid PCB,Flexible PCB,Ceramci PCB,Aluminum PCB); 3. PCB Clone; 4. Component sourcing; 5. PCB Assembly; 6. Write program for customers; 7. PCB/ PCBA Test. 8. Contract Manufacturing 9. ...

      Learn More

      Reverse Engineer Comparison
      Transaction Info
      Price US$0.01-0.02 / Piece US$0.80-2.60 / Piece US$0.80-2.60 / Piece US$0.80-2.60 / Piece US$0.80-2.60 / Piece
      Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
      Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram T/T, Western Union T/T, Western Union T/T, Western Union T/T, Western Union
      Quality Control
      Product Certification ISO9001, ISO14000, Ts16949.UL.RoHS - - - -
      Management System Certification - ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others
      Trade Capacity
      Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic
      Annual Export Revenue - - - - -
      Business Model - Own Brand, ODM Own Brand, ODM Own Brand, ODM Own Brand, ODM
      Average Lead Time Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Type: Combining Rigid Circuit Board;
      Flame Retardant Properties: HB;
      Dielectric: FR-5;
      Base Material: Aluminum;
      Insulation Materials: Metal Composite Materials;
      Processing Technology: Delay Pressure Foil;
      Application: Consumer Electronics;
      Mechanical Rigid: Fexible;
      Material: The Paper Ring Gas Resin;
      Brand: OEM ODM;
      Shape: Retangular, Round, Slots, Cutouts, Complex, Irreg;
      Surface Finishing: OSP, Immersion Gold, Immersion Tin, Immersion AG;
      Layer: 1-60 Layers;
      Service: Turnkey Assembly PCB Service;
      Other Capabilities: Repair/Rework Services Mechanical Assembly Box Bui;
      Copper Thickness: 1-10oz;
      Min. SMD Size: 01005;
      QA Inspection: Aoi, X-ray, Ict;
      Order Qty: No Limited;
      Condition: New;
      Controlling Range: -40c~125c;
      Solder Resist Color: Green;Red;Yellow;Black;White;
      Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable Mask;
      Trade Mark: OEM, ODM;
      Type: Combining Rigid Circuit Board;
      Flame Retardant Properties: Customized;
      Dielectric: MCPCB\Fr4\Bt;
      Base Material: Double-Sided/Multilayer Aluminum/Copper;
      Insulation Materials: Customized;
      Processing Technology: Delay Pressure Foil;
      Application: New Energy Vehicle Electronic Control Board;
      Mechanical Rigid: Rigid;
      Material: Copper-Based;
      Brand: Hongyu;
      Board Thickness: 1.7mm;
      Metal Core PCB: Oxygen-Free Copper(OFC) 1.5mm;
      Thermal Conductivity: 3.2W/M·K (Dielectric Layer);
      Copper Foil: 170μm;
      Tg: 150°C;
      Type: Combining Rigid Circuit Board;
      Flame Retardant Properties: Customized;
      Dielectric: MCPCB\Fr4\Bt;
      Base Material: Double-Sided/Multilayer Aluminum/Copper;
      Insulation Materials: Customized;
      Processing Technology: Delay Pressure Foil;
      Application: New Energy Vehicle Electronic Control Board;
      Mechanical Rigid: Rigid;
      Material: Copper-Based;
      Brand: Hongyu;
      Board Thickness: 1.7mm;
      Metal Core PCB: Oxygen-Free Copper(OFC) 1.5mm;
      Thermal Conductivity: 3.2W/M·K (Dielectric Layer);
      Copper Foil: 170μm;
      Tg: 150°C;
      Type: Combining Rigid Circuit Board;
      Flame Retardant Properties: Customized;
      Dielectric: MCPCB\Fr4\Bt;
      Base Material: Double-Sided/Multilayer Aluminum/Copper;
      Insulation Materials: Customized;
      Processing Technology: Delay Pressure Foil;
      Application: New Energy Vehicle Electronic Control Board;
      Mechanical Rigid: Rigid;
      Material: Copper-Based;
      Brand: Hongyu;
      Board Thickness: 1.7mm;
      Metal Core PCB: Oxygen-Free Copper(OFC) 1.5mm;
      Thermal Conductivity: 3.2W/M·K (Dielectric Layer);
      Copper Foil: 170μm;
      Tg: 150°C;
      Type: Combining Rigid Circuit Board;
      Flame Retardant Properties: Customized;
      Dielectric: MCPCB\Fr4\Bt;
      Base Material: Double-Sided/Multilayer Aluminum/Copper;
      Insulation Materials: Customized;
      Processing Technology: Delay Pressure Foil;
      Application: New Energy Vehicle Electronic Control Board;
      Mechanical Rigid: Rigid;
      Material: Copper-Based;
      Brand: Hongyu;
      Board Thickness: 1.7mm;
      Metal Core PCB: Oxygen-Free Copper(OFC) 1.5mm;
      Thermal Conductivity: 3.2W/M·K (Dielectric Layer);
      Copper Foil: 170μm;
      Tg: 150°C;
      Supplier Name

      Shenzhen Okey Circuit Co., Ltd.

      Diamond Member Audited Supplier

      Jiangxi Hongyu Circuit Technology Co., Ltd.

      Diamond Member Audited Supplier

      Jiangxi Hongyu Circuit Technology Co., Ltd.

      Diamond Member Audited Supplier

      Jiangxi Hongyu Circuit Technology Co., Ltd.

      Diamond Member Audited Supplier

      Jiangxi Hongyu Circuit Technology Co., Ltd.

      Diamond Member Audited Supplier

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