| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Okey PCBA;
Board Thickness: 0.4-2.0mm;
Surface Finihsing: OSP, HASL, Lf HASL, Enig, Carbon Oil, Enepig;
Lead Time: 6-8 Workdays;
Solder Mask Color: Green, White, Black, Blue, Yellow, Red, Purple;
Silkscreen Color: Green, White, Black, Blue, Yellow;
Copper Thickness: 0.5-4 Oz;
Layer: 1-20 Layers;
Board Material: Fr4, H-Tg, Cem, Aluminum, Copper Base;
PCB Testing: E-Test, Fly Probe Test, Visual Checking;
PCBA Testing: Aoi, Ict, Fct, Burn-in, Vibration Test;
Transportation: DHL, TNT, UPS, FedEx IP/Ie, EMS, Air/Sea Shipment;
Service: OEM One-Stop Service;
Tg Value: Tg 170;
Factory or Trader: Factory;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Test: Flying Probe and Fixture;
Solder Mask: Blue;
Certificates: UL, RoHS, SGS, ISO9001;
Board Thickness: 0.5mm / 0.8mm / 1.6mm Custom;
Custom: OEM / ODM;
Copper: 0.5oz / 18um, 2oz / 70um;
Layers: 4-10 Layers, Custom;
Legend: White;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Application: Medical Instruments;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Mu Star;
Color: Customized;
Testing Service: Aoi/ X-ray/ Fai;
Board Thickness: 1.6mm;
Number of Layers: 1-58 Layers;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Remark: PCB Board;
Layer: 6;
Surface Finish: HASL;
Materials: Fr4, High Tg Fr4, PTFE, Alu, Cu Base, Rogers;
Board Thickness: 0.20mm-8.00mm;
Min Line: 0.075mm;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: N/a;
Remark: PCB Board;
Layer: 6;
Surface Finish: HASL;
Materials: Fr4, High Tg Fr4, PTFE, Alu, Cu Base, Rogers;
Board Thickness: 0.20mm-8.00mm;
Min Line: 0.075mm;
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