| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: FR-4;
Application: Electronic Products;
Customized: Customizable;
Quality Standard: Ipc 610 Class II;
Board Thickness: 0.4-2.0mm;
Surface Finihsing: OSP, HASL, Lf HASL, Enig, Carbon Oil, Enepig;
Lead Time: 6-8 Workdays;
Solder Mask Color: Green, White, Black, Blue, Yellow, Red, Purple;
Silkscreen Color: Green, White, Black, Blue, Yellow;
Copper Thickness: 0.5-4 Oz;
Layer: 1-20 Layers;
Board Material: Fr4, H-Tg, Cem, Aluminum, Copper Base;
PCB Testing: E-Test, Fly Probe Test, Visual Checking;
PCBA Testing: Aoi, Ict, Fct, Burn-in, Vibration Test;
Transportation: DHL, TNT, UPS, FedEx IP/Ie, EMS, Air/Sea Shipment;
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Type: Rigid Circuit Board;
Dielectric: 5g Infrastructure;
Material: Rogers RO4003c;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Enig;
Base Material: Rogers RO4003c;
Insulation Materials: 5g Infrastructure;
Model: PCB;
Brand: Rogers;
Final Foil External: 1.5oz;
Final Height of PCB: 0.9 mm ±0.1;
Surface Finish: Immersion Gold;
Solder Mask Color: Blue;
Colour of Component Legend: None;
Minimum Trace and Space: 6.98mil / 6.28 Mil;
Minimum / Maximum Holes: 0.3 mm / 1.2 mm;
Test: 100% Electrical Test;
Via: Pth;
Contour/Cutting: Routing;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V1;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Fastline;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Material Type: Fr4;
Surface Treatment: HASL Lead Free;
Solder Mask: Green, Red, Blue, Black;
Silk Screen Color: White;
Board Layer: 2 Layer;
Shipping Type: DHL, UPS, TNT, EMS, FedEx etc;
Packing Type: Carton + Vacuum;
Lead Time: 5-7 Days;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: HB;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model: FR-4;
Brand: OEM/ODM;
PCB: PCB Board;
Copper Thickness: 0.5oz 1oz 2oz 3oz;
Line Width: 0.6mm;
Thinckness: 1.6mm;
Hole: Cover with Oil;
Service: SMT Aoi DIP Aging;
Packaging: ESD Bag;
Color: Black Green Red Yellow;
Application: Set Top Box Computer;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: HB;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model: FR-4;
Brand: OEM/ODM;
PCB: PCB Board;
Copper Thickness: 0.5oz 1oz 2oz 3oz;
Line Width: 0.6mm;
Thinckness: 1.6mm;
Hole: Cover with Oil;
Service: SMT Aoi DIP Aging;
Packaging: ESD Bag;
Color: Black Green Red Yellow;
Application: Set Top Box Computer;
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