| Specification |
Operating Temperature: -40°C ~ 85°C (Ta);
Technics: Semiconductor IC;
Frequency: 13.56MHz;
Standards: Felica, ISO 14443, ISO 15693, ISO 18000, , N;
Interface: I²C, Spi, Uart, USB;
Voltage - Supply: 1.65V ~ 3.6V;
Package / Case: 64-Vfqfn Dual Rows, Exposed Pad;
Supplier Device Package: 64-Hvqfn (9X9);
Base Product Number: Pn7462;
|
Conductive Type: Unipolar Integrated Circuit;
Integration: MSI;
Mounting Type: SMT;
Operating Temperature: -40℃ - +125℃;
Shape: Flat;
Technics: Thick Film IC;
Core Size: 32-Bit Dual-Core;
Speed: 200MHz;
Connectivity: Canbus, Ebi/EMI, I2c, Mcbsp, Sci, Spi, Upp, Uart/U;
RAM Size: 102K X 16;
Voltage - Supply (Vcc/Vdd): 1.14V ~ 3.47V;
|
Conductive Type: Bipolar Integrated Circuit;
Integration: GSI;
Mounting Type: BGA;
Operating Temperature: -40℃ - 85℃;
Shape: Flat;
Technics: Semiconductor IC;
Number of Labs/Clbs: 288;
Number of Logic Elements/Cells: 4608;
Voltage - Supply: 1.15V ~ 1.25V;
Number of I/O: 158;
|
Conductive Type: Bipolar Integrated Circuit;
Integration: GSI;
Mounting Type: BGA;
Operating Temperature: -40℃ - +100℃;
Shape: Flat;
Technics: Semiconductor IC;
Number of Logic Elements: 150000 Le;
Adaptive Logic Modules - Alms: 56480 Alm;
Embedded Memory: 7.7 Mbit;
Number of I/OS: 480 I/O;
Supply Voltage - Max: 1.1 V;
|
Conductive Type: Unipolar Integrated Circuit;
Integration: MSI;
Mounting Type: SMT;
Operating Temperature: -40℃ - 85℃;
Shape: Flat;
Technics: Thick Film IC;
Core Size: 16-Bit;
Speed: 20MHz;
Connectivity: Ebi/EMI, Sci, Spi, Uart/Usart;
RAM Size: 1K X 8;
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V;
|