Android Development Board

US$64.90-69.90 / Piece

Dual Camera Screen Arm Android Linux Ubuntu Industrial Embedded Development Board pictures & photos

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What is Dual Camera Screen Arm Android Linux Ubuntu Industrial Embedded Development Board

Name: Dual Camera Screen Arm Android Linux Ubuntu Industrial Embedded Development Board
Uploaded: 2026-02-07T01:04:01+08:00
Description: Product Description Dual Camera Screen Arm Android Linux Ubuntu Industrial Embedded Development Board System CPU Rockchip RK3399,ARM Dual Core A72, 4Core A53,UP to 1.8GHz GPU 4Core Mali-T860

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About this Item

Price

Min. Order Reference FOB Price

2 Pieces US$64.90-69.90 / Piece

Sepcifications

Integrated Graphics Integrated Graphics
Main Chipset Rockchip
Maximum Memory Capacity 8G
Structure ATX
Memory DDR2
SATA Interface SATA3.0
CPU Socket LGA 775
Printed Circuit Board Six Layer
Main Board Structure Integrated
Audio Effects HiFi
Transport Package Inner-Plastic Bag; Outer-Standard Carton Box
Specification Customized
Trademark customized
Origin Shenzhen, China
Name PCBA Assembly Manufacturing
Inspection 100% IQC, Ipqc, Fqc, QA, Ict
Advantages PCB Design/Assembly, PCBA & EMS
Good Services SMT, BGA and DIP
Production Type SMT & DIP & Assembling & Testing
Certificate UL94V-0+RoHS
Services OEM&ODM Manufacturer Since 2005
Item Control Board PCBA

Product Description

Product Description Dual Camera Screen Arm Android Linux Ubuntu Industrial Embedded Development Board System CPU Rockchip RK3399,ARM Dual Core A72, 4Core A53,UP to 1.8GHz GPU 4Core Mali-T860 RAM With Standard 2GB/4GB LPDDR4 R0M With Standard 16GB EMMC,Up to 128GB Display ...

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Shenzhen Grandtop Electronics Co., Ltd.

Diamond Member Since 2017

Audited Supplier

Rating & Reviews: 5.0/5.0

(1 Reviews)

Main Products PCB Assembly, Robotic Control PCB Assembly, Industrial Control PCBA, Medical PCBA, ...
Address 2-3 Floor, Building 15, Hualun Technology Park , No161 Fenghuang Xingye Road One, Fuyong town, Bao'an Distict, Shenzhen, China
Main Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe
International Commercial Terms(Incoterms) FOB, CIF, CIP, EXW, Others
Terms of Payment T/T
Average Lead Time Peak Season Lead Time: one month
Off Season Lead Time: one month

Android Development Board Comparison

	Dual Camera Screen Arm Android Linux Ubuntu Industrial Embedded Development Board Contact Now	Adlink Imb-M47-R680e Imb-M47 ATX Motherboard Support Intel 14/13/12th Core with R680e/H610 Chipset DDR5 Pclex16 6xcom 8xsata3 2xm. 2 3X2.5gigabit LAN Contact Now	Asrock Imb-X1901 ATX Motherboard LGA4710 Intel Xeon 6700e-Series Ecc DDR5 6400 MHz Contact Now	He-B73 Intel Qm580/RM590e Core I7 Onboard Displayport 6xcom Motherboard for Commell Contact Now	Asrock Imb-X1711 ATX Motherboard LGA1200 Intel Xeon 10th Gen (Comet lake-S) Core DDR4 Contact Now

Transaction Info
	Dual Camera Screen Arm Android Linux Ubuntu Industrial Embedded Development Board Contact Now	Adlink Imb-M47-R680e Imb-M47 ATX Motherboard Support Intel 14/13/12th Core with R680e/H610 Chipset DDR5 Pclex16 6xcom 8xsata3 2xm. 2 3X2.5gigabit LAN Contact Now	Asrock Imb-X1901 ATX Motherboard LGA4710 Intel Xeon 6700e-Series Ecc DDR5 6400 MHz Contact Now	He-B73 Intel Qm580/RM590e Core I7 Onboard Displayport 6xcom Motherboard for Commell Contact Now	Asrock Imb-X1711 ATX Motherboard LGA1200 Intel Xeon 10th Gen (Comet lake-S) Core DDR4 Contact Now
Price	US$64.90-69.90 / Piece	US$250.00-320.00 / Piece	US$300.00-500.00 / Piece	US$150.00-350.00 / Piece	US$500.00-700.00 / Piece
Min Order	2 Pieces	1 Piece	1 Piece	1 Piece	1 Piece
Payment Terms	T/T	LC, T/T, D/P, PayPal, Western Union	LC, T/T, D/P, PayPal, Western Union	LC, T/T, D/P, PayPal, Western Union	LC, T/T, D/P, PayPal, Western Union
Quality Control
Product Certification	UL94V-0+RoHS	-	-	-	-
Management System Certification	-	-	-	-	-
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe	Europe, Southeast Asia/ Mideast, Australia, Domestic	Europe, Southeast Asia/ Mideast, Australia, Domestic	Europe, Southeast Asia/ Mideast, Australia, Domestic	Europe, Southeast Asia/ Mideast, Australia, Domestic
Annual Export Revenue	-	-	-	-	-
Business Model	-	Own Brand, ODM, OEM	Own Brand, ODM, OEM	Own Brand, ODM, OEM	Own Brand, ODM, OEM
Average Lead Time	Peak Season Lead Time: one month Off Season Lead Time: one month	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Integrated Graphics: Integrated Graphics; Main Chipset: Rockchip; Maximum Memory Capacity: 8G; Structure: ATX; Memory: DDR2; SATA Interface: SATA3.0; CPU Socket: LGA 775; Printed Circuit Board: Six Layer; Main Board Structure: Integrated; Audio Effects: HiFi; Name: PCBA Assembly Manufacturing; Inspection: 100% IQC, Ipqc, Fqc, QA, Ict; Advantages: PCB Design/Assembly, PCBA & EMS; Good Services: SMT, BGA and DIP; Production Type: SMT & DIP & Assembling & Testing; Services: OEM&ODM Manufacturer Since 2005; Item: Control Board PCBA;	Integrated Graphics: Integrated Graphics; Main Chipset: Intel; Maximum Memory Capacity: 128GB; Structure: ATX; Memory: DDR5; SATA Interface: SATA3.0; CPU Socket: LGA1151; Main Board Structure: Integrated; with CPU: No; Chipset: Intel H610e/R680e; Fsb/Ht: 5800MHz; Memory Type: DDR5; Item Condition: New;	Integrated Graphics: Integrated Graphics; Main Chipset: Intel; Maximum Memory Capacity: 2tb; Structure: ATX; Memory: DDR5; SATA Interface: SATA3.0; CPU Socket: LGA4710; Printed Circuit Board: Six Layer; Main Board Structure: Integrated; Audio Effects: Not HiFi;	Integrated Graphics: Integrated Graphics; Main Chipset: Intel; Maximum Memory Capacity: 64G; Structure: Half-Size Picmg 1.3; Memory: DDR4; SATA Interface: SATA3.0; CPU Socket: Fcbga1787; Printed Circuit Board: Double Layers; Main Board Structure: Integrated; Audio Effects: HiFi; with CPU: Yes; Chipset Manufacturer: Intel; Socket Type: Onboard CPU; Fsb/Ht: 533/667MHz; Witn CPU: Yes; Maximum RAM Capacity: 3.5GB; Hard Drive Interface: SATA; Item Condition: New; Memory Channel: Double; Products Status: New; Memory Bank: 2DDR2DIMM; Package: Yes; Private Mold: Yes; Application: Server/Workstation;	Integrated Graphics: Integrated Graphics; Main Chipset: Intel; Maximum Memory Capacity: 128GB; Structure: ATX; Memory: DDR4; SATA Interface: SATA3.0; CPU Socket: LGA1200; Printed Circuit Board: Six Layer; Main Board Structure: Integrated; Audio Effects: Not HiFi;
Supplier Name	Shenzhen Grandtop Electronics Co., Ltd.	Beijing Teket Innovation Technology Company Limited	Beijing Teket Innovation Technology Company Limited	Beijing Teket Innovation Technology Company Limited	Beijing Teket Innovation Technology Company Limited
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