Development Board

US$51.99-53.99 / Piece

OEM Professional Support Android System WiFi Module PCB PCBA Industry Control Main Board pictures & photos

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What is OEM Professional Support Android System WiFi Module PCB PCBA Industry Control Main Board

Name: OEM Professional Support Android System WiFi Module PCB PCBA Industry Control Main Board
Uploaded: 2025-12-22T20:28:42+08:00
Description: Product Description Rockchip RK3568 Development Board Core Board Rongpin for Industrial Computer System CPU Rockchip RK3568,ARM 4Core A55,Up to 2.0GHz GPU Mali-G52 2EE NPU Support 0.8Tops Computing p

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Price

Min. Order Reference FOB Price

10 Pieces US$51.99-53.99 / Piece

Sepcifications

Integrated Graphics Integrated Graphics
Main Chipset Rockchip
Maximum Memory Capacity 8G
Structure ATX
Memory DDR2
SATA Interface SATA3.0
CPU Socket LGA 775
Printed Circuit Board Six Layer
Main Board Structure Integrated
Audio Effects HiFi
Transport Package Inner-Plastic Bag; Outer-Standard Carton Box
Specification Customized
Trademark customized
Origin Shenzhen, China
Name PCBA Assembly Manufacturing
Inspection 100% IQC, Ipqc, Fqc, QA, Ict
Advantages PCB Design/Assembly, PCBA & EMS
Good Services SMT, BGA and DIP
Production Type SMT & DIP & Assembling & Testing
Certificate UL94V-0+RoHS
Services OEM&ODM Manufacturer Since 2005
Item Control Board PCBA

Product Description

Product Description Rockchip RK3568 Development Board Core Board Rongpin for Industrial Computer System CPU Rockchip RK3568,ARM 4Core A55,Up to 2.0GHz GPU Mali-G52 2EE NPU Support 0.8Tops Computing power RAM With Standard 2GB/4GB/8GB LPDDR4 R0M With Standard 16GB EMMC,Up to 128GB ...

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Shenzhen Grandtop Electronics Co., Ltd.

Diamond Member Since 2017

Audited Supplier

Rating & Reviews: 5.0/5.0

(1 Reviews)

Main Products PCB Assembly, Robotic Control PCB Assembly, Industrial Control PCBA, Medical PCBA, ...
Address 2-3 Floor, Building 15, Hualun Technology Park , No161 Fenghuang Xingye Road One, Fuyong town, Bao'an Distict, Shenzhen, China
Main Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe
International Commercial Terms(Incoterms) FOB, CIF, CIP, EXW, Others
Terms of Payment T/T
Average Lead Time Peak Season Lead Time: one month
Off Season Lead Time: one month

Development Board Comparison

	OEM Professional Support Android System WiFi Module PCB PCBA Industry Control Main Board Contact Now	D2 Zr-M366c Ver2.3 Motherboard Contact Now	Intel 6th/7th Gen CPU 6 LAN Epic Firewall Poe Motherboard Contact Now	Intel H610 12th/13th/14th 1LAN 2HDMI DDR4 Motherboard Contact Now	Intel 6th/7th Gen LGA 1151 H110 Mini Itx Motherboard Contact Now

Transaction Info
	OEM Professional Support Android System WiFi Module PCB PCBA Industry Control Main Board Contact Now	D2 Zr-M366c Ver2.3 Motherboard Contact Now	Intel 6th/7th Gen CPU 6 LAN Epic Firewall Poe Motherboard Contact Now	Intel H610 12th/13th/14th 1LAN 2HDMI DDR4 Motherboard Contact Now	Intel 6th/7th Gen LGA 1151 H110 Mini Itx Motherboard Contact Now
Price	US$51.99-53.99 / Piece	US$60.00-200.00 / Piece	US$110.00-200.00 / Piece	US$86.00-235.00 / Piece	US$86.00-235.00 / Piece
Min Order	10 Pieces	5 Pieces	5 Pieces	5 Pieces	5 Pieces
Payment Terms	T/T	T/T, PayPal	T/T, PayPal	T/T, PayPal	T/T, PayPal
Quality Control
Product Certification	UL94V-0+RoHS	CE, RoHS, FCC, Kc	CE, RoHS, FCC, Kc	CE, RoHS, FCC, Kc	CE, RoHS, FCC, Kc
Management System Certification	-	-	-	-	-
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	-	-	-	-	-
Average Lead Time	Peak Season Lead Time: one month Off Season Lead Time: one month	Peak Season Lead Time: one month Off Season Lead Time: within 15 workdays	Peak Season Lead Time: one month Off Season Lead Time: within 15 workdays	Peak Season Lead Time: one month Off Season Lead Time: within 15 workdays	Peak Season Lead Time: one month Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Integrated Graphics: Integrated Graphics; Main Chipset: Rockchip; Maximum Memory Capacity: 8G; Structure: ATX; Memory: DDR2; SATA Interface: SATA3.0; CPU Socket: LGA 775; Printed Circuit Board: Six Layer; Main Board Structure: Integrated; Audio Effects: HiFi; Name: PCBA Assembly Manufacturing; Inspection: 100% IQC, Ipqc, Fqc, QA, Ict; Advantages: PCB Design/Assembly, PCBA & EMS; Good Services: SMT, BGA and DIP; Production Type: SMT & DIP & Assembling & Testing; Services: OEM&ODM Manufacturer Since 2005; Item: Control Board PCBA;	Integrated Graphics: Integrated Graphics; Main Chipset: Intel; Maximum Memory Capacity: 64GB; Structure: Micro-ATX; Memory: 2DDR4;* SATA Interface: SATA3.0; CPU Socket: LGA1151; Printed Circuit Board: Six Layer; Main Board Structure: Micro-ATX; Audio Effects: HiFi; Processor: 6th/7th/8th/9th Intel® LGA1151 CPU; RAM: 2DDR4 Udimm, up to 64GB;* Power: 24+8 ATX; Ethernet Ports: 6Intel I210 ,LAN1~LAN4 Poe;* Display: 1VGA+1HDMI; Storage: 1Msata, 2SATA; USB: USB3.2:8,USB2.0:5; Chipset: B365; COM: 10,COM1/2 Support RS485; Gpio: 8-in 8-out; Pcie: 1Pciex16, 2Pciex4,; M.2: 1M.2_WiFi;* Tpm: 1Tpm2.0 Pin;* Mpe: 1Mpe(Wi-Fi/4G);*	Integrated Graphics: Integrated Graphics; Main Chipset: Intel; Maximum Memory Capacity: 32G; Structure: Epic; Memory: DDR4; SATA Interface: SATA3.0; CPU Socket: Default; Printed Circuit Board: Six Layer; Main Board Structure: Epic; Audio Effects: HiFi; Processor1: 6th/7th Gen Intel Celeron/Pentium/Core; RAM: 1DDR4 So-DIMM, up to 32GB DDR4/2133mt/S;* Power: DC 12V; Ethernet Ports: 6Intel I211at;* Display1: 1 VGA,1HDMI; Display2: Integrated Intel® HD Graphics; Storage1: 1Mpcie Slot ,Msata Ssds;* Storage2: 1SATA3.0;* COM: 6 COM ,COM1~COM2 Support RS485;* Expansion: 1Mpcie, Supporting Wi-Fi/4G/3G;* Audio: Alc 897,Mic/Line out ,2 ω 5W; OS: Windows Windows 10/Linux; Temp.: Working: -10~60℃; Storage: -20~70℃; Humidity: 0% ~ 95% Humidity, Non-Condensing;	Integrated Graphics: Integrated Graphics; Main Chipset: Intel; Maximum Memory Capacity: 64GB; Structure: Mini-ITX; Memory: 2DDR4;* SATA Interface: SATA3.0; CPU Socket: Standard; Printed Circuit Board: Six Layer; Main Board Structure: Integrated; Audio Effects: HiFi; Processor1: 12th/13th/14th Gen Intel LGA1700 CPU; Chipset: H610; RAM: 2DDR4SODIMM,64GB;* Power: DC19V; Ethernet Ports: 1 Rtl8111h 1000m LAN;* Storage: 1 SATA3.0,1M.2; System: Windows 10/Windows 11/Linux; USB3.2: 6 USB 3.0;* Extension Slot1: 1 Pcie X16, 2 * Pcie X4(M.2);* COM: 2; Display1: 3HDMI;* Temp.: Working:-20-50;Storage:-20-50; Dimmension: 180mm 190 mm;*	Integrated Graphics: Integrated Graphics; Main Chipset: Intel; Maximum Memory Capacity: 64GB; Structure: Mini-ITX; Memory: 2DDR4;* SATA Interface: SATA3.0; CPU Socket: Standard; Printed Circuit Board: Six Layer; Main Board Structure: Integrated; Audio Effects: HiFi; Processor1: 12th/13th/14th Gen Intel LGA1700 CPU; Chipset: H610 / B760 / Q670; RAM: 2DDR5 SODIMM,64GB;* Power: DC19V; Ethernet Ports: 1 Intel I219;* Storage: 1 SATA3.0,1M.2; System: Windows 10/Windows 11/Linux; USB3.2: 6 USB 3.0;* Extension Slot1: 1 Pcie X16, 2 * Pcie X4(M.2);* COM: 2; Display1: 3HDMI;* Temp.: Working:-20-50;Storage:-20-50; Dimmension: 180mm 190 mm;*
Supplier Name	Shenzhen Grandtop Electronics Co., Ltd.	R&O Industrial Technology Co., Limited	R&O Industrial Technology Co., Limited	R&O Industrial Technology Co., Limited	R&O Industrial Technology Co., Limited
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