Android Development Board

US$64.90-69.90 / Piece

Dual Camera Screen Arm Android Linux Ubuntu Industrial Embedded Development Board Finished Product pictures & photos

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What is Dual Camera Screen Arm Android Linux Ubuntu Industrial Embedded Development Board Finished Product

Name: Dual Camera Screen Arm Android Linux Ubuntu Industrial Embedded Development Board Finished Product
Uploaded: 2026-02-06T11:15:54+08:00
Description: Product Description Dual Camera Screen Arm Android Linux Ubuntu Industrial Embedded Development Board System CPU Rockchip RK3399,ARM Dual Core A72, 4Core A53,UP to 1.8GHz GPU 4Core Mali-T860

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Price

Min. Order Reference FOB Price

2 Pieces US$64.90-69.90 / Piece

Sepcifications

Integrated Graphics Integrated Graphics
Main Chipset Rockchip
Maximum Memory Capacity 8G
Structure ATX
Memory DDR2
SATA Interface SATA3.0
CPU Socket LGA 775
Printed Circuit Board Six Layer
Main Board Structure Integrated
Audio Effects HiFi
Transport Package Inner-Plastic Bag; Outer-Standard Carton Box
Specification Customized
Trademark customized
Origin Shenzhen, China
Name PCBA Assembly Manufacturing
Inspection 100% IQC, Ipqc, Fqc, QA, Ict
Advantages PCB Design/Assembly, PCBA & EMS
Good Services SMT, BGA and DIP
Production Type SMT & DIP & Assembling & Testing
Certificate UL94V-0+RoHS
Services OEM&ODM Manufacturer Since 2005
Item Control Board PCBA

Product Description

Product Description Dual Camera Screen Arm Android Linux Ubuntu Industrial Embedded Development Board System CPU Rockchip RK3399,ARM Dual Core A72, 4Core A53,UP to 1.8GHz GPU 4Core Mali-T860 RAM With Standard 2GB/4GB LPDDR4 R0M With Standard 16GB EMMC,Up to 128GB Display ...

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Shenzhen Grandtop Electronics Co., Ltd.

Diamond Member Since 2017

Audited Supplier

Rating & Reviews: 5.0/5.0

(1 Reviews)

Main Products PCB Assembly, Robotic Control PCB Assembly, Industrial Control PCBA, Medical PCBA, ...
Address 2-3 Floor, Building 15, Hualun Technology Park , No161 Fenghuang Xingye Road One, Fuyong town, Bao'an Distict, Shenzhen, China
Main Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe
International Commercial Terms(Incoterms) FOB, CIF, CIP, EXW, Others
Terms of Payment T/T
Average Lead Time Peak Season Lead Time: one month
Off Season Lead Time: one month

Android Development Board Comparison

	Dual Camera Screen Arm Android Linux Ubuntu Industrial Embedded Development Board Finished Product Contact Now	Elsky Motherboard Comet Lake I7-10750h I9-10980HK Hm470 DDR432GB M. 2 Nvme 512GB USB WiFi OS Itx Motherboard Contact Now	Elsky Motherboard Comet Lake I5- 9300h Hm470 DDR432GB M. 2 Nvme 512GB USB WiFi OS Itx Motherboard Contact Now	Esonic Wholesale H510 ATX Motherboard I3 I5 I7 Processor H510 Contact Now	Quick View Wholesale Embedded Board 3I810hw & 3I810bw & 3I810dw 2I810d Dual LAN Support 8th/10th Gen CPU Contact Now

Transaction Info
	Dual Camera Screen Arm Android Linux Ubuntu Industrial Embedded Development Board Finished Product Contact Now	Elsky Motherboard Comet Lake I7-10750h I9-10980HK Hm470 DDR432GB M. 2 Nvme 512GB USB WiFi OS Itx Motherboard Contact Now	Elsky Motherboard Comet Lake I5- 9300h Hm470 DDR432GB M. 2 Nvme 512GB USB WiFi OS Itx Motherboard Contact Now	Esonic Wholesale H510 ATX Motherboard I3 I5 I7 Processor H510 Contact Now	Quick View Wholesale Embedded Board 3I810hw & 3I810bw & 3I810dw 2I810d Dual LAN Support 8th/10th Gen CPU Contact Now
Price	US$64.90-69.90 / Piece	US$169.00-179.00 / Piece	US$129.00-139.00 / Piece	US$19.99-49.99 / Piece	US$500.00-1,000.00 / Piece
Min Order	2 Pieces	1 Piece	1 Piece	10 Pieces	3 Pieces
Payment Terms	T/T	LC, T/T, D/P, PayPal, Western Union	LC, T/T, D/P, PayPal, Western Union	LC, T/T, D/P, PayPal, Western Union, Small-amount payment	LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram
Quality Control
Product Certification	UL94V-0+RoHS	-	-	-	-
Management System Certification	-	-	-	-	-
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe	Domestic	Domestic	South America, Southeast Asia/ Mideast	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	-	Own Brand, ODM, OEM	Own Brand, ODM, OEM	ODM, OEM	ODM, OEM
Average Lead Time	Peak Season Lead Time: one month Off Season Lead Time: one month	Peak Season Lead Time: one month Off Season Lead Time: one month	Peak Season Lead Time: one month Off Season Lead Time: one month	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Integrated Graphics: Integrated Graphics; Main Chipset: Rockchip; Maximum Memory Capacity: 8G; Structure: ATX; Memory: DDR2; SATA Interface: SATA3.0; CPU Socket: LGA 775; Printed Circuit Board: Six Layer; Main Board Structure: Integrated; Audio Effects: HiFi; Name: PCBA Assembly Manufacturing; Inspection: 100% IQC, Ipqc, Fqc, QA, Ict; Advantages: PCB Design/Assembly, PCBA & EMS; Good Services: SMT, BGA and DIP; Production Type: SMT & DIP & Assembling & Testing; Services: OEM&ODM Manufacturer Since 2005; Item: Control Board PCBA;	Integrated Graphics: Integrated Graphics; Main Chipset: Intel; Maximum Memory Capacity: 64G; Structure: Mini-ITX; Memory: DDR4; SATA Interface: SATA; CPU Socket: Slot 1; Printed Circuit Board: Six Layer; Main Board Structure: Integrated; Audio Effects: HiFi; CPU: I3 I5 I7 I9; Storage: M.2 Nvme; WiFi: 2.4GHz/5.0GHz WiFi Optional; OS: Win10/11/Linux; Power Supply: DC 12/19V; Network: 2RJ45 Gigabit Network;*	Integrated Graphics: Integrated Graphics; Main Chipset: Intel; Maximum Memory Capacity: 64G; Structure: Mini-ITX; Memory: DDR4; SATA Interface: SATA; CPU Socket: Slot 1; Printed Circuit Board: Six Layer; Main Board Structure: Integrated; Audio Effects: HiFi; CPU: I3 I5 I7 I9; Storage: M.2 Nvme; WiFi: 2.4GHz/5.0GHz WiFi Optional; OS: Win10/11/Linux; Power Supply: DC 12/19V; Network: 2RJ45 Gigabit Network;*	CPU Support: 11gen /10 Gen; Chipset Manufacturer: Intel; Socket Type: Socket LGA1200; Chipset: Intel H510, H510; Size: Micro ATX; Storage: 2DDR4;* Memory Type: DDR4; M.2: Yes; Form Factor: ATX; Hard Drive Interface: IDE, SATA; Item Condition: New; Memory Bank: 2 DDR4 DIMM; with CPU: No; USB: USB3.2/USB2.0; CPU Type: Intel;	Integrated Graphics: Integrated Graphics; Main Chipset: Intel; Maximum Memory Capacity: 64G; Structure: Micro ATX; Memory: DDR3; SATA Interface: SATA3.0; CPU Socket: LGA1700; Printed Circuit Board: Four Layers; Main Board Structure: Integrated; Audio Effects: Not HiFi; Power Supply: DC 12V or 19V Voltage; CPU Processor: Alder Lake 12th Generation Core I5; Working Humidity: 5%~95% Relative Humidity; Switch: 1F_Panel Pin;1Jatx Pin;
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