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      Android Development Board
      US$64.90-69.90 / Piece
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      What is Rk3399 Android System Industrial Embedded Development Board in Shenzhen

      About this Item
      Details
      Company Profile

      Price

      Min. Order Reference FOB Price

      2 Pieces US$64.90-69.90 / Piece

      Sepcifications

      • Integrated Graphics Integrated Graphics
      • Main Chipset Rockchip
      • Maximum Memory Capacity 8G
      • Structure ATX
      • Memory DDR2
      • SATA Interface SATA3.0
      • CPU Socket LGA 775
      • Printed Circuit Board Six Layer
      • Main Board Structure Integrated
      • Audio Effects HiFi
      • Transport Package Inner-Plastic Bag; Outer-Standard Carton Box
      • Specification Customized
      • Trademark customized
      • Origin Shenzhen, China
      • Name PCBA Assembly Manufacturing
      • Inspection 100% IQC, Ipqc, Fqc, QA, Ict
      • Advantages PCB Design/Assembly, PCBA & EMS
      • Good Services SMT, BGA and DIP
      • Production Type SMT & DIP & Assembling & Testing
      • Certificate UL94V-0+RoHS
      • Services OEM&ODM Manufacturer Since 2005
      • Item Control Board PCBA

      Product Description

      Product Description Dual Camera Screen Arm Android Linux Ubuntu Industrial Embedded Development Board System CPU Rockchip RK3399,ARM Dual Core A72, 4Core A53,UP to 1.8GHz GPU 4Core Mali-T860 RAM With Standard 2GB/4GB LPDDR4 R0M With Standard 16GB EMMC,Up to 128GB Display ...

      Learn More

      Android Development Board Comparison
      Transaction Info
      Price US$64.90-69.90 / Piece Negotiable Negotiable Negotiable Negotiable
      Min Order 2 Pieces 1 Piece 1 Piece 1 Piece 1 Piece
      Payment Terms T/T T/T, PayPal T/T, PayPal T/T, PayPal T/T, PayPal
      Quality Control
      Product Certification UL94V-0+RoHS CE, RoHS, FCC, Kc - - -
      Management System Certification - - - - -
      Trade Capacity
      Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
      Annual Export Revenue - - - - -
      Business Model - - - - -
      Average Lead Time Peak Season Lead Time: one month
      Off Season Lead Time: one month
      Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Integrated Graphics: Integrated Graphics;
      Main Chipset: Rockchip;
      Maximum Memory Capacity: 8G;
      Structure: ATX;
      Memory: DDR2;
      SATA Interface: SATA3.0;
      CPU Socket: LGA 775;
      Printed Circuit Board: Six Layer;
      Main Board Structure: Integrated;
      Audio Effects: HiFi;
      Name: PCBA Assembly Manufacturing;
      Inspection: 100% IQC, Ipqc, Fqc, QA, Ict;
      Advantages: PCB Design/Assembly, PCBA & EMS;
      Good Services: SMT, BGA and DIP;
      Production Type: SMT & DIP & Assembling & Testing;
      Services: OEM&ODM Manufacturer Since 2005;
      Item: Control Board PCBA;
      Integrated Graphics: Integrated Graphics;
      Main Chipset: Intel® H610/B660/B760/Q67;
      Maximum Memory Capacity: 64G;
      Structure: ATX;
      Memory: Dual-Channel Udimm DDR4;
      SATA Interface: 4*SATA3.0;
      CPU Socket: LGA1700;
      Printed Circuit Board: Six Layer;
      Main Board Structure: Integrated;
      Audio Effects: HiFi;
      Processor1: Intel®12th/13th/14th S-Series Processor;
      RAM: Dual-Channel Udimm, DDR4 Memory, up to 64GB;
      Power: ATX (24+8 Pin) Power Supply;
      Ethernet Ports: Intel Dual Network Port (Optional Single Network);
      Storage: 1*M.2 M Key(Pciex4), 4*SATA3.0;
      System: Window10/Window11/Linux;
      Interface: 12*USB, 6*RS232(2*RS485 ),1*Lpt;
      Extension Slot1: 1*M.2 E Key(WiFi6)/Bluetooth;
      Extension Slot2: 1*Pciex16,1*Pciex1,1*Pciex4;
      Audio: Alc897 7.1 High Fidelity;
      Display1: Intel®UHD Graphics,4-Display;
      Display2: VGA+HDMI2.0+Dp1.4+HDMI Pin;
      Temp.: Working:-0-60;Storage:-20-70;
      Dimmension: 170mm X 170mm;
      Integrated Graphics: Integrated Graphics;
      Main Chipset: Intel® H610/H670/B760;
      Maximum Memory Capacity: 64G;
      Structure: Mini-ITX;
      Memory: Dual-Channel So-DIMM, DDR4 , Max 64GB;
      SATA Interface: 1*SATA3.0;
      CPU Socket: LGA1700;
      Printed Circuit Board: Six Layer;
      Main Board Structure: CPU Based;
      Audio Effects: HiFi;
      Processor: Intel® Raptor Lake/Alder Lake S 12th/13th/14th;
      RAM: 2*So-DIMM DDR4 3200MHz,Max64GB;
      Display1: Lvds1/Edp1 + 2*HDMI(4K@60Hz) + 2*Dp (4K@60Hz);
      Display2: Intel®HD Graphic,4-Display;
      LAN: Onboard 1*Intel I219-V+1*Intel I210at;
      Interface: 4*USB3.0 + 6*USB2.0 ,6*COM;
      Power Supply: DC (2.5/φ5.5mm)/ 4pin ATX 19V;
      Storage: 1*M.2 M Key, Support SATA (Optional Pciex4) ,1*Sat;
      Extension Slot1: 1*M.2 E Key, Support WiFi6(Cnvi ) / Bluetooth;
      Extension Slot2: 1*M.2 B Key, Support 4G/Optional 5g;
      Extension Slot3: 1*Pciex16 Slot;
      OS: Window10/Window11/Linux;
      Temp.: Working: 0~60℃; Storage: -20℃~75;
      Humidity: 0% ~ 95% Humidity, Non-Condensing;
      Integrated Graphics: Integrated Graphics;
      Main Chipset: Intel;
      Maximum Memory Capacity: 16G;
      Structure: Nuc;
      Memory: DDR4;
      SATA Interface: SATA3.0;
      CPU Socket: LGA1200;
      Printed Circuit Board: Six Layer;
      Main Board Structure: CPU Based;
      Audio Effects: Not HiFi;
      CPU: Integrated Intel Celeron N100 0.8GHz Quad Core;
      RAM: 1 * SODIMM,Single Channel 3200MHz DDR4;
      Display: Integrated Intel®UHD Graphics;
      LAN Ports: 4* Intel I225 or I226 2.5g Gigabit Ethernet Ports;
      Storage: 1* 7pin SATA3.0;1* M.2 Key-M 2280/2242 Pcie/SATA;
      Serial Ports: 2* RS232,Support 1*RS485;;
      Expansion Slot: 1* Mini-Pcie Slot,Support WiFi/4G;
      Cooling: Fanless;
      Power: DC 12V ±5% Power Supply;
      Integrated Graphics: Integrated Graphics;
      Main Chipset: Intel® H610/B660;
      Maximum Memory Capacity: 64G;
      Structure: Mini-ITX;
      Memory: Dual-Channel So-DIMM, DDR4 , Max 64GB;
      SATA Interface: 2*SATA3.0;
      CPU Socket: LGA1700;
      Printed Circuit Board: Six Layer;
      Main Board Structure: CPU Based;
      Audio Effects: HiFi;
      Processor: Intel® Alder Lake & Raptor Lake12th/13th Proce;
      RAM: 2*So-DIMM DDR4 3200MHz, Max64GB;
      Display1: Lvds/Edp(4K)+HDMI1+HDMI2+VGA/Dp, Three Display;
      Display2: Intel ® Core Graphics Card, 3-Display;
      LAN: 1*Realtek 8111h(Optionalintel I219lm);
      Interface: 2*USB3.2gen2(10gbps)+2*USB3.0 Gen1+ 4*USB2.0;
      Power Supply: DC19V;
      Storage1: 1*M.2 M Key (Default SATA, Optional Pcie3.0 X4);
      Storage2: 2*SATA3.0;
      Extension Slot1: 1*M.2 E Key (WiFi6/Cnvi)+1*M.2 E Key(Optiona);
      OS: Window10/Window11/Linux;
      Temp.: Working: 0~60℃; Storage: -20℃~75;
      Humidity: 0% ~ 95% Humidity, Non-Condensing;
      Supplier Name

      Shenzhen Grandtop Electronics Co., Ltd.

      Diamond Member Audited Supplier

      R&O Industrial Technology Co., Limited

      Diamond Member Audited Supplier

      R&O Industrial Technology Co., Limited

      Diamond Member Audited Supplier

      R&O Industrial Technology Co., Limited

      Diamond Member Audited Supplier

      R&O Industrial Technology Co., Limited

      Diamond Member Audited Supplier

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