| Specification |
Type: Rigid Circuit Board;
Flame Retardant Properties: V2;
Dielectric: FR-4;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Processing Technology: Electrolytic Foil;
Application: Medical Instruments;
Mechanical Rigid: Rigid;
Material: Fiberglass Epoxy;
Brand: Grandtop;
Circuit Board Type: Rigid, Flex;
Standard: 94V0 Circuit Board;
Moisture and Dust Prevention: Conformal Coating;
Testing: Aoi, X-ray, Spi, Fct, Ict;
Programming: Support;
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Type: Single Sided PCB;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Fr-4,Fr-1,Cem,High Tgaluminumrogerslsola;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Material: Fiberglass Epoxy;
Brand: Smart;
Modelnumber: Single-Layer-PCB-01;
Silkscreen: White, Black;
PCB Type: Rigid, Flexible, Rigid-Flexible;
Copper Thickness: 0.5oz-6oz;
MOQ: 5PCS;
Solder Mask Color: White Black Yellow Green Red Blue Orange Purple;
Surface Treatment: HASL, Lf HASL, Imm Gold, Lmm Silverosp etc.;
PCBA Service: Turnkey Assembly PCBA Service;
Min. Hole Diameter: 0.1mm;
Components Sourcing: Yes;
Board Size: Custom&Max1200mm*600mm;
Board Thickness: 0.2mm-4mm;
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Type: Single Sided PCB;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Bakelite Material;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Material: Fiberglass Epoxy;
Brand: Smart;
Number of Layers: 2/4/6/8/12/14or Custom;
Shape: Rectangular, Round, Slots, Cutouts, Complex Irramu;
Copper Thickness: 0.5-6.0oz;
Min.Hole Size: 0.1mm;
Min.Line Width: 0.15mm;
Hole Spacing: 2.54mm;
Min.Hole Diameter: 1.0mm;
Board Size: Various Specifications Available;
Board Thickness: 0.2-4.0mm;
Surface Finishing: Standard;
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Type: Multilayer PCB;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Material: Fiberglass Epoxy;
Brand: Smart;
Number of Layers: 2/4/6/8/12/14or Custom;
Shape: Rectangular, Round, Slots, Cutouts, Complex Irramu;
Insulation Resin: Epoxy Resin;
Copper Thickness: 0.5-6.0oz;
Min. Hole Size: 0.1mm;
Min. Line Width: 0.15mm;
Hole Spacing: 2.54mm;
Board Thickness: 0.2-4.0mm;
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Type: Single Sided PCB;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Bakelite Material;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Material: Fiberglass Epoxy;
Brand: Smart;
Number of Layers: 2/4/6/8/12/14or Custom;
Copper Thickness: 0.5-6.0oz;
Min.Line Spacing: Standard;
Min. Line Width: 0.15mm;
Hole Spacing: 2.54mm;
Min.Hole Diameter: 1.0mm;
Mechanical Rigidity: Rigidity;
Board Size: Varioys Specifications Available;
Board Thickness: 0.2-4.0mm;
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