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      Shenzhen One-Stop Service PCBA Board Circuit Board Assembly

      About this Item
      Details
      Company Profile

      Price

      Min. Order Reference FOB Price

      2 Pieces US$0.25-6.35 / Piece

      Sepcifications

      • Type Rigid Circuit Board
      • Dielectric FR-4
      • Material Fiberglass Epoxy
      • Application Consumer Electronics
      • Flame Retardant Properties V0
      • Mechanical Rigid Rigid
      • Processing Technology Electrolytic Foil
      • Base Material Copper
      • Insulation Materials Epoxy Resin
      • Brand New Chip
      • Transport Package Vacuum Packaging, Carton Box
      • Specification FR-4 SILICON COMPONENTS
      • Trademark New Chip
      • Origin China
      • Layer 1-32 Layers
      • Service OEM/ODM
      • OEM/ODM Available
      • Test 100%E-Testing
      • Layer Count 1-20 Layers
      • Shipping DHL/UPS/FedEx/Air/Sea
      • Surface Treatmen OSP, Enig, HASL, AG Immersion
      • Certificate Gurantee Yes

      Product Description

      Product Description What we offer: Quote Requirement: Gerber file of the bare PCB board BOM (Bill of material) for assembly To short the lead time, please kindly advise us if there is any acceptable components substitution (for PCB assembly). Testing Guide &Test Fixtures if necessary ...

      Learn More

      PCB Comparison
      Transaction Info
      Price US$0.25-6.35 / Piece US$0.10-10.00 / Piece US$0.10-10.00 / Piece US$0.10-10.00 / Piece US$0.10-10.00 / Piece
      Min Order 2 Pieces 1 Piece 1 Piece 1 Piece 1 Piece
      Payment Terms T/T, PayPal, Western Union T/T, PayPal, Western Union, Small-amount payment, VTB T/T, PayPal, Western Union, Small-amount payment, VTB T/T, PayPal, Western Union, Small-amount payment, VTB T/T, PayPal, Western Union, Small-amount payment, VTB
      Quality Control
      Management System Certification - - - - -
      Trade Capacity
      Export Markets North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Western Europe North America, South America, Western Europe North America, South America, Western Europe North America, South America, Western Europe
      Annual Export Revenue - - - - -
      Business Model ODM, OEM - - - -
      Average Lead Time Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Brand: New Chip;
      Layer: 1-32 Layers;
      Service: OEM/ODM;
      OEM/ODM: Available;
      Test: 100%E-Testing;
      Layer Count: 1-20 Layers;
      Shipping: DHL/UPS/FedEx/Air/Sea;
      Surface Treatmen: OSP, Enig, HASL, AG Immersion;
      Certificate Gurantee: Yes;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Medical Instruments;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Insulation Materials: Epoxy Resin;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Medical Instruments;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Insulation Materials: Epoxy Resin;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Communication;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Insulation Materials: Epoxy Resin;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Communication;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Insulation Materials: Epoxy Resin;
      Supplier Name

      Shenzhen New Chip international Ltd

      Gold Member Audited Supplier

      EXCEEDING ELECTRONICS GROUP LIMITED

      Diamond Member Audited Supplier

      EXCEEDING ELECTRONICS GROUP LIMITED

      Diamond Member Audited Supplier

      EXCEEDING ELECTRONICS GROUP LIMITED

      Diamond Member Audited Supplier

      EXCEEDING ELECTRONICS GROUP LIMITED

      Diamond Member Audited Supplier

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